An apparatus and method for simultaneously mounting lead strip segments onto each side of a rectangular ceramic substrate. Four lead strip mounting assemblies are equally spaced 90 degrees apart around a central vertically oriented substrate support so that each assembly is perpendicular an edge of a substrate on the support. Lead strip feed assemblies located adjacent each mounting assemblies cuts lead strip segments and feeds the lead strip segments into the mounting assemblies. The four mounting assemblies simultaneously mount the lead strip segments on the substrate.

A circuit module includes a multilayer circuit board having a plurality of alternate layers defining circuit paths and insulation with conductive vias between selected circuit paths of different layers. A hermetic seal is sealed to the top layer of the multilayer circuit board, and the circuit paths and/or vias are selectively connected to external pads by vias extending through the multilayer circuit board, one via terminating at a pad internal to the sealed region and another via terminating at the external pad. In one form, the vias providing the external connection extend into a substrate supporting the board, and circuit paths in the substrate electrically connect the vias together. In a second form, the vias providing the external connection are electrically connected together by selected circuit paths in the circuit board. A conductive anchor extends through the circuit board to the substrate to provide an anchor for the seal. Where the vias providing external connection are connected by selected circuit paths in the circuit board, the conductive anchor comprises posts having openings through which the selected circuit paths pass.