A video wire bonder system includes a processor (12) coupled to an imaging station (14), an input device (16), a display (18), and a memory (20). Processor (12) generates an image overlay (30) having a graphical representation of each video wire bond between a bonding pad (34) of a semiconductor die (21) and a lead finger (35) of an associated lead frame (22). Processor (12) generates a template (28) comprising an organization of video wire bond parameters associated with each video wire bond, and stores template (28) in memory (20). Display (18) displays image overlay (30) to provide visual feedback to an operator while the operator is programming template (28).

An inspecting apparatus is arranged on an electronic component mounting line for inspecting whether a mounting state of the component mounted by a mounting apparatus in a precedent process or a printing state of a cream solder by a cream solder printing apparatus in a precedent process is non-defective or defective. The inspecting apparatus includes an input device for taking data of the mounting state of the component to be inspected or the printing state of the cream solder to be inspected, a comparing device for comparing the data of the mounting state or the printing state input through the input device with an absolute decision criterion having a predetermined allowable range to decide whether the mounting state or the printing state is non-defective or defective and an operating state criterion which is within and narrower than the allowable range of the absolute decision criterion and a deciding device for deciding an operating state of the mounting apparatus or the cream solder printing apparatus in the precedent process based the data which is both within the absolute decision criterion and outside the operating state criterion.

Methods and apparatuses are disclosed for defining a locus of viable points on an elongated object, such as a locus of viable bond points on a lead of a lead frame. The locus guides the bond point positioning of a wire bonder so that the number of unacceptable wire bonds is reduced. The locus is a region adapted to receive a bond, and is defined such that for any bond centered therein, the probability of forming an unacceptable bond is reduced by offsetting the locus from at least a portion of the lead edge(s) by a minimum-offset distance. The minimum-offset distance is based on various factor(s), such as user tolerance and bond width. Further, the definition of the locus is independent of lead shape, and consequently works with a variety of lead shapes. The locus can also have various shapes for a single lead, and the shapes can vary depending on the application. The method and apparatus herein disclosed describe a variety of methods to detect the leads and define the size, position, and shape of the locus during training. Preferably, the lead tip is also detected so that the locus can be defined based on an offset from the front of the lead. During operation, characteristics of the locus and/or the target bond point are used to relocate the lead and refine the target bond/point before bonding. Alternative embodiments disclosed include inspecting the leads.

There is provided a method of bonding inner leads of lead frames to electrodes of semiconductor chips, including the steps of (a) pictorially recognizing bonding sites of inner leads a semiconductor chip through wires for the certain number of lead frames among a plurality of lead frames and analyzing the bonding sites to obtain coordinate data numerically expressing the bonding sites, (b) calculating statistic about dispersion in the thus obtained coordinate data, (c) judging whether the thus calculated statistic is smaller or greater than a predetermined threshold value, and (d) bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames in accordance with predetermined bonding site data without pictorially recognizing bonding sites thereof, if the statistic is equal to or smaller than the predetermined threshold value, or bonding inner leads of lead frames to electrodes of semiconductor chips for the rest of lead frames by pictorially recognizing bonding sites in advance for the rest of lead frames, if the statistic is greater than the predetermined threshold value. In accordance with the above mentioned method, it is possible to omit pictorial recognition for the rest of lead frames, if statistic calculated based on dispersion in bonding sites in the certain number of lead frames is smaller than a threshold value, resulting in significant improvement in bonding speed.

Disclosed are apparatus and method for inspecting leads of an IC placed on a setting table. The apparatus comprises an optical image recognition part for scanning the setting table, a device for moving the recognition palt with respect to the setting table, a position detection palt for detecting a position of the recognition part on the basis of an output signal thereof, and a control part for controlling the device on the basis of a signal of the position detection pait so that the recognition part is positioned at an optimal position above the setting table. The setting table is scanned stepwise, and the optimal position is a position that the value of the output signal is maximized. The recognition pall is positioned at the optimal position. The arrangement and the status of the leads of the IC are inspected automatically in a short period of time, and productivity increases.