Apparatus (11) is robotically operated to pick up an optical element such as a ball lens (12) or an optical fiber, place it in a groove or depression (13) of a substrate (14), and apply pressure to it so that it is bonded to the substrate. The tool comprises a retracting element holder (17) surrounding a bonding tool (16). A vacuum channel (18) communicates with the element holder so that, by the application of a vacuum, it can pick up an optical element. The tool then moves the element to place it, for example, in a depression (13) of a substrate, whereupon the vacuum is released, thereby to allow the element to nest between opposing sidewalls of the depression. The retracting holder element is simultaneously retracted vertically upwardly so as to expose a bonding surface of the bonding tool. After the element has nested in the groove, the bonding tool contacts the element and forces it against opposite sidewalls to effect a thermo-compression bond of the optical element with the sidewalls.
A surface emitting type of light emitting devices has a narrow emanating region near the front surface. A spherical lens is fixed on the front surface or rear surface for converging light beams to a core of an optical fiber. Prior devices determined the position of the spherical lens by forming a concavity or a set of protrusions on the rear surface. Two wafer processes were required to form the concavity or protrusions. Two wafer processes on both surfaces induced not a little positioning error. This invention does not form concavities nor protrusions on the rear surface. The rear surface is ground and left flat. Second electrode is formed on the rear surface, not hindering light to emit through. The center of the emanating region is determined by supplying current to the device and illuminating the emanating region. The emanating pattern is observed by a TV camera connected to a computer. The center of the emanating region is detected by image processing of the illuminated pattern. The position of the center is memorized. Adhesive is supplied to the rear surface of the chip. A spherical lens is carried to a spot of the memorized coordinate. The adhesive is hardened in a moment to fix the lens at the spot.
The present invention relates to a method and apparatus for forming ball electrodes on electrode pads provided on a package. Solder balls and the electrode pads can be aligned with each other with high precision, and the cost of processing can be decreased. An installation apparatus for balls which holds the solder balls by vacuum suction is preferably formed of heat-resisting glass or other transparent material through which the balls may be observed. The solder balls are aligned with electrode pads provided on a package, and brought into contact with the electrode pads, with the solder balls and the electrode pads capable of being viewed through the installation apparatus from the top. Thereafter, a light beam is radiated from a light beam radiation light through the installation apparatus, thereby successively melting soldering paste on the electrode pads. In such a manner, the solder balls are fixed to the electrode pads. Consequently, ball electrodes are precisely formed.
The present invention includes a tool (300) for positioning optical waveguide fibers (310) on an adhesive coated substrate (302) including a holder (301) and a pressure source. The holder (301) includes a chamber (314) coupled to the pressure source and multiple recesses (308) configured to position the optical waveguide fibers (310). Each recess (308) includes a reference surface (312) and is connected to the chamber (314) by a passageway (316). The pressure source is configured to selectively increase and decrease the pressure in the chamber (314). The invention also includes a method of making optical waveguide fiber array blocks using the tool (300).
The invention is a method and resulting device which provides a strong bond between a silicon substrate and an oxide component mounted within a cavity in the substrate. A layer of titanium, for example, is deposited on the walls of the cavity, followed by deposition of a layer of aluminum. The structure is preferably annealed to form titanium silicide and titanium-aluminum interface layers. The component is then bonded to the aluminum layer.
A device for applying light conductive fibers onto substrates and having a mounting yoke, a holding device and a stamping device. The holding device is configured as a U-shaped base body with an upward arching outside area having guide grooves and holders for installing the fibers in the device. The stamping device consists of a stamp, a stamp neck and a stamp head, which are inserted and linearly guided in the U-shaped die sink in the holding device. The device ensures a precise positioning of fibers and in particular of functional units in fiber segments. Fiber breaks can be nearly ruled out with the application method. The separating foils ensure that the device can be removed after the adhesive has hardened, so that no force is exerted onto the fiber through excess adhesive that sticks.
