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Claims  |
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I claim:
1. A method of removing synthetic and natural resins, other than epoxy
resins, from an article containing an epoxy resin without damage to said
epoxy resin comprising
(A) contacting the said article with a solvent having the formula
##STR3##
where n is 1 or 2, to dissolve said synthetic and natural resins into
said solvent and form a solution thereof; and
(B) separating said solution from said article.
2. A method according to claim 1 including the additional last step of
recovering said solvent from said solution.
3. A method according to claim 2 when said solvent is recovered by
evaporating said solvent using heat, a vacuum, or both heat and a vacuum.
4. A method according to claim 2 wherein said recovered solvent is recycled
to step (A).
5. A method according to claim 1 wherein said article is contacted with
said solvent in at least two stages, where the solvent used in each later
stage is used in the preceding earlier stage, and the solvent used in the
earliest stage is recovered and used in the last stage.
6. A method according to claim 1 wherein said article is selected from the
group consisting of printed circuit boards, magnetic tape, coaxial wire,
copier equipment, office machines, electronic components and equipment,
glass products, instruments and meters, jewelry, metals, medical
equipment, and plastic and rubber products.
7. A method according to claim 6 wherein said solvent is
parachlorobenzotrifluoride.
8. A method according to claim 6 wherein said solvent is
orthochlorobenzotrifluoride.
9. A method according to claim 1 wherein n is 2.
10. A method according to claim 9 wherein said solvent is
3,4-dichlorobenzotrifluoride.
11. A method according to claim 9 wherein said solvent is
2,5-dichlorobenzotrifluoride.
12. A method according to claim 1 wherein said article is a circuit board.
13. A method according to claim 1 wherein said solvent includes about 0.01
to about 1.0 wt % of a stabilizer.
14. A method according to claim 13 wherein said stabilizer is allyl
glycidyl ether.
15. A method according to claim 1 wherein said solvent includes about
0.0005 to about 1 wt % of a antioxidant.
16. A method according to claim 15 wherein said antioxidant is a hindered
phenol.
17. A method according to claim 1 wherein said solvent includes about 0.001
to about 0.1 wt % of a corrosion inhibitor.
18. A method according to claim 17 wherein said corrosion inhibitor is
ethyl morpholine.
19. A method of cleaning an article made from an epoxy resin which is
contaminated with another resin comprising
(A) placing said article in a treatment chamber;
(B) washing said article in said treatment chamber with a liquid solvent
having the formula
##STR4##
where n is 1 or 2; (C) transporting solvent used in said treatment
chamber to a solvent recovery chamber;
(D) vaporizing said solvent in said solvent recovery chamber;
(E) transporting said solvent vapors to a condenser; and
(F) condensing said solvent vapors in said condensor to form a liquid
solvent.
20. A method according to claim 19 wherein said article is a circuit board. |
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Claims  |
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Description  |
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BACKGROUND OF INVENTION
This invention relates to a method of cleaning articles that contain an
epoxy resin. In particular, it relates to a method of removing undesirable
synthetic and natural resins from those articles without dissolving the
epoxy resin.
In the electronics industry, circuit boards are used that are made from
epoxy resins. When components are mounted on the boards, rosins used as
solder fluxes contaminate the surfaces of the board. Other synthetic and
natural resins are used as adhesives, and they also end up as undesirable
substances on the board. In addition, the board can be contaminated by
human contact and by particles and gases from the air. In order to
preserve the electrical properties of the board, it is necessary to remove
these contaminants without damaging the board itself. This is accomplished
by cleaning the board with a solvent that readily dissolves most synthetic
and natural resins, but does not dissolve or attack the epoxy resin from
which the board is constructed.
Until recently, trichlorotrifluoroethane was used for this purpose because
it is a good solvent for most resins but does not attack epoxy resins.
However, trichlorotrifluoroethane persists in the atmosphere and has been
implicated in the depletion of the ozone layer. For this reason, its use
has been restricted and it may be prohibited entirely within a few years.
Efforts are being made to identify other solvents with the same desirable
properties but which will not affect the ozone layer.
SUMMARY OF INVENTION
I have discovered that certain chlorinated benzotrifluoride compounds are,
like trichlorotrifluoroethane, good solvents for many natural and
synthetic resins, yet are very poor solvents for epoxies. This was an
unexpected discovery because aromatic compounds are usually very good
solvents and chlorinated aromatic compounds are especially good solvents.
Thus, it was surprising to find that these compounds do not dissolve epoxy
resins.
However, unlike trichlorotrifluoroethane, the chlorinated benzotrifluoride
compounds of this invention are not expected to attack the ozone layer.
Because about two years are required for a solvent released on the ground
to reach the ozone layer in the stratosphere, and the solvents of this
invention have an atmospheric life in the troposphere of only about sixty
days, they should not be ozone depleters.
DESCRIPTION OF THE INVENTION
The solvents used in the process of this invention have the general
formula:
##STR2##
where n is 1 or 2. Monochlorobenzotrifluoride compounds (n=1) are
preferred for applications requiring high solvent volatility, and
dichlorobenzotrifluoride compounds (n=2) are preferred for applications
requiring a high flash point. A high volatility is desirable when it is
desirable to rapidly evaporate the solvent after it is used. The flash
point is the temperature above which combustion over a liquid can occur; a
high flash point is desirable in applications where flammability may be a
problem.
Of the three monochlorobenzotrifluoride isomers, ortho
chlorobenzotrifluoride and parachlorobenzotrifluoride (PCBTF) are
preferred because the ortho isomer can be easily made from
orthochlorotoluene and the para isomer is already commercially available.
All the isomers can be obtained by chlorinating benzotrifluoride and
separating them from the resulting mixture. Of the seven
dichlorobenzotrifluoride (DCBTF) isomers, 3,4-dichlorobenzotrifluoride
(3,4-DCBTF) is preferred because it is already a commercial product and
2,5-dichlorobenzotrifluoride is preferred because it can readily be
obtained by chlorinating orthochlorobenzotrifluoride. The other
dichlorobenzotrifluoride isomers can be obtained by chlorinating
benzotrifluoride or a monochlorobenzotrifluoride.
The solvents can be used in a pure form or they can be mixed with various
optional components to preserve or enhance their properties. For example,
about 0.01 to about 1.0 wt % (based on total composition weight) of a
stabilizer can be included with the solvent to trap decomposition products
that may catalyze the decomposition of the solvent. Stabilizers include
compounds such as epoxides, glycidyl ethers, and diepoxides. The preferred
stabilizer is allyl glycidyl ether because it is available and its boiling
point is close to the boiling point of the solvents.
About 0.0005 to about 0.1 wt % of an antioxidant can be included in the
solvent to act as a free radical inhibitor by scavenging free radicals
such as monoatomic oxygen. Examples of antioxidants include hindered
phenols such as thymol, hydroquinone monomethyl ether, and tertiary amyl
phenol. Other examples of antioxidants include nitrogen ring compounds
such as N-methyl pyrolle. Hindered phenols are preferred due to their low
cost and availability.
About 0.001 to about 0.1 wt % of a corrosion inhibitor can be included in
the solvent to prevent it from attacking various metals with which it
comes into contact. Examples of corrosion inhibitors include acetates,
glycol ethers, imidazoles, and amines, such as ethyl morpholine and methyl
morpholine. The preferred corrosion inhibitor is ethyl morpholine because
of its good performance and availability.
The addition of about 0.5 to about 10.0 wt % of an oxygenated solvent such
as an alcohol, ketone, glycol or glycol ether to the
chlorobenzotrifluoride solvent may be desirable to improve the cleaning of
ionic contaminants from solder fluxes. Examples of useful oxygenated
solvents include amyl alcohol, butyl alcohol, hexyl alcohol, amyl acetate,
butyl acetate, propylene glycol mono methyl ether, propylene glycol ether
acetate, and/or propylene glycol methyl ether acetate. The selection of a
specific oxygenated solvent is based on cleaning performance,
recoverability with the chlorobenzotrifluoride solvent, and cost.
The chlorobenzotrifluorides can also be combined with water and an anionic
surfactant to form an emulsion or a semi-aqueous cleaner. These cleaners
offer solvent power for a specific cleaning job, but are less flammable
and less expensive because they contain water. Useful surfactants include
a C.sub.10 to C.sub.14 sulfated or sulfonated anionic surfactant such as
sodium dodecyl benzene sulfonate, ammonium salts of a sulfonated C.sub.10
to C.sub.14 alcohol-ethylene oxide condensation product, and the ammonium
salt of the sulfated condensation product of ethylene oxide and dodecanol.
A preferred composition is about 0.5 to about 10 wt % of the
chlorobenzotrifluoride, about 0.5 to about 10 wt % anionic surfactant, and
the balance water. See U.S. Pat. No. 3,835,070, herein incorporated by
reference, for additional details.
Any article that contains an epoxy resin and is contaminated with a
synthetic or natural resin can be cleaned using the process of this
invention. Such articles include printed circuit boards, magnetic tape,
coaxial wire, copier equipment, office machines, electronic components and
equipment, glass products, instruments and meters, jewelry, metals,
medical equipment, and plastic and rubber products.
In the cleaning process of this invention, the contaminated article is
contacted or washed with the chlorinated benzotrifluoride solvent. Washing
is typically done for about 30 to about 60 seconds at room temperature.
One part can be washed by itself or many parts can be washed together. The
amount of solvent used depends upon the shape of the parts and the number
of parts and the type and amount of contaminant. The contaminants dissolve
in the solvent and the solution of the contaminants, carrying entrained
soil particles, is separated from the article. Recovery of the solvent
from the solution is accomplished by evaporating the solvent and
condensing its vapors. In practice, an article to be cleaned is washed in
stages with the used solvent from the later stages being reused in the
earlier stages. The solvent used in the earliest stage is recovered and is
recycled back to the last stage. Because the solvents of this invention
are expensive and are combustible, they are preferably used in a closed
system and are recovered after use. Such a closed system would include a
treatment chamber where the parts to be cleaned are washed with the
solvent, and a separate solvent recovery chamber where the solvent is
evaporated to recover it. Evaporation can be accomplished by heating, such
as by infrared light, or by vacuum, or a combination of heat and vacuum.
The solvent vapors are passed to a condensor where the solvent is
condensed back to a liquid. The cleaning of articles can be accomplished
in either a batch or a continuous process.
The following example further illustrates this invention.
EXAMPLE
Using ASTM Test D1545-89, the solubility of various resins in a variety of
solvents was determined. The kinematic viscosity (in centipoises) was also
determined at the solubility limit. The resins tested were those commonly
used as industrial adhesives. The solvents tested were PCBTF and
3,4-DCBTF, which are within the scope of this invention, and a blend of 20
vol % PCBTF--50 vol % orthochlorotoluene (OCT)--30 vol % perchloroethylene
(PCE) ("20--50--30"), a blend of 50 vol % PCBTF--50 vol % OCT
("50--50--0"), a blend of 30 vol % PCBTF--20 vol % OCT--50 vol %
perchloroethylene ("30--20--50"), and OCT. The following table gives the
wt % solubility (the number in parenthesis is the viscosity).
__________________________________________________________________________
Volume % PCBTF-OCT-PCE
Type of Resin 20-50-30
50-50-0
30-20-50
OCT PCBTF
3,4-DCBTF
__________________________________________________________________________
DOW D.E.R. 661R 50 53 56 65 <3 <3
(Epoxy) (2831)
(1901)
(5740)
(7040)
-- --
AMOCO INDOPOL H100
>70 >70 >70 >70 >70 >70
(Polybutenes)
Durez Resin 29095
58 60 54 65 53 45
(Phenolic) (1624)
(2662)
(1426)
(6600)
(1332)
(154)
Goodyear Wingtack Extra
65 61 64 70 58 53
(Polyterpene Hydrocarbon)
(3131)
(776)
(4067)
(6710)
(384)
(373)
Goodyear Vitel PE 200
36 42 40 40 31 25
(Phthalate Ester)
(19572)
(34197)
(100407)
-- (9948)
(12580)
Goodyear Vitel PE 307
38 39 37 40 34 26
(Phthalate Ester)
(14699)
(24621)
(20511)
(13310)
(8617)
(4422)
Hercules Staybelite Ester 10
67 69 67 75 60 55
(Hydrogenated Rosin Glyceride)
(1365)
(2530)
(1947)
(4180)
(502)
(221)
Monsanto Gelva GMS 788
>70 >70 >70 >70 >70 >70
(Acrylate Copolymers In Solvent)
Shell Krayton D 1107P
38 27 30 30 32 31
(Styrene Rubber Block Polymers)
(4620)
(18720)
(5068)
(7920)
(31900)
(59249)
__________________________________________________________________________
The table shows that PCBTF and 3,4DCBTF dissolved less than 3 wt % of the
epoxy resin (3 wt % was the limit of the accuracy of the test), while the
epoxy resin was very soluble in the other solvents tested. The table also
shows that the other resins tested are nearly as soluble in PCBTF and
3,4DCBTF as they are in the other solvents tested.
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Description  |
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