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Claims  |
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What is claimed is:
1. A pacemaker comprising:
a housing;
at least one electrical feedthrough terminal extending through the housing;
a battery located in the housing, the battery having two terminals
extending out of a top of the battery;
an electronic substrate having electronic components mounted thereon; and
a molded integrated interconnect structure having a lid portion, at least a
first, a second and a third through-hole, and conductive means integrally
formed therein, the lid portion having means for receiving and protecting
the electronic substrate, the first and second through-holes being
connected to one each of the battery terminals, the third through-hole
being connected to the electrical feedthrough terminal, the conductive
means including means for electrically interconnecting the electronic
substrate to the battery terminals and to the electrical feedthrough
terminal.
2. The pacemaker, as recited in claim 1, further comprising:
electronic components mounted onto the integrated interconnect structure.
3. The pacemaker, as recited in claim 2, wherein the conductive means
comprises:
means for electrically connecting the electronic components of the
electronic substrate to the electronic components mounted onto the
integrated interconnect structure.
4. The pacemaker, as recited in claim 3, wherein the means for receiving
and protecting the electronic substrate comprises a circuitry housing
recess.
5. The pacemaker, as recited in claim 4, wherein the electronic components
mounted onto the integrated interconnect structure are mounted within the
circuitry housing recess.
6. The pacemaker, as recited in claim 1, wherein:
the integrated interconnect structure has a first set of electrical
contacts on a surface thereof; and
the electronic substrate has a second set of electrical contacts on a
surface thereof for making electrical contact with the first set of
electrical contacts.
7. The pacemaker, as recited in claim 1, further comprising:
a shock mount pad between the substrate and battery.
8. The pacemaker, as recited in claim 1, wherein the integrated
interconnect structure is comprised of a molded dielectric material.
9. The pacemaker, as recited in claim 8, wherein the conductive means
comprises:
conductive wires molded within the dielectric material.
10. The pacemaker, as recited in claim 8, wherein the conductive means
comprises:
conductors printed on the surfaces of the molded dielectric material.
11. An electronic module for use with a pacemaker, the pacemaker having a
battery with terminals, and at least one electrical feedthrough terminal
for connection to a pacing lead, the electronic module comprising:
an electronic substrate having electronic components mounted thereon; and
an integrated interconnect structure having a recess for receiving and
protecting the electronic substrate, the integrated interconnect structure
further having conductive means for electrically connecting the electronic
substrate to the battery and feedthrough terminals.
12. The electronic module, as recited in claim 11, further comprising:
electronic components mounted onto the recess of the integrated
interconnect structure; and
wherein the conductive means includes means for electrically
interconnecting the electronic components mounted onto the integrated
interconnect structure with the electronic components mounted on the
electronic substrate.
13. The electronic module, as recited in claim 11, wherein the conductive
means comprises:
conductive through-holes for passage of the battery terminals and at least
one feedthrough terminal therethrough.
14. The electronic module, as recited in claim 11, wherein the conductive
means comprises:
conductors substantially contained inside the integrated interconnect
structure with the dielectric polymer material molded thereover.
15. The electronic module, as recited in claim 11, wherein the conductive
means comprises:
conductors printed on the surfaces of the molded dielectric material.
16. The electronic module, as recited in claim 11, wherein the conductive
means comprises:
electrical contact means for connecting the electronic substrate to the
integrated interconnect structure.
17. The electronic module, as recited in claim 11, wherein the an
integrated interconnect structure is comprised of a molded dielectric
polymer material.
18. An electronic package for use within a pacemaker, the pacemaker having
a battery and feedthroughs, the package comprising:
an integrated interconnect structure having a recess for at least partially
housing an electronic substrate, the integrated interconnect structure
having conductive means integrally formed therewith;
electronic components mounted onto the recess of integrated interconnect
structure and electrically interconnected by the conductors; and
means for connecting an electronic substrate to the integrated interconnect
structure and the conductive means.
19. The package, as recited in claim 18, wherein the conductive means
comprises:
conductive holes for receiving and making electrical connection with the
battery terminals.
20. The package, as recited in claim 18, wherein the conductive means
comprises:
conductive holes for receiving and making electrical connection with the
feedthroughs.
21. An electronic package for use with a pacemaker, the pacemaker including
a battery having battery terminals, an electronic substrate, and
feedthrough terminals for connection with a pacemaker lead, the package
comprising:
a integrated interconnect structure having a recess for receiving and
protecting the electronic substrate, the integrated interconnect structure
further having conductive means for electrically connecting the electronic
substrate to the battery and feedthrough terminals.
22. The package, as recited in claim 21, further comprising electronic
components mounted onto the recess of the integrated interconnect
structure and electrically interconnected by the conductive means.
23. The package, as recited in claim 21, wherein the integrated
interconnect structure has conductive holes for receiving and making
electrical connection with the battery terminals.
24. The package, as recited in claim 21, wherein the integrated
interconnect structure has conductive holes for receiving and making
electrical connection with the feedthroughs.
25. The package, as recited in claim 21, wherein the integrated
interconnect structure is comprised of a molded dielectric polymer
material.
26. A method of manufacturing a pacemaker comprising steps of:
providing a battery with battery terminals;
providing electrical feedthroughs extending through a pacemaker housing;
mounting electronic components onto a substrate;
mounting the substrate onto an integrated interconnect structure to form an
electronic module, the interconnect structure comprising dielectric
material having a cavity molded therein and conductors integrally formed
therewith, the interconnect structure further having a plurality of
through-holes molded therein for the positioning of the battery terminals
and the electrical feedthroughs;
mounting the electronic module on the top of the battery so that the
battery terminals extend through two of the plurality of through-holes;
and
positioning the battery, the integrated interconnect structure and the
electronic module in the pacemaker housing with the feedthroughs extending
through the housing into through-holes within the integrated interconnect
structure.
27. The method, as recited in claim 26, comprising steps of:
mounting electronic components onto the cavity molded within the integrated
interconnect structure. |
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Claims |
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Description |
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FIELD OF THE INVENTION
The present invention relates to pacemakers, and, more particularly, to a
microelectronic package for mounting electronic components for use in a
pacemaker and a method of manufacturing a pacemaker.
BACKGROUND OF THE INVENTION
There are three primary driving forces for today's implantable biomedical
devices increased functionality, enhanced reliability, and a reduction in
product size. The advent of the hybrid microcircuit has been one of the
major contributors to meeting all of these requirements, thus enabling the
development of sophisticated implantable products which are truly
physiologically compatible in terms of product size.
A problem exists in the pacemaker field in that currently available
pacemaker designs utilize discrete substrates and lids to protect and
enclose microcircuit components. Furthermore, the pacemaker assembly
employs flexible interconnect circuitry to connect the microcircuit
components in the electronic package to the pacemaker battery and output
feedthroughs. The assembly of such a pacemaker consequently requires
accurate placement of several discrete structures which is costly to
assemble and difficult to automate.
Another problem of the prior art pacemaker is that design changes during
the qualification and testing phases of pacemaker development often
necessitate adding additional components. In many cases, these components
circuitry due to the lack of flexible interconnect circuitry due to the
lack of real estate on the hybrid substrate, which significantly
complicates the assembly of the pacemaker and potentially decreases the
reliability of the system.
It is therefore an objective of the present invention to provide a new and
improved electronics package that combines the functions of the hybrid lid
and the flexible interconnect circuit into a single structure.
It is also an objective of the present invention to provide an interconnect
structure which can easily add electronic components without complicating
the assembly operations of the pacemaker.
It is another objective to provide a pacemaker which has significantly
improved reliability, and is easily manufactured at a reduction of cost.
SUMMARY OF THE INVENTION
The disadvantages and limitations of the background art discussed above are
overcome by the present invention. According to the invention, an
arrangement is provided which enables the rapid and effective assembly of
an implantable medical device such as a pacemaker. The solution offered by
the present invention is to combine the functions of a protective cover
for a hybrid substrate and the flexible interconnect circuitry into an
integrated interconnect structure.
In accordance with one embodiment of the present invention, a pacemaker is
provided comprising an electronic module, a battery having battery
terminals for interconnecting the battery with the electronic module, and
a pacemaker housing for housing the battery and the electronic module. The
housing includes electrical feedthroughs which serve to interconnect the
electronic module with a pacemaker lead. The electronic module includes a
circuit substrate and an integrated interconnect structure. The circuit
substrate has electronic components mounted thereon. The integrated
interconnect structure is a three-dimensional molded part which combines
the function of a lid for the circuit substrate and the function of the
flexible interconnect circuitry between the battery, the circuit
substrate, and the electrical feedthroughs. Interconnect conductors may be
formed within and/or otherwise printed on any of the surfaces of the
integrated interconnect structure. The integrated interconnect structure
further includes means for receiving the battery feedthroughs and the
electrical feedthroughs.
In accordance with another embodiment of the present invention, an
electronic module for use in a pacemaker is provided. The electronic
module comprises a substrate, an integrated interconnect structure, and
electronic components. The integrated interconnect structure is comprised
of an electrically insulating material which is moldable into a
three-dimensional part. The electronic components are mounted either onto
the substrate, onto the integrated interconnect structure, or both. In one
embodiment, all of the active components (i.e., diodes, transistors, and
other integrated circuits) are placed on one side of the substrate. The
integrated interconnect structure, which includes a cavity for receiving
the substrate, thus serves as a lid or cover for the active electrical
components which are mounted onto the substrate. The integrated
interconnect structure further includes conductors and through-holes
integrally formed therein, which serve to interconnect the electronic
module to battery feedthroughs and electrical feedthroughs in the
pacemaker.
In accordance with another embodiment of the present invention, an
integrated interconnect structure for use with a pacemaker is provided.
The integrated interconnect structure comprises a three-dimensional molded
part having a lid portion and a feedthrough portion. The lid portion
includes a flat inner cavity with walls extending therefrom for receiving
and protecting an electronic substrate. The feedthrough portion includes
several through-holes adapted to receive battery terminals and electrical
feedthroughs. Conductors are integrally formed within the integrated
interconnect structure such that the electronic substrate may be
electrically interconnected to the battery terminals and to the electrical
feedthroughs. Advantageously, the integrated interconnect structure
combines the functions of the hybrid lid and the flexible interconnect
circuit into a single structure. The lid portion may further be adapted to
have additional electronic circuitry mounted directly onto the flat inner
cavity thereby enabling electronic components to be easily added or
modified without complicating the assembly operations of the pacemaker.
In accordance with one method of the present invention, a method of
manufacturing a pacemaker is disclosed which comprises the steps of,
first, providing a battery with battery terminals and electrical
feedthroughs which extend through a pacemaker housing. Electronic
components are then mounted onto a substrate. The substrate is then
mounted onto an integrated interconnect structure to form an electronic
module. The electronic module is next mounted on the top of the battery so
that the battery terminals extend through two of the through-holes.
Finally, the battery, the integrated interconnect structure, and the
electronic module are positioned within the pacemaker housing with the
feedthroughs extending through additional through-holes within the
integrated interconnect structure. Advantageously, by reducing the number
of components (i.e., by eliminating a separate flex circuit), the
integrated interconnect structure provides greatly improved and
accelerated assembly of device components, increased reliability of these
connections, and reduced cost of manufacturing due to its simplicity, and
the ability to automate the assembly process.
Finally, all of the aforesaid advantages and objectives are achieved
without incurring any substantial relative disadvantage. It will,
therefore, be perceived that the advantages of the present invention
result in rapid and effective assembly of a cardiac pacemaker, making the
method of the present invention a highly desirable enhancement to
implantable cardiac pacemaker therapy.
BRIEF DESCRIPTION OF THE DRAWINGS
Further features and advantages of the present invention may be more
readily understood by reference to the following description taken in
conjunction with the accompanying drawings, in which:
FIG. 1 is an exploded perspective view of a pacemaker known in the prior
art;
FIG. 2 is an exploded perspective view of a pacemaker incorporating the
present invention;
FIG. 3 is a partial perspective view of one embodiment of the present
invention;
FIGS. 4A and 4B are two side views of a circuit package for use with the
present invention shown in FIG. 3;
FIG. 5 is a perspective view of another embodiment of the present
invention; and
FIG. 6 is a perspective view of another embodiment of the present invention
.
DETAILED DESCRIPTION OF THE INVENTION
Although the present invention will be described with reference to the
embodiments shown in the drawings, it should be understood that various
modifications can be incorporated into the present invention. The
foregoing general description and the following detailed description are
exemplary and explanatory but are not to be restrictive of the invention.
The accompanying drawings illustrate one of the embodiments of the
invention, and, together with the description, serve to explain the
principles of the invention in general terms. In addition, any suitable
size, shape, or type of elements or materials can be used. Like numerals
refer to like parts throughout the disclosure.
In FIG. 1, there is shown an exploded perspective view of a pacemaker 10
known in the prior art. The pacemaker 10 generally comprises a housing 12,
a battery 16, electronic package 18, and ribbon or flex cable 20 connected
between the electronic package 18, at electrical connections 22, and
feedthroughs 24 at electrical feedthrough leads 26. An interior end of
each of the electrical feedthrough leads 26 is suitably connected, such as
by soldering, to an end of the flex cable 20. An opposite end of the
electrical feedthrough leads 26 is positioned for engagement with an
associated conductor 39 of a connector block 40 within a connector top 42
intended for suitable mounting on the top surface of the housing 12.
Proximal ends of the pacemaker leads (not shown) are received through
suitable jack openings 44 in the connector top 42 for electrical
connection with the connector block 40. The distal ends of the pacemaker
leads (not shown) are suitably attached to the heart of a patient. The
battery 16 has two terminals (not shown) that extend up from its top which
are connected to the electronic components of the electronic package 18
either by way of the flex cable 20 or individual discrete wires. The
electronic package 18 is fixedly connected to the top of the battery 16.
One of the major problems of the prior art, as exemplified by the device
shown in FIG. 1, is that in order to make the electrical connections
between the battery 16, the electronic package 18, and the feedthrough
leads 26, individual connections had to be made with great precision due
to the pacemaker's small size. This, of course, was time-consuming and
costly.
In FIG. 2, there is shown an exploded perspective view of one embodiment of
the present invention. A pacemaker 28 comprises a housing 12, a battery
16, an electronic package 18, an integrated interconnect structure 32, and
feedthroughs 24 at electrical feedthrough leads 26. The battery 16 is of
conventional design and has two terminals 34 and 35 extending up from its
top surface.
As best seen in FIG. 3, the pacemaker 28 also includes a shock mount pad
30. The shock mount pad 30 rests on top of the battery 16 with the
terminals 34 and 35 projecting therethrough. The shock mount pad 30 is
generally comprised of silicone rubber, however, any suitable shock
absorbing type of material can be provided. In an alternate embodiment of
the present invention, the shock mount pad 30 might be replaced by a
silicone rubber covering over the integrated interconnect structure 32.
The integrated interconnect structure 32, in the embodiments shown in FIGS.
2 and 3, generally comprises a molded three-dimensional part made of a
thermoplastic resin that has been extruded, thermo-formed or injection
molded using conventional molding equipment. Several suitable
thermoplastic materials are currently available, including polyetherimide
sold under the trademark ULTEM and manufactured by General Electric;
polyethersulfone sold under the trademark VICTREX manufactured ICI
Americas, Inc.; or any equivalent plastic material having the following
properties: high-strength, low dielectric constant, low coefficient of
thermal expansion, and can meet the molding and soldering requirements.
Conductors may be injection molded into the integrated interconnect
structure 32 or printed on any of the flat surfaces of the integrated
interconnect structure 32 using one of several methods, such as metal
stamping, printing conductive inks, or using additive plating. For a
further explanation of three-dimensional molded processes, reference is
made to the following publications: "3-D Circuit Boards Optimize Use of
Space," Design News, Sep. 19, 1988, pp. 146-147; and "Update:
Three-Dimensional Molded Interconnect," Connection Technology, June 1990,
pp. 23-25; and "Single- and Multilayer Molded Circuits Using Image Decals
in the Molding Process," Electronic Manufacturing, July 1990, pp. 24-27;
which publications are hereby incorporated herein by reference.
The purposes of the integrated interconnect structure 32 includes providing
protection for the electronic package 18 and providing electrical
interconnections between the electronic package 18, the battery 16, and
the electrical feedthrough leads 26. Thus, in the preferred embodiment
shown in FIG. 3, the integrated interconnect structure 32 has a
feedthrough portion 36 and a lid portion 38. The feedthrough portion 36
has a hollow interior with two feedthrough holes 37 extending through a
bottom wall 66 and four feedthrough holes 41 extending through a top wall
67. In a preferred embodiment of the invention, the battery terminals 34
and 35 and the electrical feedthrough leads 26 are located in each of the
feedthrough holes 37 and 41 to make good electrical contact with the
integrated interconnect structure 32.
The lid portion 38 has a general box-like shape with an interior recess 46.
In the embodiment shown, a plurality of contacts 50 are disposed for
making electrical contact with corresponding contacts (not shown) on the
electronic package 18. The contacts 50 may be comprised of any suitable
type of contact material.
In the embodiment shown, the integrated interconnect structure 32 has a
plurality of conductors or conductive strips 70 integrally formed
therewith. The conductors 70 are generally provided to function as
electrical connections between the contacts 50 and the battery terminals
34 and 35, and the electrical feedthrough leads 26. In one embodiment of
the invention, the conductors 70 are comprised of electrical wires which
the dielectric material of the integrated interconnect structure 32 is
molded around. In another embodiment of the present invention, the
integrated interconnect structure 32 is comprised of a molded circuit
assembly board which has conductive traces printed thereon. The conductive
traces follow the contours of the outer surface of the integrated
interconnect structure 32 to interconnect the contacts 50 with the
electrical feedthrough leads 26 and the battery terminals 34 and 35.
In FIGS. 4A and 4B, two sides are shown of an electronic package 18
intended to be used with the integrated interconnect structure 32 shown in
FIG. 3. In the preferred embodiment shown in FIGS. 4A and 4B, the
substrate 54 is a double-sided substrate. On one side (FIG. 4A), the
electronic package 18 includes electronic components 56 (including,
diodes, transistors, and other integrated circuits) mounted onto a
substrate 54 and contacts 58. As shown in FIG. 4B, components which do not
need to be protected (such as a crystal 55, tantalum capacitors 57, and a
telemetry coil 59), are placed together on the other side of the substrate
54. The electronic components 55, 56, 57 and 59 are fixedly connected to
the substrate 54 with interconnect metallization (not shown) within the
substrate 54 thereby interconnecting the electronic components together.
The interconnect metallization also interconnects the electronic
components 55, 56, 57 and 59 with the contacts 58. The contacts 58 are
located at a side region of the substrate 54 and are intended to make
electrical contact with the contacts 50 of the integrated interconnect
structure 32 shown in FIG. 3. Thus, when the substrate 54 is mounted onto
the integrated interconnect structure 32, all of the active components
will be protected by the integrated interconnect structure 32.
The electronic package 18 can be connected with the integrated interconnect
structure 32 by merely inserting the side of the electronic package 18
having the active electronic components into the interior recess 46 of the
integrated interconnect structure 32. The substrate 54 is suitably sized
and shaped to align the contacts 58 with the contacts 50 as the electronic
package 18 is mounted to the integrated interconnect structure 32. The
electronic package 18 can then be fixedly connected to the integrated
interconnect structure 32 by any suitable means. For example, the
integrated interconnect structure 32 may be attached to the substrate
using a nonconductive sealant, while the contacts 50 and 58 may be
connected by welding, solder or epoxy.
Once the electronic package 18 is mounted, the integrated interconnect
structure 32 is easily aligned over the battery 16 such that the battery
terminals 34 and 35 can be inserted through the through-holes 37 and
subsequently soldered or otherwise welded. One end of the electrical
feedthrough leads 26 is also easily positioned for engagement with the
feedthrough holes 41. Thus, the integrated interconnect structure 32
interconnects the electronic package 18 to the battery terminals 34 and 35
and to the electrical feedthrough leads 26.
Advantageously, the integrated interconnect structure 32 is also capable of
mounting additional electronic components on the interior recess 46, as
shown in FIG. 5. In the embodiment shown, an integrated interconnect
structure 32 is provided with electronic components 60 connected directly
onto the interior recess 46 (shown in FIG. 3). The integrated interconnect
structure 32 has suitable conductive traces on its interior recess 46 to
interconnect the electronic components 60. Thus, no additional circuit
package need be connected to the integrated interconnect structure 32.
However, the embodiment shown in FIG. 5 allows for an additional
electronic substrate, such as the electronic package 18 shown in FIG. 4,
to be connected to the integrated interconnect structure 32. For this
purpose, the integrated interconnect structure 32 has contacts 50 and
suitable space is provided in the area 61 to position additional
electronic components therein. This provides the additional capacity for
providing not only passive components, such as capacitors and resistors to
the integrated interconnect structure 32, but it also enables active
components, such as diodes, FETS, and other integrated circuits to be
mounted to the integrated interconnect structure 32. Thus, this allows the
electronics of a pacemaker having the integrated interconnect structure 32
to be modified at a later date without having to change the basic
integrated interconnect structure 32.
In FIG. 6, there is shown an another alternate embodiment of the present
invention. In the embodiment shown, an integrated interconnect structure
62 is provided without a feedthrough connection section. Thus, the
integrated interconnect structure 62 merely comprises an electronic
connection section 64. The integrated interconnect structure 62 has
electronic components 60 connected thereto and suitable conductive traces
(not shown) interconnecting the electronic components 60 and connecting
the electronic components 60 to contacts 50. For the embodiment shown, the
integrated interconnect structure 62 would be connected to the battery
terminals 34 and 35 and the feedthrough leads 26 as known in the prior art
by means of a flex cable as shown in FIG. 1. Advantageously, the
integrated interconnect structure 62 in the embodiment shown, unlike the
prior art shown in FIG. 1, is adapted to receive an additional electronic
substrate such as substrate 52 shown in FIG. 4. Thus, the integrated
interconnect structure 62 can have an additional electronic substrate
connected thereto to provide increased or additional features to a
pacemaker, similar to the integrated interconnect structure 32 shown in
FIG. 5.
There are two major advantages provided by the present invention. First,
the use of the integrated interconnect structure allows for the
elimination of the use of wires and flex cables in making electrical
connections. The integrated interconnect structure of the present
invention, due to its modular feature of electrical interconnection,
allows for connections to be made relatively simply and easily by merely
positioning the battery terminals and feedthrough leads in the appropriate
integrated interconnect structure holes. This is also obviously faster
than the flex cable connections in prior art devices. This also allows for
the assembly process to become automated due to its simplicity of
assembly.
Second, the three-dimensional integrated interconnect structure is a
modular unit that can have additional circuit packages connected thereto.
This has never been provided in pacemakers and can be used to add
additional features and functions to pacemakers without having to redesign
the entire pacemaker. The added space for locating electronic components
can also allow for Z-axis integration of electronic components that has
not been available in the prior art.
Let it be understood that the foregoing description is only illustrative of
the invention. Various alternatives and modifications can be devised by
those skilled in the art without departing from the spirit of the
invention. Accordingly, the present invention is intended to embrace all
such alternatives, modifications and variances which fall within the scope
of the appended claims.
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