A mechanically conformable thermally conductive interface for use in electrically isolating and thermally connecting printed circuit boards to either beat sinks, metal chasses, or heat spreaders. The interface material utilizes silicone polymers of controlled molecular weight and a surface layer of a pressure sensitive adhesive may be employed. The silicone polymer is filled with a thermally conductive electrically insulative particulate such as alumina and/or boron nitride, with the silicone being prepared as a reaction product of a liquid organosiloxane together with a chain extender such as a hydride terminated polydimethylsiloxane material. A release film such as polyethylene may be utilized as the undersurface layer, if desired.

A carrier or substrate for a photoconductor to be used for the formation of an electrophotographic recording element, particularly an imaging drum for an electrophotographic printing press, wherein the carrier is made of a metal or a metal alloy, preferably of aluminum, is prepared wherein the surface of the carrier supporting the photoconductor, used to form a barrier layer, is oxidized, preferably by etching and/or anodizing. The oxidized surface of the barrier layer is sealed with a sealing material following oxidation, and a preservative or impregnating agent is used as the sealing material.

A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may then be deposited onto the elemental metal to produce a microstructure.

A method of forming microstructures. An article including a metal atom precursor is disproportionally exposed to electromagnetic radiation in an amount and intensity sufficient to convert some of the precursor to elemental metal. Additional conductive material may then be deposited onto the elemental metal to produce a microstructure.