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Ring-alkylated m-phenylene diamine blends for use in curing epoxy resins
   
Document Number
US Patent 5049639
Issued Date
September 17, 1991
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Abstract
Blends of diaminoisopropylbenzene (DAIPB) and diaminoethylbenzene (DAEB) are provided for curing epoxy resins. The cured epoxy resins have increased tensile strength and slightly lower glass transistion temperatures as compared with resins cured with either diamine alone.
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Number of Claims:
3
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Published
September 17, 1991
Application Number
07/314,126
Filed
February 23, 1989
US Classification
528/120   252/182.13 525/504 528/124 528/407
Int'l Classification
C08G   59/00   (20060101)   C08G   59/50   (20060101)  
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Assistant Examiner
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USPTO Field of Search
528/120   528/407   525/504  
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