A Langmuir-Blodgett monolayer polyimide film and a bulk amorphous polyimide film are in contacting superposed relation to form a composite film having improved moisture resistance. The composite film may be either a free film or provide an insulating coating on the surface of a microelectronics device.
Polymer compositions, typically thermoplastic polymer compositions, readily converted into electroconductive polymers and articles shaped therefrom, e.g., films, comprise at least one convertible polymer support substrate (A) and at least one amphiphilic heterocyclic monomer (B) having the formula (I): ##STR1## in which R.sub.1 and R.sub.2, which may be identical or different, are each a linear or branched alkyl, aryl, alkylaryl, arylalkyl, hydroxycarbonyl, alkoxycarbonyl or amide radical; X is an oxygen or sulfur atom or the divalent radical ##STR2## wherein R.sub.3 is a hydrogen atom or an alkyl, aryl, alkylaryl or arylalkyl radical; at least one of the substituents R.sub.1, R.sub.2 and R.sub.3 having an amphiphilicity-imparting number of carbon atoms.
In one aspect, the invention includes a method of patterning a substrate. A film is formed over a substrate and comprises a plurality of individual molecules. The individual molecules comprise two ends with one of the two ends being directed toward the substrate and the other of the two ends being directed away from the substrate. Particle-adhering groups are bound to said other of the two ends of at least some of the individual molecules and a plurality of particles are adhered to the particle-adhering groups to form a mask over the substrate. The substrate is etched while the mask protects portions of the substrate. In another aspect, the invention encompasses a method of forming a field emission display. A material having a surface of exposed nitrogen-containing groups is formed over the substrate. At least one portion of the material is exposed to radiation while at least one other portion of the material is not exposed. The exposing renders one of the exposed or unexposed portions better at bonding the masking particles than the other of the exposed and unexposed portions. After the exposing, the material is bonded with masking particles. The adhered masking particles define a mask over the semiconductive substrate. The substrate is etched while the patterned mask protects portions of the substrate. A plurality of emitters are formed from the substrate. A display screen is provided to be spaced from the emitters.
In one aspect, the invention includes a method of forming field emission emitter tips, comprising: a) providing a masking material over a semiconductor substrate to form a masking-material-covered substrate; b) submerging at least a portion of the masking-material-covered semiconductor substrate in a liquid; c) providing particulates suspended on an upper surface of the liquid; d) while the particulates are suspended, moving the submerged masking-material-covered substrate relative to the suspended particulates to form tightly packed monolayer of the particulates supported on the masking material of the masking-material-covered substrate; e) decreasing a dimension of the particulates to leave some portions of the masking material covered by the particulates and other portions of the masking material uncovered by the particulates; f) after decreasing the dimension and while the particulates are supported on the upper surface, exposing the masking-material-covered substrate to first etching conditions which remove uncovered portions of the masking material while leaving covered portions of the masking material over the substrate to define a patterned masking layer; g) removing the particulates; and h) while the patterned masking layer is over the semiconductor substrate, exposing the semiconductor substrate to a second etching conditions to pattern the semiconductor substrate into emitter tips.
In one aspect, the invention includes a method of patterning a substrate. A film is formed over a substrate and comprises a plurality of individual molecules. The individual molecules comprise two ends with one of the two ends being directed toward the substrate and the other of the two ends being directed away from the substrate. Particle-adhering groups are bound to said other of the two ends of at least some of the individual molecules and a plurality of particles are adhered to the particle-adhering groups to form a mask over the substrate. The substrate is etched while the mask protects portions of the substrate. In another aspect, the invention encompasses a method of forming a field emission display. A material having a surface of exposed nitrogen-containing groups is formed over the substrate. At least one portion of the material is exposed to radiation while at least one other portion of the material is not exposed. The exposing renders one of the exposed or unexposed portions better at bonding the masking particles than the other of the exposed and unexposed portions. After the exposing, the material is bonded with masking particles. The adhered masking particles define a mask over the semiconductive substrate. The substrate is etched while the patterned mask protects portions of the substrate. A plurality of emitters are formed from the substrate. A display screen is provided to be spaced from the emitters.