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Claims  |
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What is claimed is:
1. A release modified organopolysiloxane for use in a silicone release
coating composition comprising units, in sufficient number to increase
release of the formula:
R.sub.a R.sub.b.sup.1 SiO.sub.(4-a-b)/2
wherein R is hydrogen, C.sub.(1-8) alkyl, or C.sub.(1-8) aryl, R.sup.1 is a
monovalent phenolic radical of from 6 to 25 carbon atoms; a is 0, 1 or 2;
b is 1, 2 or 3, and a+b is 1, 2 or 3, and comprising units, in sufficient
number to properly cure said coating composition, of the formula:
R.sub.a R.sub.c.sup.2 SiO.sub.(4-a-c)/2
wherein R and a are given above; R.sup.2 is hydrogen or a monovalent epoxy
functional organic radical; c is 1, 2 or 3 and a+c is 1, 2 or 3.
2. The release modified organopolysiloxane of claim 1 wherein the number of
units containing R.sup.1 substitution is from 0.5 to 25% of the total
number of siloxane units in the organopolysiloxane and the number of units
containing R.sup.2 substitution is from 0.5 to 50% of the total number of
siloxane units in the organopolysiloxane.
3. The release modified organopolysiloxane of claim 1 wherein R.sup.1 has
the formula:
##STR3##
where A.sup.1 is --CH.sub.2 --CH.sub.2 -- or --CH.dbd.CH--, R.sup.3 is a
divalent hydrocarbon radical of from 1 to 18 carbon atoms, R.sup.4 is
hydrogen, halogen or a monovalent organic moiety, R.sup.5 is hydrogen or a
monovalent substituted or unsubstituted hydrocarbon radical of from 1 to
18 carbon atoms, and d is 0 or 1.
4. The release modified organopolysiloxane of claim 1 wherein R.sup.2 is
hydrogen.
5. The release modified organopolysiloxane of claim 1 wherein R.sup.2 is
monovalent epoxy functional organic radical.
6. The release modified organopolysiloxane of claim 1 comprising units of:
SiO.sub.4/2, RR.sup.1 SiO.sub.2/2 and R.sub.2 HSiO.sub.1/2 ;
SiO.sub.4/2, R.sub.2 HSiO.sub.1/2 and R.sub.2 R.sup.1 SiO.sub.1/2 ;
R.sub.3 SiO.sub.1/2, RR.sup.1 SiO.sub.2/2 and RHSiO.sub.2/2 ; or
RSiO.sub.3/2, RR.sup.1 SiO.sub.2/2, RHSiO.sub.2/2 ; and R.sub.3 SiO.sub.1/2
wherein R and R.sup.1 are as defined in claim 1.
7. The release modified organopolysiloxane of claim 1 comprising units of
R.sub.3 SiO.sub.1/2, RR.sup.1 SiO.sub.2/2, R.sub.2 SiO.sub.2/2 and RR.sup.2
SiO.sub.2/2 ; RSiO.sub.3/2, RR.sup.1 SiO.sub.2/2, R.sub.2 SiO.sub.2/2 ;
and
RR.sup.2.sub.2 SiO.sub.2/2, or RR.sup.2.sub.2 SiO.sub.2/2, R.sub.2
SiO.sub.2/2 and RR.sup.2.sub.2 SiO.sub.2/2
where R and R.sup.1 are as defined in claim 1 and R.sup.2 is monovalent
epoxy functional organic radical.
8. The release modified organopolysiloxane of claim 3 wherein A.sup.1 is
--CH.sub.2 --CH.sub.2 --.
9. The release modified organopolysiloxane of claim 3 wherein R.sup.5 is
hydrogen.
10. The release modified organopolysiloxane of claim 3 wherein R.sup.5 is
C.sub.1-3 alkyl.
11. The release modified organopolysiloxane of claim 3 wherein R.sup.5 is
C.sub.6 aryl.
12. The release modified organopolysiloxane of claim 3 wherein R.sup.5 is
C.sub.1-6 carbonyl.
13. A silicone release composition comprising (i) linear, terminally vinyl
substituted silicone polymer having a viscosity of from 50 to 100,000
centipoise at 25.degree. C.; (ii) a release modified organopolysiloxane
comprising units, in sufficient number to increase release, of the formula
R.sub.a R.sup.1.sub.b SiO.sub.(4-a-b)/2
wherein R is hydrogen, C.sub.(1-8) alkyl, or C.sub.(1-8) aryl, R.sup.1 is a
monovalent phenolic radical of from 6 to 26 carbon atoms, a is 0, 1 or 2;
b is 1, 2 or 3; and a+b is 1, 2 or 3, and comprising units, in sufficient
number to properly cure said coating composition, of the formula:
R.sub.a R.sup.2.sub.c SiO.sub.(4-a-c)/2
wherein R and a are given above; R.sup.2 is hydrogen; c is 1, 2 or 3; and
a+c is 1, 2 or 3, (iii) an addition cure catalyst and (iv) an addition
cure inhibitor.
14. The silicone release composition of claim 13 wherein the number of
units containing R.sup.1 substitution in said release modified
organopolysiloxane is from 0.5 to 25% of the total number of siloxane
units and the number of units containing R.sup.2 substitution is from 0.5
to 50% of the total number of siloxane units.
15. The silicone release composition of claim 13 wherein R.sup.1 has the
formula:
##STR4##
where A.sup.1 is --CH.sub.2 --CH.sub.2 -- or --CH.dbd.CH--, R.sup.3 is a
divalent hydrocarbon radical of from 1 to 18 carbon atoms, R.sup.4 is
hydrogen, halogen or a monovalent organic moiety, R.sup.5 is hydrogen or a
monovalent substituted or unsubstituted hydrocarbon radical of from 1 to
18 carbon atoms, and d is 0 or 1.
16. The silicone release composition of claim 13 wherein said release
modified organopolysiloxane comprises units of:
SiO.sub.4/2, RR.sup.1 SiO.sub.2/2 and R.sub.2 HSiO.sub.1/2 ;
SiO.sub.4/2, R.sub.2 HSiO.sub.1/2 and R.sub.2 R.sup.1 SiO.sub.1/2 ;
R.sub.3 SiO.sub.1/2, RR.sup.1 SiO.sub.2/2 and RHSiO.sub.2/2 ; or
RSiO.sub.3/2, RR.sup.1 SiO.sub.2/2, and R.sub.3 SiO.sub.1/2
wherein R and R.sup.1 are as defined in claim 13.
17. The release composition of claim 15 wherein A.sup.1 is --CH.sub.2
--CH.sub.2 --.
18. The release composition of claim 13 comprising from 0.5 to 20% by
weight R.sup.1 functions based on the silicone polymer content.
19. The release modified organopolysiloxane of claim 15 wherein R.sup.5 is
hydrogen.
20. The release modified organopolysiloxane of claim 15 wherein R.sup.5 is
C.sub.1-3 alkyl.
21. The release modified organopolysiloxane of claim 15 wherein R.sup.5 is
C.sub.6 aryl.
22. The release modified organopolysiloxane of claim 15 wherein R.sup.5 is
C.sub.1-6 carbonyl.
23. A silicone release composition comprising (i) linear, terminally vinyl
substituted silicone polymer having a viscosity of from 50 to 100,000
centipoise at 25.degree. C.; (ii) hydride substituted silicone fluid or
resin, (iii) an addition cure catalyst, (iv) an addition cure inhibitor,
and (v) a phenolic compound of the formula:
##STR5##
wherein A is --CH.dbd.CH.sub.2 or --C.ident.CH, R.sup.3 is a divalent
hydrocarbon radical of from 1 to 4 carbon atoms, R.sup.4 is hydrogen,
halogen, or a monovalent organic moiety, R.sup.5 is hydrogen or a
substituted or unsubstituted hydrocarbon radical of from 1 to 18 carbon
atoms, and d is 0 or 1 in an amount sufficient to increase the release of
the composition.
24. The release modified organopolysiloxane of claim 23 wherein R.sup.5 is
hydrogen.
25. The release modified organopolysiloxane of claim 23 wherein R.sup.5 is
C.sub.1-3 alkyl.
26. The release modified organopolysiloxane of claim 23 wherein R.sup.5 is
C.sub.6 aryl.
27. The release modified organopolysiloxane of claim 23 wherein R.sup.5 is
C.sub.1-6 carbonyl. |
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Claims  |
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Description  |
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The present invention relates to silicone release coating compositions.
More particularly, the present invention relates to silicone release
coating compositions having organic substitution to control release of
adherent materials.
BACKGROUND OF THE INVENTION
Silicone release coatings are widely used to render surfaces non-adherent.
Non-adherent surfaces are necessary in the case of pressure-sensitive
adhesives for easy transportation and storage prior to use of labels,
decorative laminates, transfer tapes, etc. Likewise, non-adherent surfaces
are desirable for food handling and industrial packaging.
There is a continuing need in the release coating industry to develop
materials with "differential release" characteristics. In other words,
there are wanted release coatings, the release of which may be adjusted to
various levels as desired. With "differential release", premature release
can be prevented while accounting for easy release when desired.
U.S. Pat. No. 4,448,815 discloses a heat curable release coating
composition crosslinked by addition reaction in the presence of a platinum
catalyst. There is no teaching as to a controlled release.
U.S. Pat. No. 4,576,999 discloses a UV radiation curable release coating
composition crosslinked either through epoxy or acrylic functions. Again,
there is no teaching as to a controlled release.
U.S. Ser. No. 171,498, filed Mar. 21, 1988, now U.S. Pat. No. 4,977,198,
discloses the reaction by esterification of benzoyl compounds with epoxy
functional silicone to produce a silicone polymer self-sensitized to UV
radiation and having a modified release. Other methods to modify release
are desirable, particularly methods with broader application to different
chemistries.
U.S. Pat. No. 4,547,431 discloses UV radiation curable epoxy functional
silicone further containing polyfunctional epoxy monomers. The additional
monomers provide quantitative variable release. Again, other methods are
desired to modify release, not specific to epoxy chemistry.
It is an object of the present invention to produce differential release
silicone coatings.
It is a further object of the present invention to produce silicone
polymers substituted to provide differential release.
SUMMARY OF THE INVENTION
Briefly, there is provided by the present invention release modified
organopolysiloxane for use in a silicone release coating composition
comprising units, in sufficient number to increase release, of the
formula:
R.sub.a R.sub.b.sup.1 SiO.sub.(4-a-b)/2
wherein R is hydrogen, C.sub.(1-8) alkyl, or C.sub.(1-8) aryl; R.sup.1 is a
monovalent phenolic radical of from 6 to 26 carbon atoms; a is 0, 1 or 2;
b is 1, 2 or 3; and a+b is 1, 2 or 3, and comprising units, in sufficient
number to properly cure said coating composition, of the formula:
R.sub.a R.sub.c.sup.2 SiO.sub.(4-a-c)/2
wherein R and a are given above; R.sup.2 is hydrogen, monovalent acrylic
functional organic radical or monovalent epoxy functional organic radical;
c is 1, 2 or 3; and a+c is 1, 2 or 3.
DETAILED DESCRIPTION OF THE INVENTION
A release modified organopolysiloxane herein is easily and simply
manufactured. For example, base hydride functional organopolysiloxanes may
be reacted with phenolic compounds with substitution containing terminal
aliphatic unsaturation. Alternatively, a base epoxy substituted
organopolysiloxane might be reacted with a carboxylic acid functional
phenolic compound. Likewise, base amine functional organopolysiloxanes
might be reacted with both carboxylic acid functional phenolic compound
and acrylic acid. Persons skilled in the art understand the methods to
obtain phenolic substitution on appropriate organopolysiloxane. Based on
convenience, manufacture from base hydride functional organopolysiloxanes
and phenolic compounds with unsaturated substitution is preferred and will
be described in further details as follows.
The hydride functions may be present in the base organopolysiloxane as
H.sub.2 SiO.sub.2/2 units, HSiO.sub.3/2 units, (CH.sub.3).sub.2
HSiO.sub.1/2 units, and/or preferably (CH.sub.3)HSiO.sub.2/2 units. These
hydride functions are reacted with the aliphatic unsaturation of the
phenolic radical by an addition type in the presence of an appropriate
catalyst such as a platinum catalyst. Where the release modified
organopolysiloxane contains epoxy or acrylic functional organic radicals,
then these functions are added in a similar reaction from base hydride
functional organopolysiloxane and epoxy or acrylic functional compounds
containing terminal aliphatic unsaturation.
Suitable phenolic compounds for use herein include compounds derived from
phenolic compounds and having the formula:
##STR1##
wherein A is --CH.dbd.CH.sub.2 or --C.ident.CH, R.sup.3 is a divalent
hydrocarbon radical of from 1 to 18 carbon atoms, R.sup.4 is hydrogen,
halogen, or a monovalent organic moiety, R.sup.5 is hydrogen or a
monovalent substituted or unsubstituted hydrocarbon radical of 1 to 18
carbon atoms, and d is 0 or 1. Suitable R.sup.3 include methylene,
ethylene, propylene, etc. Suitable R.sup.4 include alkyl, alkoxy, hydroxy,
amine, carboxyl, etc. Suitable R.sup.5 include hydrogen, alkyl, alkenyl,
alkynyl, aryl, alkoxy, aryloxy, and polyether. Preferably, R.sup.5 is
hydrogen, C.sub.1-3 alkyl, such as methyl, ethyl, etc., or C.sub.6 aryl
such as phenyl or C.sub.1-6 carbonyl, such as acetyl, acryloyl, benzoyl,
nitrobenzoyl, etc. Preferably the majority of R.sup.4 are hydrogen. Also
preferred are those phenolic compounds where A--R.sub.d.sup.3 -- and --OH
bear a 1, 2 relationship on the aromatic ring.
From the above, it is clear that R.sup.1 will have a formula of:
##STR2##
where A.sup.1 is --CH.sub.2 --CH.sub.2 -- or --CH.dbd.CH-- and R.sup.3,
R.sup.4, R.sup.5 and d are given above. Conveniently, R.sup.3 is
methylene.
Suitable phenolic compounds include:
4-allyl-2-methoxyphenol, 2-allylphenol,
4-allyl-2-aminophenol, 4-vinylphenol
4-allyl-2-methylphenol, 4-allyl-2,6-dimethylphenol,
5-allyl-3-hydroxyphenol, methyl eugenol, phenyl eugenol,
4-allyl-acetoxybenzene etc.
Silicone release coating compositions are well known in the art. Presently
these coatings are of two basic types, i.e. heat cured and UV cured. Heat
cured release coating compositions contain terminally vinyl substituted
silicone polymer, hydride substituted silicone polymer, addition reaction
promoting catalyst and addition reaction inhibitor. Heat is employed to
deactivate the inhibitor and to allow cure to proceed. Suitable inhibitors
include dialkyl carboxylic esters such as diallylmaleate, or
hydroperoxides such as taught in U.S. Pat. Nos. 4,061,609 and 4,448,815,
incorporated by reference. In the heat cured release coating compositions,
it is believed to be most convenient to release modify the hydride
substituted silicone polymer. Thus, the hydride substituted silicone
polymer will simply have some portion of the hydride functions reacted
with phenolic compounds substituted with terminal aliphatic unsaturation.
Suitable heat cured release coating compositions and inhibitors therefor
are further described in U.S. Pat. Nos. 4,448,815 and 4,061,609, hereby
incorporated by reference. UV cured release coating compositions contain
epoxy and/or acrylic substituted silicone polymer and an effective
catalyst to promote cure with UV light. Suitable catalysts include onium
salt cationic photoinitiator for epoxy, such as halonium, sulfonium or
phosphonium or free-radical photoinitiator for acrylic. U.S. Pat. Nos.
4,576,999 and 4,279,717 further describe UV cured silicone release coating
compositions and are hereby incorporated by reference.
The molecular structure of release modified organopolysiloxane will change
according to the type of coating composition in which it is employed. In
heat cured compositions a solvent is often employed. The vinyl substituted
silicone polymer portion of the release coating composition is generally
linear and might have a viscosity ranging from about 50 to 100,000
centipoise at 25.degree. C. The hydride substituted silicone polymer of
heat cured compositions may take the form of either a resin or a fluid and
is desirably release modified. Thus, the release modified
organopolysiloxane for heat cured compositions include polymers containing
units of the formulas SiO.sub.4/2, RR.sup.1 SiO.sub.2/2 and R.sub.2
HSiO.sub.1/2 ; SiO.sub.4/2, R.sub.2 HSiO.sub.1/2 and R.sub.2 R.sup.1
SiO.sub.1/2 ; R.sub.3 SiO.sub.1/2, RR.sup.1 SiO.sub.2/2 and RHSiO.sub.2/2
; RSiO.sub.3/2, RR.sup.1 SiO.sub.2/2, RHSiO.sub.2/2 and R.sub.3
SiO.sub.1/2 ; etc. In UV cured compositions, generally applied
solventless, there is required only a single silicone polymer type, i.e.
that containing epoxy and/or acrylic functions. To obtain appropriate
viscosity of between 100 and 1500 centipoise at 25.degree. C. for the UV
cured composition, the single type should be substantially linear. Thus,
the release modified organopolysiloxane for UV cured compositions include
polymers containing units of the formulas R.sub.3 SiO.sub.1/2, RR.sup.1
SiO.sub.2/2, R.sub.2 SiO.sub.2/2 and RR.sup.2 SiO.sub.2/2 ; RSiO.sub.3/2,
RR.sup.1 SiO.sub.2/2, R.sub.2 SiO.sub.2/2 and RR.sub.2.sup.1 SiO.sub.1/2
RR.sup.2 SiO.sub.2/2, R.sub.2 SiO.sub.2/2 and RR.sub.2.sup.1 SiO.sub.1/2 ;
etc., where R.sup.2 is monovalent acrylic functional organic radical or
monovalent epoxy functional organic radical. Broadly, a release modified
organoplysiloxane should have from 0.5 to 25% by number units with R.sup.1
substitution and from 0.5 to 50% by number units with R.sup.2
substitution. Preferably these ranges are 1 to 15% and 1 to 25%
respectively.
Of course, in either the heat or UV cured release coating compositions
there may always be employed additional ingredients for their ordinary
purpose which contain no units with R.sup.1 substitution. In the case of
heat cured compositions there may be employed an unmodified hydride
substituted silicone to perform the major part of the crosslinking
function. Also, in the case of the UV cured compositions, there may be
employed an unmodified acrylic functional or epoxy functional silicone to
form the major part of the cured matrix with the release modified
organopolysiloxane providing R.sup.1 functions and having only sufficient
R.sup.2 to properly cure the coating and prevent bleed. Thus, it is not
critical that each polymer of the release coating composition be modified
with an R.sup.1 function. It is, however, critical that there be
sufficient release modified organopolysiloxane with sufficient units
having R.sup.1 substitution to increase release.
In the release coating composition, the silicone polymer portion may
contain from about 5 to 100% by weight and preferably 10 to 75% by weight
release modified organopolysiloxane. At the same time, the composition
should contain from 0.5 to 20% by weight and preferably 1.0 to 15% by
weight R.sup.1 functions based on the silicone polymer content.
Although not central to the instant invention, UV cured release coating
compositions contain R.sup.2 of epoxy and/or acrylic functions. These
functions may be conveniently added to a base silicone polymer in the same
manner as described above for R.sup.1. Thus, where epoxy or acrylic
functions are desired, unsaturated epoxy or acrylic functional compounds
are added to silicone hydride units in the presence of an addition
catalyst such as platinum. Suitable unsaturated epoxy or acrylic
functional compounds are well known. Exemplary of the unsaturated epoxy
compounds are 1-methyl-4-isopropenyl cyclohexeneoxide,
2,6-dimethyl-2,3-epoxy-7-octene, 1,4-dimethyl-4-vinylcyclohexeneoxide and
4-vinylcyclohexeneoxide. Exemplary of the unsaturated acrylic compounds
are allyl acrylate and allyl methacrylate. Due to the similar chemistry
involved in substituting both R.sup.1 and R.sup.2 for UV cured
compositions, it may be desirable to perform both substitutions in a
single reaction step.
The release coating composition is applied to a substrate and cured
according to its chemistry. Generally the substrate is paper having a
porosity to allow a desired penetration of the composition prior to cure.
Other substrates include metal, foil, glass, polyethylene film,
polypropylene film and polyester film.
In the case of heat cured coating compositions, it may be desirable to form
the release modified organopolysiloxane simultaneously to curing the
coating composition. In this case, the phenolic compound may act as a
solvent up to the point of cure, at which time it adds to a base hydride
substituted silicone to form an R.sup.1 group and increase release. This
option is more difficult to carry out in the UV cured compositions due to
the necessity of initiating and controlling simultaneous addition,
substitution and free radical cure reactions.
In order that persons skilled in the art may better understand the practice
of the present invention, the following examples are provided by way of
illustration, and not by way of limitation.
EXAMPLES
EXAMPLE 1
This example describes the preparation of a release modified
organopolysiloxane containing phenol substitution and epoxy functions. A
silicone-hydride fluid, trimethyl-stopped polydimethyl, methylhydrogen,
silicone, 0.17 wt % H, 30 centipoise at 25.degree. C., was devolatilized
at 120 C. at 1 mm Hg. 50 g of the devolatilized fluid, 25 g of toluene and
0.01 g of platinum complex (H.sub.2 PtCl.sub.6 in octanol) were weighed
into a 200 mL 3-necked flask equipped with a stir bar, reflux condenser
and a thermometer. The reaction was heated to 65 C. and a slow dropwise
addition of 5.5 g of 2-allylphenol (flash distilled) was started. The
temperature of the reaction rose to 70.degree. C. The remainder of the
Si-H groups were replaced by the slow dropwise addition of 5.2 g of
4-vinylcyclohexeneoxide at 65.degree. C. The reaction mixture was heated
at 65 C. for 3 hours. In order to ensure the completion of the reaction,
i.e. that no SiH remain unreacted, 0.5 g of 1-hexene was also added to the
reaction. After a 1 hour reflux, the reaction was cooled and the solvent
was removed by rotary evaporation. A siloxane fluid was obtained. This
material, Phenol P, was found to be completely miscible with other
epoxysilicone fluids.
EXAMPLE 2
This comparative example describes the preparation of an organopolysiloxane
containing benzene substitution and epoxy functions. 20 g of the
devolatilized silicone-hydride fluid described in the previous example, 10
g of toluene and 0.01 g of platinum complex as in Example 1 were weighed
into a 200 mL 3-necked flask equipped with a stir bar, reflux condenser
and a thermometer. The reaction was heated to 65 C. and a slow dropwise
addition of a mixture of 2.1 g of 4-vinylcyclohexeneoxide and 1.8 g of
allylbenzene was started. The temperature of the reaction rose to
70.degree. C. After a 3 hour hold at 65.degree. C., Si-H groups still
remained, so an additional 0.01 g of platinum complex was added. After an
additional 1 hours hold, the reaction was cooled and the solvent was
removed by rotary evaporation. A siloxane fluid was obtained. This
material, Benzene P, was found to be completely miscible with other
epoxysilicones.
EXAMPLE 3
This example describes the preparation of a release modified
organopolysiloxane containing eugenol substitution and epoxy functions. 20
g of a silicone-hydride fluid described in Example 1 was weighed into a
250 ml 3-necked flask with 10 ml of toluene and 0.01 g of a platinum
complex as in Example 1. The reaction was heated to 60.degree. C. and a
slow dropwise addition of 2.78 g of eugenol was started. The temperature
of the reaction rose to 70.degree. C. The remainder of the Si-H groups
were replaced by the slow dropwise addition of 2.1 g of
4-vinylcyclohexeneoxide at 60.degree. C. The reaction mixture was heated
at 60.degree. C. for 10 minutes. GC and IR were used to confirm the
disappearance of olefin and Si-H, respectively. After a 1 hour heating
cycle the reaction was cooled and the solvent was removed by rotary
evaporation. This material, Eugenol P, was also found to be completely
miscible with other epoxysilicones.
EXAMPLES 4-7
Unmodified Epoxy (UE), poly-dimethyl-methyl, beta (3,4-epoxy-cyclohexyl)
siloxane, 10% by weight epoxy, 250 cps at 25.degree. C., was blended in
various ratios with the materials of Examples 1-4. The blend was diluted
to 20% by weight solids with an organic solvent and catalyzed with
iodonium photocatalyst at from 1 to 3% by weight to form a release coating
composition. The coating composition was applied to polyethylene kraft
using a coating rod and dried and cured by exposure to a mercury vapor
lamp at 600 watts and 100 ft/min. Release numbers were obtained against an
aggressive solvent cast SBR pressure sensitive adhesive at a pull of 400
in/min and a 180.degree. angle. Release was measured in the units of g/2
in.
TABLE 1
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Modified
Epoxy
Polymer UE/ME Release
Example
(ME) by weight
Initial
3 day 1 week
2 week
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4 -- 100/0 50-60
80-100
80-110
70-110
5A Phenol P
75/25 65-80
70-90 110-130
120-140
5B Phenol P
50/50 50-65
50-65 80-100
100-120
5C Phenol P
25/75 125-140
130-150
210-240
260-290
5D Phenol P
0/100
175-200
230-260
310-340
340-380
6A Benzene P
75/25 40-50
35-45 50-65
55-65
6B Benzene P
50/50 30-40
45-55 60-75
70-90
6C Benzene P
25/75 40-50
35-50 50-70
55-65
6D Benzene P
0/100
50-60
45-55 50-60
55-65
7A Eugenol P
75/25 60-70
-- 60-80
60-75
7B Eugenol P
50/50 75-90
-- 90-100
90-110
7C Eugenol P
25/75 85-100
-- 120-140
120-140
7D Eugenol P
0/100
120- 140
-- 500 220-250
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The presence of phenolic structure on the silicone polymer chain provides
for controlled release. The benzylic structure alone fails to provide this
advantage.
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Description  |
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