With the floating-type magnetic head, a load beam, working as an arm, and a flexure, working as a holder, are separately constructed. The flexure is attached to the base of the load beam by spot welding. An embossed (spherical concaved) portion is formed onto the middle of the displacement portion and is in contact with the base. Because the flexure is stiffer and stronger than a conventional cantilever spring-type flexure, it is possible. to prevent the displacement portion from being plastic-deformed even when there is a shock to the magnetic head when it is on standby. Further, the slider uses the embossed portion as a pivot, making the floating more stable.

A head suspension assembly for positioning a head assembly at the correct static attitude with respect to the surface of a rotatable data storage device. The head assembly includes a gimbal assembly having a novel static attitude adjustment feature comprising a solid drop of material. The solid drop of material is dispensed as a fluid on the desired location and then cured to solid form. The solidified drop of material can be used to create surface features on head suspension assemblies for correcting pitch and roll static attitude errors and for applying gram loads on the head assembly.

A method and apparatus for loading and unloading a slider onto the surface of a substrate. The present invention includes a suspension assembly that supports a slider having an air bearing surface. The suspension assembly is coupled to a guide rod that is biased toward a first, second and third bearing. The guide rod remains in continuous contact with at least two bearings. Movement of the slider toward or away from the substrate surface is accomplished by changing the position of one or more of the bearings. In this manner, a set of pivot points acting upon the guide rod is varied as the slider is rotated toward or away from the disk surface such that the axis of rotation of the slider varies as the slider is rotated toward or away from the substrate surface. The loader is also configured to minimize the lateral movement of the slider along the surface of the substrate as the slider is loaded or unloaded from the substrate surface.

Methods of forming capacitors and related integrated circuitry are described. In a preferred embodiment, the capacitors form part of a dynamic random access memory (DRAM) cell. According to one aspect of the invention, a first insulating layer is formed over a semiconductive material layer. A conductive gate is formed over the semiconductive material layer. A second insulating layer is formed over the gate and thereafter etched to form a capacitor container. In one implementation, such etch is conducted to outwardly expose the semiconductive material layer. In another implementation, such etch continues into the semiconductive material layer. In yet another implementation, such etch is conducted completely through the semiconductive material layer and into the first insulating layer. In a preferred implementation, a storage capacitor is formed within the capacitor container which extends both elevationally above and elevationally below the gate. According to another aspect of the invention, adjacent word lines are formed over the first insulating layer and source/drain diffusion regions are formed within the semiconductive material laterally outward of the word lines. Respective capacitor containers are etched into the diffusion regions and capacitors are formed within the etched containers. In a preferred implementation, storage node material which constitutes part of the capacitors is in electrical contact with the respective diffusion regions and comprises part of a DRAM memory cell.

A method and assembly are disclosed for bundling wires utilized in a head gimbal assembly of a magnetic disk storage device. According to the method of the present invention, a number of wires are routed along a predetermined path on a surface of the arm of the head gimbal assembly. While the wires are maintained along the predetermined path, an adhesive is dispensed at selected locations along the predetermined path. According to a preferred embodiment of the present invention, the adhesive is applied in a contiguous manner along the length of the wires extending beyond the end of the arm. Finally, the adhesive is cured to encapsulate a portion of the wires within a sleeve of adhesive. In an alternate embodiment of the present invention, the adhesive is dispensed over the wires in a plurality of non-contiguous segments.