Feed through assemblies and methods for their manufacture are provided. The feedthrough assemblies include a ferrule, an insulating material contacting the ferrule, and a terminal extending through the ferrule and having first and second areas separated by an area contacting the insulating material. A brazing material contacts the insulating material and the terminal's first area, and a conductive material covers the terminal's second area. The presence of the conductive material causes current density to be dispersed away from the brazing material.
A molded part, in particular a casing for electronic components, includes a cast body made in one piece of a material selected from the group including metal and metal matrix composite, and having passages made of an electrically insulating material for receiving a conductor, whereby the material of the body is cast onto the passages.
Apparatus for hermetically sealing materials that cannot be satisfactorily sealed directly to one another using conventional techniques are disclosed. A laminar sheet material having adjacent bonded dissimilar metallic layers is interposed between elements being sealed. One of the metallic layers bonds metallurgically to one of the elements, while the other metallic layer is hermetically sealed to the other element using conventional techniques such as welding. The apparatus of the present invention are especially suitable for hermetically sealing metal matrix composite electronics packages.
A microcircuit package feedthrough that relates to glass-to-metal seals, and more particularly, to feedthroughs for use in surfacemount microcircuit packages. The present invention can be used with surface mount technology such that it is a microcircuit package feedthrough that requires fewer manufacturing steps to install than conventional feedthroughs.
The present invention provides a light-weight, hermetic coaxial radio-frequency (RF) interconnection having an electrically conductive outer housing made of aluminum or an aluminum alloy, a central electrical conductor made of ferrous or non-ferrous material, and a cylinder of dielectric material comprising a low-melting-temperature, high-thermal-expansion aluminophosphate glass composition for hermetically sealing between the aluminum-alloy outer housing and the ferrous or non-ferrous center conductor. The entire RF interconnection assembly is made permanently hermetic by thermally fusing the center conductor, glass, and housing concurrently by bringing the glass to the melt point by way of exposure to an atmospheric temperature sufficient to melt the glass, less than 540.degree. C., but that does not melt the center conductor or the outer aluminum or aluminum alloy housing. The composition of the glass used is controlled to provide a suitable low dielectric constant so that an appropriate electrical characteristic impedance, for example 50 ohms, can be achieved for an electrical interconnection that performs well at high radio frequencies and also provides an interconnection maintaining a relatively small physical size.
