In a method for electrocoating an electrically conductive surface serving as an electrode, which method comprises passing an electrical current between the electrically conductive surface to be electrocoated and a counter electrode in contact with an electrodeposition bath comprising a synthetic resin ionically dispersed in an aqueous medium, wherein improvement comprises (a) adding a complexing agent, and then (b) removing at least a portion of the complexing agent along with metals coordinated therewith from the bath.
The invention provides a curable electrodepositable coating composition that has improved durability in the presence of metal ions. The coating composition includes one or more ungelled, active hydrogen-containing ionic salt group-containing resins which are electrodepositable on an electrode, one or more curing agents, and one or more metal deactivators.
The present invention is directed to a curable electrodepositable coating composition having a resinous phase dispersed in an aqueous medium. The resinous phase includes (a) one or more ungelled, active hydrogen-containing cationic salt group-containing resins which are electrodepositable on a cathode; (b) one or more at least partially blocked polyisocyanate curing agents; (c) at least one substantially non-volatile antioxidant; and (d) at least one volatile antioxidant. The present invention also provides a process for electrodeposition using the coating and substrates coated therewith.
Electroless copper plating baths are disclosed. The electroless copper baths are formaldehyde free and are environmentally friendly. The electroless copper baths are stable and deposit a bright copper deposit on substrates.
Electroless copper and copper alloy plating baths are disclosed. The electroless baths are formaldehyde free and are environmentally friendly. The electroless baths are stable and deposit a bright copper or copper alloy on substrates.
