Apparatus for handling devices under varying temperatures

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BACKGROUND

The present invention generally relates to devices for handling devices under test, such as integrated circuit packages, particularly to devices for handling such devices for testing under varying temperature conditions.

Integrated circuits are tested electrically and under specific thermal conditions to determine the reliability of such circuits. Such testing has been accomplished by a variety of ways. One prior method was thermal forcing systems which could be cumbersome, inconvenient, and tedious. Another previous method utilized was pick and place handlers which were inefficient and relatively expensive and thus were economically justifiable in only limited circumstances.

SUMMARY

It is thus an object of the present invention to provide a unique apparatus for handling devices such as integrated circuit packages for testing thereof. In a first aspect of the present invention, the apparatus is constructed to accommodate just about any size test head and to conform to a wide range of test head heights for easy docking and undocking. Further, the apparatus is of a compact size so it does not take up much space and also has easy mobility allowing it to pass through congested areas to the test location.

In a further object of the present invention, the apparatus provides fast changeover if testing of different devices having different package constructions is desired. In an aspect of the present invention, the conversion of the apparatus to handle a different device package requires minimal part replacement and provides rapid self alignment.

In a further object of the present invention, the apparatus provides thermally conditioned gas to the thermal socket removably holding the device under test and which is rotatable and reciprocal. In an aspect of the present invention, a thermal tube is reciprocal and movable with the thermal socket and does not rely upon flexibility or bending material characteristics to allow fluid communication of thermally conditioned gas having a wide temperature range such as from -60.degree. C. to 165.degree. C.

In yet another object of the present invention, the apparatus directs the thermally conditioned gas in a manner to rapidly heat and cool the device under test to the set point temperature without exposing the device under test to extreme gas temperatures and without subjecting the test head to harsh temperatures.

In another object of the present invention, the apparatus monitors and controls the die or core temperature of the device under test to insure that thermal conditioning is both fast and accurate over the testing temperature range. In this regard, the exterior package temperature is measured and compared to the temperature at a known thermally spaced location to determine the core temperature based upon heat flow through a temperature sensing loop.

The present invention will become clearer in light of the following detailed description of an illustrative embodiment of this invention described in connection with the drawings.

DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of an apparatus for handling integrated circuit packages according to the preferred teachings of the present invention, with portions being shown in phantom to expose interior components.

FIG. 2 shows a partial, top view of the apparatus of FIG. 1, with portions being broken away to expose interior components and with portions being shown in phantom to show alternate positions.

FIG. 3 shows a partial, exploded view of the insert arm of the apparatus of FIG. 1, with portions being shown in phantom to expose constructional details.

FIG. 4 shows a partial, cross-sectional view of the apparatus of FIG. 1 according to section line 4--4 of FIG. 3.

FIG. 5 shows a partial, cross-sectional view of the apparatus of FIG. 1 according to section line 5--5 of FIG. 2, with portions being exploded to expose constructional details.

FIG. 6 shows a diagramatic view of the thermal model of the temperature monitoring and controlling system of the apparatus of FIG. 1.

All figures are drawn for ease of explanation of the basic teachings of the present invention only; the extensions of the Figures with respect to number, position, relationship, and dimensions of the parts to form the preferred embodiment will be explained or will be within the skill of the art after the following teachings of the present invention have been read and understood. Further, the exact dimensions and dimensional proportions to conform to specific force, weight, strength, and similar requirements will likewise be within the skill of the art after the following teachings of the present invention have been read and understood.

Where used in the various figures of the drawings, the same numerals designate the same or similar parts. Furthermore, when the terms "top", "first", "second", "vertical", "horizontal", "end", "side", and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention.

DESCRIPTION

Apparatus for handling devices such as integrated circuit packages, computer chips, or the like according to the preferred teachings of the present invention is shown in the drawings and generally designated 10. Generally, apparatus 10 includes a body 12 including a platform portion 14 and a control portion 16. In the most preferred form, body 12 is generally rectangu