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Claims  |
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What is claimed is:
1. A ceramic capacitor having a dielectric layer composed of one or more
than one dielectric ceramic composition and two or more than two internal
electrodes so disposed as to interpose the dielectric layer, wherein:
the dielectric ceramic composition is composed of a sintered body of
ceramic particles having crystal grains with a core section composed
mainly of BaTiO.sub.3 and a shell portion composed of crystal grains of
BaTiO.sub.3 in the form of a solid solution comprising an oxide of one or
more than one elements M selected from the group consisting of Mg, Ca, Sr,
and Zn, and on oxide as represented by R.sub.2 O.sub.3, wherein R is one
or more than on element selected from the group consisting of Sc, Y, Gd,
Dy, Ho, Er, Yb, Tb, Tm and Lu and optionally ZrO.sub.2, said ceramic
particles having a structure as shown in the microphotograph of FIG. 1,
with streaks domain walls in the core section, said shell sections having
M and R in the crystal grains of BaTiO.sub.3x in the shell, with M and R
components in the shell being substantially uniformly distributed.
2. A ceramic capacitor as claimed in claim 1, wherein the shell section of
the ceramic particle is composed of ZnO.sub.2 in the form of a solid
solution.
3. A ceramic capacitor as claimed in claim 1, wherein the internal
electrode is composed of material containing Ni as a major component.
4. The ceramic capacitor of claim 1, wherein the core section of the
crystal grain is composed mainly of BaTiO.sub.3 and the shell section is
composed of BaTiO.sub.3 and a solid solution of ZrO.sub.2.
5. A process for the preparation of a ceramic capacitor comprising:
a step of preparing powder of raw material as basic component;
a step of calcining the powder of raw material as the basic component at a
predetermined temperature;
a step of forming a slurry by mixing the calcined raw material powder with
powder of an additive component and an organic binder;
a step of formulating the slurry into a sheet form, thereby forming a
non-sintered ceramic sheet;
a step of yielding a laminated body by forming a conductive paste film so
as to interpose the non-sintered ceramic sheet;
a step of baking the laminated body in a non-oxidative atmosphere; and
a step of subjecting the laminated body to heat treatment in an oxidative
atmosphere;
wherein the basic component comprises BaTiO.sub.3 as a major component, one
or more than one oxide selected from MgO, CaO, SrO and ZnO, an oxide as
represented by R.sub.2 O.sub.3, wherein R is one or more than one element
selected from Sc, Y, Gd, Dy, Ho, Er, Yb, Tb, Tm and Lu, and BaO and/or
TiO.sub.2 so added as to amount to 1.00.ltoreq.k.ltoreq.1.04, wherein k is
a ratio by mole of (Ba+Mg+Ca+Sr+Zn) to (Ti+R); and
wherein an additive component comprises Li.sub.2 O-SiO.sub.2 -MeO or
B.sub.2 O.sub.3 -SiO.sub.2 -MeO, wherein Me is one or more than one
element selected from Ba, Ca, Sr, Mg and Zn.
6. A method as claimed in claim 5, wherein the conductive paste is formed
with material containing Ni as a major component.
7. A method as claimed in claim 5, wherein the additive component comprises
Cr.sub.2 O.sub.3 and/or Al.sub.2 O.sub.3.
8. A process for the preparation of a ceramic capacitor comprising:
a step of preparing powder of raw material as a first basic component;
a step of calcining the powder of raw material as the first basic component
at a predetermined temperature; a step of forming a slurry by mixing the
calcined first basic component with powder of raw material as a second
basic component, an additive component and an organic binder;
a step of formulating the slurry into a sheet form, thereby forming a
non-sintered ceramic sheet;
a step of yielding a laminated body by forming a conductive paste film so
as to interpose the non-sintered ceramic sheet;
a step of baking the laminated body in a non-oxidative atmosphere; and
a step of subjecting the laminated body to heat treatment in an oxidative
atmosphere;
wherein the first basic component comprises BaTiO.sub.3 as a major
component, one or more than one oxide selected from MgO, CaO, SrO and ZnO,
an oxide as represented by R.sub.2 O.sub.3, wherein R is one or more than
one element selected from Sc, Y, Gd, Dy, Ho, Er, Yb, Tb, Tm and Lu, and
BaO and/or TiO.sub.3 so added as to amount to 1.00.ltoreq.k.ltoreq.1.04,
wherein k is a molar ratio of (Ba+Mg+Ca+Sr+Zn) to (Ti+R);
wherein the second basic component comprises CaZrO.sub.3 and/or BaZrO.sub.3
; and
wherein an additive component comprises Li.sub.2 O-SiO.sub.2 -MeO or
B.sub.2 O.sub.3 -SiO.sub.2 -MeO, wherein Me is one or more than one
element selected from Ba, Ca, Sr, Mg and Zn.
9. A method as claimed in claim 8, wherein the conductive paste is formed
with material containing Ni as a major component.
10. A method as claimed in claim 8, wherein the additive component
comprises Cr.sub.2 O.sub.3 and/or Al.sub.2 O.sub.3.
11. A dielectric ceramic composition composed of a sintered body of ceramic
particles having an inner core section and an outer shell section, the
core being composed mainly of BaTiO.sub.3 and the shell section being
composed of BaTiO.sub.3 and a solid solution of one or more oxides, said
composition having a structure as shown in the microphotograph of FIG. 1. |
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Claims  |
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Description  |
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BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention relates to a ceramic capacitor and a method for the
preparation of the ceramic capacitor and, to more particularly, to a
ceramic capacitor of a mono-layer structure or of a multi-layer structure,
having one or more than one dielectric layer composed of a dielectric
ceramic composition containing BaTiO.sub.3 as a major component and two or
more than two internal electrodes so disposed as to interpose the
dielectric layer.
2. Description of the Related Art
Ceramic capacitors of a multi-layer structure are generally formed by
alternately laminating a non-sintered ceramic sheets for forming
dielectric layers and conductive paste films and baking the laminated
dielectric layers and conductive paste films at temperatures ranging from
1,300.degree. C. to 1,600.degree. C. in oxidative atmosphere. Hence,
expensive metals as are not oxidized upon baking in oxidative atmosphere,
such as platinum or palladium, are employed as material for the internal
electrode, thereby making costs of ceramic capacitors expensive.
In order to reduce the costs of the ceramic capacitors, it is considered to
use a base metal, such as Ni or the like, as the material for the internal
electrodes and to bake the base metal in reductive atmosphere to prevent
the oxidation of the base metal. It is to be noted, however, that desired
dielectric ceramic compositions having sufficiently high electrical
characteristics cannot be produced by baking material of the dielectric
ceramic compositions so far known in reductive atmosphere.
For example, Japanese Patent Laid-open Publication (kokai) No. 61-275,164
discloses dielectric ceramic compositions having a high dielectric
constant yet a small rate of change of temperatures of capacitance which
can be produced by baking powder of raw material obtainable by adding
Nb.sub.2 O.sub.5 and Co.sub.2 O.sub.3 to BaTiO.sub.3, in oxidative
atmosphere. It is to be noted, however, that the baking of such powder of
the raw material in such reductive atmosphere cannot produce the
dielectric ceramic composition having desired electrical characteristics
because the baked body may become readily converted into semi-conductors.
Japanese Patent Publication (kokoku) Nos. 61-14,607-14,611 and
62-1,595-1,596 propose dielectric ceramic compositions, obtainable by
baking in reductive atmosphere, having a high dielectric constant yet a
small rate of change in temperatures of the capacitance. Further, our
Japanese Patent Application Nos. 1-311,094-98, 2-314,754-56, 1-315,981-83,
2-16,345, 2-76,761-68 and 2-76,773-776 propose improvements in various
electric characteristics of the dielectric ceramic compositions.
The dielectric ceramic compositions as proposed by those patent
applications as described hereinabove contain, as a first basic component,
a component as represented by (Ba.sub.k-x M.sub.x)O.sub.k (Ti.sub.1-y
R.sub.y)O.sub.2-y/2. As a second basic component, there may optionally be
employed a component as represented by CaZrO.sub.3 or BaZrO.sub.3.
Further, as a first additive component, there may be employed Li.sub.2
O-SiO.sub.2 -MeO or B.sub.2 O.sub.3 -SiO.sub.2 -MeO, while at least one of
Cr.sub.2 O.sub.3 and Al.sub.2 O.sub.3 may optionally be employed as a
second additive component.
Recently, however, very strong demands have been made to minimize laminated
ceramic capacitors as electronic circuit becomes highly dense. For making
laminated ceramic capacitors compact, there are known many processes for
reducing the thickness of the dielectric layers and for increasing the
number of layers to be laminated. If the dielectric layer becomes too
thin, however, the direct current breakdown voltage may deviate and
reliability in the withstand voltage of the ceramic capacitor cannot be
maintained.
For instance, for laminated ceramic capacitors requiring for characteristic
X7R (characteristic B), reliability in the direct current breakdown
voltage particularly at the highest temperature as high as 125.degree. C.
places particular significance. However, reducing the thickness of the
dielectric ceramic compositions disclosed in the aforesaid patent
applications to deviation in the direct current breakdown voltage at
125.degree. C. and makes it impossible to maintain the reliability in the
withstand voltage at that temperature.
SUMMARY OF THE INVENTION
The object of the present invention is to provide ceramic capacitors of a
mono-layer structure or of a multi-layer structure and a method for the
preparation of small-sized ceramic capacitors having high reliability in
the direct current breakdown voltage at 125.degree. C.
Other objects, features and advantages of the present invention will become
apparent in the course of the description of the preferred embodiments,
which follows, with reference to the accompanying drawings.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1 is an electron microphotograph showing a dielectric ceramic
composition according to Example 1.
FIG. 2 is a graph showing an EDS spectrum of a core section of a ceramic
particle of the dielectric ceramic composition according to Example 1.
FIG. 3 is a graph showing an EDS spectrum of a shell section of a ceramic
particle of the dielectric ceramic composition according to Example 1.
FIG. 4 is a sectional view showing the ceramic capacitor according to
Example 1.
FIG. 5 is an electron microphotograph showing a sample of Comparative
Example.
FIG. 6 is a graph showing an EDS spectrum of the section A of FIG. 5.
FIG. 7 is a graph showing an EDS spectrum of the section B of FIG. 5.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The ceramic capacitor according to the present invention has a dielectric
layer composed of one or more than one dielectric ceramic composition and
two or more than two internal electrodes formed so as to interpose the
dielectric layer there between. The dielectric ceramic composition is
composed of a sintered body of a ceramic particle whose core section is
composed mainly of BaTiO.sub.3 and whose shell section is composed of
BaTiO.sub.3 in the form of a solid solution containing an oxide of one or
more than one element selected from Mg, Ca, Sr and Zn and an oxide of one
or more than one element selected from Sc, Y, Gd, Dy, Ho, Er, Yb, Tb, Tm
and Lu.
The core section of the ceramic particle is intended to mean an inner
section of the ceramic particle and the shell section of the ceramic
particle is intended to mean an outer shell section thereof. The shell
section of the particle ceramic may optionally be composed of a solid
solution of ZrO.sub.2. Further, the internal electrode may be composed of
conductive material containing Ni as a major component or composed of
another metal.
The method for the preparation of the ceramic capacitor according to the
present invention comprises a step of preparing powder of the raw material
as the basic component, a step of calcining the powder of the raw material
at a predetermined temperature, a step of forming a slurry by mixing the
calcined raw material powder of the basic component with powder of the
additive component and an inorganic binder, a step of forming the slurry
in the form of a sheet to give a non-sintered ceramic sheet and
formulating a laminated body by forming a conductive paste film so as to
interpose the non-sintered ceramic sheet, there between step of baking the
laminated body in a non-oxidative atmosphere, and a step of heating the
laminated body in an oxidative atmosphere. The basic component may be
composed of BaTiO.sub.3 as a major component, one or more than one oxide
selected from MgO, CaO, SrO and ZnO, an oxide as represented by R.sub.2
O.sub.3 (wherein R is one or more than one elements selected from Sc, Y,
Gd, DY, Ho, Er, Yb, Tb, Tm and Lu), and BaO and/or TiO.sub.2 which are/is
added so as to amount to 1.00.ltoreq.k.ltoreq.1.04 (wherein k is a ratio
by mole of (Ba+Mg+Ca+Sr+Zn) to (Ti+R), i.e. (Ba+Mg+Ca+Sr+Zn)/(Ti+R)). The
additive component is composed of Li.sub.2 O-SiO.sub.2 -MeO or B.sub.2
O.sub.3 -SiO.sub.2 -MeO (wherein Me is one or more than one element
selected from Ba, Ca, Sr, Mg and Zn).
An alternative method for the preparation of the ceramic capacitor involves
a step of preparing powder of the raw material as the first basic
component, a step of calcining the powder of the raw material of the first
component at a predetermined temperature, a step of forming a slurry by
mixing the calcined raw material powder of the first basic component with
powder of the second basic component, powder of an additive component and
an organic binder, a step of forming the slurry in the form of a sheet to
give a non-sintered ceramic sheet and formulating a laminated body by
forming a conductive paste film so as to interpose there between the
non-sintered ceramic sheet, a step of baking the laminated body in a
non-oxidative atmosphere, and a step of heating the laminated body in an
oxidative atmosphere. The first basic component may be composed of
BaTiO.sub.3 as a major component, one or more than one oxide selected from
MgO, CaO, SrO and ZnO, powder of an oxide as represented by R.sub.2
O.sub.3 (wherein R is one member selected from one or more than one
element selected from Sc, Y, Gd, Dy, Ho, Er, Yb, Tb, Tm and Lu), and BaO
and/or TiO.sub.2 which are/is added so as to amount to
1.00.ltoreq.k.ltoreq.1.04 (wherein k is a ratio by mole of
(Ba+Mg+Ca+Sr+Zn) to (Ti+R)). The second basic component is composed of
CaZrO.sub.3 and/or BaZrO.sub.3. The additive component is composed of
Li.sub.2 O-SiO.sub.2 -MeO or B.sub.2 O.sub.3 -SiO.sub.2 -MeO (wherein Me
is one or more than one element selected from Ba, Ca, Sr, Mg and Zn).
In the two methods for the preparation of the ceramic capacitors as
described hereinabove, the raw material of the basic component is not
restricted to the oxides and it may include any compound, such as a
carbonate or the like, that can be converted into an oxide by baking. The
additive component may include ones containing optionally Cr.sub.2 O.sub.3
and/or Al.sub.2 O.sub.3. Although the conductive paste may be formed with
material containing Ni as a major component, a metal other than Ni may
also be employed.
In the two methods as described hereinabove, the temperatures at which the
first basic component is calcined may preferably range from 800.degree. C.
to 1,100.degree. C. If the calcining temperature is lower than 800.degree.
C., on the one hand, the decomposition of BaCO.sub.3 or the like proceeds
to an insufficient extent and the reaction is likely to be carried out in
an irregular fashion. If the calcining temperature exceeds 1,100.degree.
C., on the other hand, the growth of particles and aggregation would
start, thereby causing a decrease in the sintering ability.
It is preferred to use BaTiO.sub.3 as the first basic component in the
purity as high as 99% or higher and having an average particle size
ranging from 0.5 micron to 2.0 microns. If the particle size would be
smaller than 0.5 micron, the reaction may proceed too much, thereby
converting the first basic component into a solid solution. If the
particle size would become larger than 2.0 microns, the sintering ability
may be decreased. The reason for setting the ratio by mole
(k=(Ba+Mg+Ca+Sr+Zn)/(Ti+R)) to 1.00.ltoreq.k.ltoreq.1.04 is because the
dielectric ceramic composition is converted into semi-conductor when k is
smaller than 1.00, on the one hand, and the dielectric body suffers from
the difficulty of becoming dense when k is larger than 1.04, on the other
hand.
In conventional methods for the preparation of ceramic capacitors, all
components of raw material are mixed together to carry out the reactions
concurrently when the first basic component as represented by (Ba.sub.k-x
M.sub.x)O.sub.k (Ti.sub.1-y R.sub.y)O.sub.2-y/2), thereby making the
reaction likely to occur in an irregular fashion as well as localizing
particularly small components, i.e. a component M (such as Ca, Sr, Mg or
Zn) and a component R (such as Sc, Y, Gd, Dy, Ho, Er, Yb, Tb, Tm or Lu) in
the dielectric ceramic composition and deviating from the composition to a
great extent.
On the other hand, the present invention can suppress the composition of
the components M and R from deviating by carrying out the reaction
uniformly between BaTiO.sub.3 and the additive components because Ba, the
component M, Ti, and the component R are added to the previously
synthesized BaTiO.sub.3 at predetermined rates and the mixture is then
heated.
The present invention will be described more in detail by way of examples.
EXAMPLE 1
A pot mill was charged with 0.96 part by mole of BaTiO.sub.3 synthesized
previously, 0.05 part by mole of MgO, 0.01 part by mole of ZnO, 0.03 part
by mole of TiO.sub.2 and 0.005 part by mole of Ho.sub.2 O.sub.3, each
component having purity of 99% or higher, together with alumina balls and
2.5 liters of water, and the resulting mixture was stirred for 15 hours.
The resulting mixture was charged into a stainless pot and dried at
150.degree. C. for 4 hours with a hot air dryer and the dry mixture was
then pulverized to rough particles which in turn were calcined in air at
approximately 1,000.degree. C. for 2 hours with a tunnel oven, thereby
yielding powder of the first basic component as represented by
(Ba.sub.0.96 Mg.sub.0.05 Zn.sub.0.01)O.sub.1.02 (Ti.sub.0.99
Ho.sub.0.01)O.sub.1.995.
Then, 98 parts by mole of the powder of the first component and 2 parts by
mole of powder of CaZrO.sub.3 as the second basic component were weighed,
and 2 parts by weight of 0.20Li.sub.2 O-0.60SiO.sub.2
-0.04SrO-0.10MgO-0.06ZnO were added to 100 parts by weight of the mixture
of the basic components, followed by addition of 15% by weight of an
organic binder consisting of an aqueous solution of acrylic ester polymer,
glycerin and condensed phosphate salt and then 50% by weight of water to
the resulting mixture of the basic and additive components. The resulting
mixture was then pulverized and mixed in a ball mill to give a slurry.
The resulting slurry was defoamed with a vacuum defoamer and then
transferred to a reverse roll coater, thereby forming a thin coat on a
long polyester film. The thin coat formed on the polyester film was then
heated and dried at 100.degree. C., thereby yielding a non-sintered
ceramic sheet having the film thickness of approximately 25 microns. The
sheet was then cut to give a square sheet having a 10 cm side each.
On the other hand, the conductive paste for the internal electrode was
prepared by dissolving 10 grams of nickel powder having an average
particle size of 1.5 microns and 0.9 gram of ethyl cellulose in 9.1 grams
of butyl carbitol and stirring the resulting mixture for 10 hours with a
stirrer. The resulting conductive paste was then printed on one side of
the non-sintered ceramic sheet through a screen having 50 patterns, each
being 14 mm long and 7 mm wide, and the coat formed on the ceramic sheet
was dried.
Thereafter, one non-sintered ceramic sheet was laminated on another
non-sintered ceramic sheet with each printed side directed upward. In this
instance, the adjacent sheets were laminated so as for the upper sheet to
be superimposed on the lower sheet in a staggered arrangement by nearly
half of one, pattern in the lengthwise direction, thereby forming a
laminated body. Further, four non-sintered ceramic sheets having a
thickness of 60 microns were laminated on each of both surfaces of the
laminated body, and the sheets were pressed to attach to each other by
application of the temperature of nearly 50.degree. C. and the vertical
load of approximately 40 tons. Thereafter, the resulting laminated body
was then cut in a lattice form, thereby giving fifty laminated body chips.
The chips were then placed in an oven and the temperature of the atmosphere
within the oven was elevated at the rate of 100.degree. C. per hour to
600.degree. C., thereby burning the organic binder. Thereafter, the
atmosphere in the oven was changed from the atmosphere in air to reductive
atmosphere containing H.sub.2 (2% by volume)+N.sub.2 (98% by volume).
While the oven was held in such reductive atmosphere, the laminated body
chips were heated from 600.degree. C. to the sintering temperature as high
as 1,150.degree. C. at the rate of 100.degree. C. per hour. After they
were held at the maximum temperature, i.e. 1,150.degree. C. for three
hours, the temperature was cooled down to 600.degree. C. from
1,150.degree. C. at the rate of 100.degree. C. per hour, followed by
replenishing the atmosphere in the oven with atmosphere in air (oxidative
atmosphere) in which the oxidation was carried out at 600.degree. C. for
30 minutes. Thereafter, the chips were cooled down to room temperature,
thereby yielding laminated sintered body chips.
The side surfaces of the laminated sintered body chip with the electrodes
exposed to the outside were coated with a conductive paste consisting of
zinc, glass frit and a vehicle, and then dried. The chips were then baked
at 550.degree. C. for 15 minutes in air, thereby forming zinc electrode
layers and further forming a copper layer on the zinc electrode layers by
means of electroless plating method, followed by the formation of Pb-Sn
soldering layer thereon by means of electric plating method to thereby
formulate a pair of external electrodes.
The aforesaid procedures gave a laminated ceramic capacitor 10 having a
pair of the external electrodes 16 formed on the laminated sintered body
chip 15 composed of three dielectric ceramic layers 12 and two-layered
inner electrodes 14, as shown in FIG. 4. The external electrode comprises
a zinc electrode layer 18, a copper layer 20 formed on the zinc electrode
layer 18, and a Pb-Sn soldering layer 22 formed on the copper layer 20.
It is to be noted herein that the thickness of the dielectric ceramic layer
of the laminated ceramic capacitor 10 was found to be 0.02 mm and the area
of the internal electrodes, which overlaps with each other, was 25
mm.sup.2 (5 mm.times.5 mm). It is further to be noted herein that the
composition of the dielectric layer 12 subsequent to sintering is
substantially identical to a combination of the compositions of the basic
components and the additive component prior to sintering.
The laminated ceramic capacitor 10 was measured for its electrical
characteristics. As a result, the laminated ceramic capacitor 10 was found
to have a dielectric constant .epsilon..sub.s of 3,950, dielectric loss,
tan .delta., of 1.2%, electrical resistivity .rho. of 5.3.times.10.sup.6
M.OMEGA..multidot.cm, change rates of capacitance at -55.degree. C. and
+125.degree. C. when based on the capacitance at 25.degree. C., i.e.
.DELTA.C.sub.-55 and .DELTA.C.sub.125, of -10.1% and +3.5%, respectively,
change rates of capacitance at -25.degree. C. and +85.degree. C. when
based on the capacitance at 20.degree. C., i.e. .DELTA.C.sub.-25 and
{C.sub.85, of -3.6% and -4.2%, respectively, an average direct current
breakdown voltage at 125.degree. C. of 64 V/micron, and a minimum direct
current breakdown voltage at 125.degree. C. of 55 V/micron.
The aforesaid electrical characteristics were measured in the following
manner.
Dielectric constant .epsilon..sub.s : The capacitance was measured at the
temperature of 20.degree. C., frequency of 1 kHz and voltage (effective
value) of 1.0 V. The dielectric constant .epsilon..sub.s is then computed
from the measured value, the facing area (25 mm.sup.2) of a pair of
internal electrodes 14, and the thickness (0.02 mm) of a dielectric
ceramic layer 12 interposed between the pair of the internal electrodes
14.
Dielectric loss tan .delta.: The dielectric loss, tan .delta. (%), was
measured under the same conditions as the dielectric constant
.epsilon..sub.s.
Electrical resistivity .rho. (M.OMEGA..multidot.cm): The resistance value
between a pair of the external electrodes was measured after application
of direct current voltage of 100 V at 20.degree. C. for 1 minute, and the
electrical resistivity was measured from the measured value and a
dimension.
The temperature characteristics of the capacitance was measured by
measuring the capacitance of an sample placed in a thermostat at the
frequency of 1 kHz and the voltage (effective value) of 1.0 volt and
temperatures of -55.degree. C., -25.degree. C., 0.degree. C., +20.degree.
C., +25.degree. C., +40.degree. C., +60.degree. C., +85.degree. C.,
+105.degree. C. and +125.degree. C. and computing the rates of change at
each temperature relative to the capacitance at 20.degree. C. and
25.degree. C.
Direct current breakdown voltage at 125.degree. C.: Twenty samples were
immersed in a silicon oil at 125.degree. C. and the voltage was measured
immediately before each of the samples was broken down when the direct
current voltage was applied to the sample at the rate of 100 volts per
second, i.e. before the passage of the current of 0.1 mA. The direct
current breakdown voltage at 125.degree. C. was then computed from the
measured voltage per micron of the film thickness of the dielectric layer.
Comparative Example 1
The first basic component was prepared by calcining 0.05 part by mole of
MgO, 0.01 part by mole of ZnO, 0.96 part by mole of BaCO.sub.3, 0.99 part
by mole of TiO.sub.2 and 0.005 part by mole of Ho.sub.2 O.sub.3 at
1,200.degree. C. As the second basic component was employed CaZrO.sub.3.
To 98 parts by mole of the first basic component were added 2 parts by
mole of the second basic component. To 100 parts by weight of the mixture
of the first and second basic components were added 2 parts by weight of
an additive component as represented by 0.20Li.sub.2 O-0.60SiO.sub.2
-0.04SrO-0.10MgO-0.06ZnO. Then, a slurry was prepared by mixing the
mixture of the basic components and the additive component with an organic
binder. A laminated ceramic capacitor was prepared from the resulting
slurry in the same manner as in Example 1 and measured for its electrical
characteristics in the same manner as in Example 1. The results are shown
in Table 2 below.
EXAMPLE 2
As the raw material for a basic component, there were employed 0.96 part by
mole of BaTiO.sub.3, 0.03 part by mole of MgO, 0.01 part by mole of ZnO,
0.01 part by mole of CaCO.sub.3, 0.01 part by mole of SrCO.sub.3, 0.02
part by mole of TiO.sub.2, and 0.01 part by mole of Er.sub.2 O.sub.3. To
100 parts by weight of the basic component were added 2 parts by weight of
an additive component as represented by 0.30Li.sub.2 O- 0.45SiO.sub.2
-0.25SrO. An ceramic capacitor was prepared in the same manner as in
Example and then measured for its electric characteristics. The results
are shown in Table 2 below.
Comparative Example 2
The first basic component was prepared by calcining 0.03 part by mole of
MgO, 0.01 part by mole of ZnO, 0.01 part by mole of CaCO.sub.3, 0.01 part
by weight of SrCO.sub.3, 0.96 part by mole of BaCO.sub.3, 0.98 part by
mole of TiO.sub.2 and 0.01 part by mole of Er.sub.2 O.sub.3 at
1,200.degree. C. To 100 parts by weight of the basic component were added
2 parts by weight of an additive component as represented by 0.30Li.sub.2
O-0.45SiO.sub.2 -0.25SrO. Then, a slurry was prepared by mixing the
mixture of the basic component and the additive component with an organic
binder. A laminated ceramic capacitor was prepared from the resulting
slurry in the same manner as in Example 1 and measured for its electrical
characteristics in the same manner as in Example 1. The results are shown
in Table 2 below.
EXAMPLE 3
The basic component was prepared by employing 0.98 part by mole of
BaTiO.sub.3, 0.005 part by mole of MgO, 0.005 part by mole of SrCO.sub.3,
0.01 part by mole of BaCO, and 0.01 part by mole of Yb.sub.2 O.sub.3, as
the first basic component, and BaZrO.sub.3, as the second basic component,
at the rate of 2 parts by mole of the second basic component relative to
98 parts by mole. To 100 parts by weight of the basic components were
added an additive component as represented by 0.20B.sub.2 O.sub.3
-0.50SiO.sub.2 -0.30MgO. A ceramic capacitor was prepared in substantially
the same manner as in Example 1 and the electrical characteristics for the
resulting ceramic capacitor were measured in the same manner as in Example
1. The results are shown in Table 2 below.
Comparative Example 3
The first basic component was prepared by calcining 0.005 part by mole of
MgO, 0.005 part by mole of SrCO.sub.3, 0.99 part by weight of BaCO.sub.3,
0.98 part by mole of TiO.sub.2 and 0.01 part by mole of Yb.sub.2 O.sub.3
at 1,200.degree. C. To 98 parts by mole of the first basic component were
added 2 parts by mole of BaZrO.sub.3 as the second basic component. To 100
parts by weight of the mixture of the first and second basic components
were added 0.5 part by weight of an additive component as represented by
0.20Ba.sub.2 O.sub.3 -0.50SiO.sub.2 - 0.30MgO. Then, a slurry was prepared
by mixing the mixture of the basic component and the additive component
with an organic binder. A laminated ceramic capacitor was prepared from
the resulting slurry in the same manner as in Example 1 and measured for
its electrical characteristics in the same manner as in Example 1. The
results are shown in Table 2 below.
EXAMPLE 4
The basic component was prepared by employing 0.99 part by mole of
BaTiO.sub.3, 0.025 part by mole of CaCO.sub.3, 0.005 part by mole of
SrCO.sub.3 and 0.005 part by mole of Dy.sub.2 O.sub.3 as the first basic
component, and CaZrO.sub.3, as the second component at the rate of 2 parts
by mole of the second basic component relative to 98 parts by mole of the
first basic component. To 100 parts by weight of the mixture of the first
and second basic component were added a first additive component as
represented by 0.10B.sub.2 O.sub.3 -0.50SiO.sub.2 -0.08BaO-0.20CaO-0.12MgO
at the rate of 2 parts by weight of the first additive component as well
rate each of 0.1 part by weight. A laminated ceramic capacitor was
prepared in the same manner as in Example 1. The electrical
characteristics for the resulting ceramic capacitor were measured in the
same manner as in Example 1, and the results are shown in Table 2 below.
Comparative Example 4
The first basic component was prepared by calcining 0.025 part by mole of
CaCO.sub.3, 0.005 part by mole of SrCO.sub.3, 0.99 part by weight of
BaCO.sub.3, 0.99 part by mole of TiO.sub.2 and 0.005 part by mole of
Dy.sub.2 O.sub.3 at 1,200.degree. C. To 98 parts by mole of the first
basic component were added 2 parts by mole of CaZrO.sub.3 as the second
basic component. To 100 parts by weight of the mixture of the first and
second basic components were added 0.5 part by weight of a first additive
component as represented by 0.10B.sub.2 O.sub.3 -0.50SiO.sub.2
-0.08BaO-0.20CaO-0.12MgO. Further, as second additive components, 0.1 part
by weight of Cr.sub.2 O.sub.3 and 0.1 part by weight of Al.sub.2 O.sub.3
were added to 100 parts by weight of the mixture of the first and second
basic components. Then, a slurry was prepared by mixing the mixture of the
basic component and the additive component with an organic binder. A
laminated ceramic capacitor was prepared from the resulting slurry in the
same manner as in Example 1 and measured for its electrical
characteristics in the same manner as in Example 1. The results are shown
in Table 2 below.
EXAMPLE 5
The basic component was prepared by employing 0.96 part by mole of
BaTiO.sub.3, 0.03 part by mole of MgO, 0.02 part by mole of CaCO.sub.3,
0.01 part by mole of BaCO.sub.3, 0.015 part by mole of Y.sub.2 O.sub.3 and
0.005 part by mole of Er.sub.2 O.sub.3. To 100 parts by weight of the
basic component were added a first additive component as represented by
0.25Li.sub.2 O-0.50SiO.sub.2 -0.25BaO at the rate of 2 parts by weight of
the first additive component as well as Cr.sub.2 O.sub.3 and Al.sub.2
O.sub.3 as second additive components at the rate each of 0.1 part by
weight. A laminated ceramic capacitor was prepared in the same manner as
in Example 1. The electrical characteristics for the resulting ceramic
capacitor were measured in the same manner as in Example 1, and the
results are shown in Table 2 below.
Comparative Example 5
The first basic component was prepared by calcining 0.03 part by mole of
MgO, 0.02 part by mole of CaCO.sub.3, 0.97 part by weight of BaCO.sub.3,
0.96 part by mole of TiO.sub.2, 0.015 part by weight of Y.sub.2 O.sub.3
and 0.005 part by mole of Er.sub.2 O.sub.3 at 1,200 To 98 parts by mole of
the first basic component were added 2 parts by weight of a first additive
component as represented by 0.25Li.sub.2 O-0.50SiO.sub.2 -0.25BaO as well
as 0.1 part by weight of Cr.sub.2 O.sub.3 and 0.9 part by weight of
Al.sub.2 O.sub.3, each serving as second additive components. Then, a
slurry was prepared by mixing the mixture of the basic component and the
additive components with an organic binder. A laminated ceramic capacitor
was prepared from the resulting slurry in the same manner as in Example 1
and measured for its electrical characteristics in the same manner as in
Example 1. The results are shown in Table 2 below.
TABLE 1
__________________________________________________________________________
Basic Components
Rates of First Component (in mole)
Composition Formula
BaTiO.sub.3
MO R.sub.2 O.sub.3
BaO
TiO.sub.2
__________________________________________________________________________
Example 1
0.98{(Ba.sub.0.96 Mg.sub.0.05 Zn.sub.0.01)O.sub.1.02
0.96 MgO
0.05
Ho.sub.2 O.sub.3
0.005
-- 0.03
(Ti.sub.0.99 Ho.sub.0.01)O.sub.1.995 } + 0.02 CaZrO.sub.3
ZnO
0.01
Comparative -- MgO
0.05
Ho.sub.2 O.sub.3
0.005
0.96
0.99
Example 1 ZnO
0.01
Example 2
(Ba.sub.0.96 Mg.sub.0.03 Zn.sub.0.01 Ca.sub.0.01 Sr.sub.0.01)O.sub.
1.02 - 0.96 MgO
0.03
Er.sub.2 O.sub.3
0.01
-- 0.02
(Ti.sub.0.98 Er.sub.0.02)O.sub.1.99
ZnO
0.01
CaO
0.01
SrO
0.01
Comparative -- MgO
0.03
Er.sub.2 O.sub.3
0.01
0.96
0.98
Example 2 ZnO
0.01
CaO
0.01
SrO
0.01
Example 3
0.98{(Ba.sub.0.99 Mg.sub.0.005 Sr.sub.0.005)O.sub.1.00
0.98 MgO
0.005
Yb.sub.2 O.sub.3
0.01
0.01
--
(Ti.sub.0.98 Yb.sub.0.02)O.sub.1.99 } + 0.02 BaZrO.sub.3
SrO
0.005
Comparative -- MgO
0.005
Yb.sub.2 O.sub.3
0.01
0.99
0.98
Example 3 SrO
0.005
Example 4
0.98{(Ba.sub.0.99 Ca.sub.0.025 Sr.sub.0.005)O.sub.1.02
0.99 CaO
0.025
Dy.sub.2 O.sub.3
0.005
-- --
(Ti.sub.0.99 Dy.sub.0.01)O.sub.1.995 } + 0.02 CaZrO.sub.3
SrO
0.005
Comparative -- CaO
0.025
Dy.sub.2 O.sub.3
0.005
0.99
0.99
Example 4 SrO
0.005
Example 5
(Ba.sub.0.97 Mg.sub.0.03 Ca.sub.0.02)O.sub.1.02 -
0.96 MgO
0.03
Y.sub.2 O.sub.3
0.015
0.01
--
(Ti.sub.0.96 Y.sub.0.03 Er.sub.0.01)O.sub.1.98
CaO
0.02
Er.sub.2 O.sub.3
0.005
Comparative -- MgO
0.03
Y.sub.2 O.sub.3
0.015
0.97
0.96
Example 5 CaO
0.02
Er.sub.2 O.sub.3
0.005
__________________________________________________________________________
Additive Components
First Second
Part by Weight
Composition Ratio (by mole)
Part by Weight
__________________________________________________________________________
Example 1
2 0.20 Li.sub.2 O--0.60 SiO.sub.2 --0.04 SrO--0.10 MgO--0.06
ZnO --
Comparative
2 0.20 Li.sub.2 O--0.60 SiO.sub.2 --0.04 SrO--0.10 MgO--0.06
ZnO --
Example 1
Example 2
2 0.30 Li.sub.2 O--0.45 SiO.sub.2 --0.25 SrO
--
Comparative
2 0.30 Li.sub.2 O--0.45 SiO.sub.2 --0.25 SrO
--
Example 2
Example 3
0.5 0.20 B.sub.2 O.sub.3 --0.50 SiO.sub.2 --0.30
--O
Comparative
0.5 0.20 B.sub.2 O.sub.3 --0.50 SiO.sub.2 --0.30
--O
Example 3
Example 4
2 0.10 B.sub.2 O.sub.3 --0.50 SiO.sub.2 --0.08 BaO--0.20
CaO--0.12 MgO Cr.sub.2 O.sub.3 0.1
Al.sub.2 O.sub.3 0.1
Comparative
2 0.10 B.sub.2 O.sub.3 --0.50 SiO.sub.2 --0.08 BaO--0.20
CaO--0.12 MgO Cr.sub.2 O.sub.3 0.1
Example 4 Al.sub.2 O.sub.3 0.1
Example 5
2 0.25 Li.sub.2 O-0.50 SiO.sub.2 -0.25 BaO
Cr.sub.2 O.sub.3 0.1
Al.sub.2 O.sub.3 0.9
Comparative
2 0.25 Li.sub.2 O- 0.50 SiO.sub.2 -0.25 BaO
Cr.sub.2 O.sub.3 0.1
Example 5 Al.sub.2 O.sub.3 0.9
__________________________________________________________________________
TABLE 2
__________________________________________________________________________
DC Breakdown
Dielectric
Electrical Voltage (V/.mu.m)
Constant
tan .delta.
Resistivity .rho.
.DELTA.C.sub.-55
.DELTA.C.sub.125
.DELTA.C.sub.-25
.DELTA.C.sub.85
Average
Minimum
.epsilon..sub.s
(%)
(M.OMEGA. .multidot. cm)
(%) (%) (%) (%) Value
Value
__________________________________________________________________________
Example 1
3950 1.2
5.3 .times. 10.sup.6
-10.1
3.5 -3.6
-4.2
64 55
Comparative
3890 1.0
5.6 .times. 10.sup.6
-11.0
1.3 -4.4
-4.8
61 27
Example 1
Example 2
3530 1.1
3.3 .times. 10.sup.6
-9.5
3.6 -4.5
-4.1
65 57
Comparative
3490 1.1
3.2 .times. 10.sup.6
-11.0
3.3 -5.6
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