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Apparatus for handling devices under varying temperatures    

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United States Patent5263775   
Link to this pagehttp://www.wikipatents.com/5263775.html
Inventor(s)Smith; Nathan R. (Stillwater, MN); Schmitt; Steven E. (Stillwater, MN)
AbstractApparatus (10) for handling devices for testing under varying temperature conditions is disclosed including a mechanical arm (32) pivotally mounted by a bearing (34) to a control portion (16) which is variably vertically positionable relative to a platform portion (14). An insert arm (38) is rotatably mounted within the mechanical arm (32) to reciprocally and rotatably mount a thermal socket (90) for mating with a contactor (126). The socket (90) is mounted to a vacuum cup (48) to allow position alignment as alignment pins (132) are initially slideably received in alignment notches (124) and when no vacuum is applied and is fixed in the aligned position after the application of vacuum. Thermal tubes (74) of probes (50) are reciprocal with the thermal socket (90) to provide thermally conditioned gas/air to the thermal socket (90). The thermal socket (90) provides a swirling action to the thermally conditioned gas/air to exit 360.degree. around a vacuum cup (112) holding the device in the thermal socket (90) for circulating the thermally conditioned gas/air across the top and past the leads of the device. The apparatus (10) monitors and controls the device core temperature by measuring the temperature of the bottom of the device and of a thermally spaced location of a pedestal (144) abutting the bottom of the device and determining the rate of heat flow through a temperature sensing loop.
   














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Drawing from US Patent 5263775
Apparatus for handling devices under varying temperatures - US Patent 5263775 Drawing
Apparatus for handling devices under varying temperatures
Inventor     Smith; Nathan R. (Stillwater, MN); Schmitt; Steven E. (Stillwater, MN)
Owner/Assignee     Aetrium, Inc. (North St. Paul, MN)
Patent assignment
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Company News
Publication Date     November 23, 1993
Application Number     07/935,862
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     August 26, 1992
US Classification     374/134 374/112 374/178 374/208
Int'l Classification     G01K 001/16
Examiner     Cuchlinski Jr.; William A.
Assistant Examiner     Bennett; G. Bradley
Attorney/Law Firm     Peterson, Wicks, Nemer & Kamrath
Address
Parent Case     This is a divisional of copending application(s) Ser. No. 07/649,657 filed on Feb. 1, 1991, now U.S. Pat. No. 5,143,450.
Priority Data    
USPTO Field of Search     374/29 374/30 374/43 374/44 374/112 374/120 374/121 374/134 374/141 374/179 374/208 414/744.3 414/744.6 414/590 414/750 414/752 901/17
Patent Tags     handling devices under varying temperatures
   
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 Technical Review Submit all comments and votes
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What is claimed is:

1. Method of monitoring the temperature of the core of a device, with the device having a bottom, comprising the steps of: measuring the temperature of the bottom of the device; measuring the temperature at a location thermally spaced from the bottom of the device; determining the rate of the heat flow between the temperatures of the bottom of the device and the thermally spaced location; determining the thermal resistance between the core and the bottom of the device; and determining the temperature of the core of the device as a function of the rate of heat flow, the thermal resistance between the core and the bottom of the device, and the temperature of the bottom of the device.

2. The method of claim 1 wherein the device has a top; wherein a thermally conditioned gas is being directed on the top of the device; and wherein the method further comprises the step of controlling the temperature of the thermally conditioned gas as a function of the difference between the desired temperature and the actual temperature of the core of the device.

3. The method of claim 1 further comprising the step of abutting the bottom of the device with the end of a pedestal; wherein the step of measuring the temperature of the bottom of the device comprises placing a first means on the pedestal at a first location for generating a first signal as a function of the temperature of the bottom of the device; wherein the step of measuring the temperature of the thermally spaced location comprises the step of placing a second means on the pedestal at a second location spaced from the first location for generating a second signal as a function of the temperature of the pedestal at the second location.

4. The method of claim 3 wherein the step of placing a first means comprises the step of placing a first thermocouple on the pedestal at the first location; and wherein the step of placing a second means comprises the step of placing a second thermocouple on the pedestal at the second location.

5. The method of claim 2 further comprising the step of abutting the bottom of the device with the end of a pedestal; wherein the step of measuring the temperature of the bottom of the device comprises placing a first means on the pedestal at a first location for generating a first signal as a function of the temperature of the bottom of the device; wherein the step of measuring the temperature of the thermally spaced location comprises the step of placing a second means on the pedestal at a second location spaced from the first location for generating a second signal as a function of the temperature of the pedestal at the second location.

6. The method of claim 5 wherein the step of placing a first means comprises the step of placing a first thermocouple on the pedestal at the first location; and wherein the step of placing a second means comprises the step of placing a second thermocouple on the pedestal at the second location.

7. The method of claim 3 wherein the abutting step comprises the step of biasing the pedestal towards the bottom of the device to abut the bottom of the device with the end of the pedestal.

8. The method of claim 7 wherein the biasing step comprises the steps of providing a base having a bore; slideably mounting the pedestal in the bore; and biasing the pedestal outwardly in the bore of the base.

9. The method of claim 8 wherein the base-providing step comprises the step of providing a base having a shoulder; and wherein the abutting step comprises the step of providing the pedestal with an enlarged lip which engages with the shoulder of the base for retaining the pedestal in the bore of the base.

10. The method of claim 3 wherein the abutting step comprises the step of abutting the bottom of the device with a disc secured to an outside face of the pedestal; and wherein the step of placing a first means comprises the step of sandwiching a first means between the pedestal and the disc.

11. The method of claim 1 wherein the step of determining the temperature of the core comprises the step of multiplying the sum of the temperature of the bottom of the device plus the thermal resistance between the core of the device and the bottom of the device by the product of the difference between the temperatures of the bottom of the device and the location thermally spaced from the bottom of the device divided by the thermal resistance between the bottom of the device and the location thermally spaced from the bottom of the device.
 Description Submit all comments and votes
 


BACKGROUND

The present invention generally relates to devices for handling devices under test, such as integrated circuit packages, particularly to devices for handling such devices for testing under varying temperature conditions.

Integrated circuits are tested electrically and under specific thermal conditions to determine the reliability of such circuits. Such testing has been accomplished by a variety of ways. One prior method was thermal forcing systems which could be cumbersome, inconvenient, and tedious. Another previous method utilized was pick and place handlers which were inefficient and relatively expensive and thus were economically justifiable in only limited circumstances.

SUMMARY

It is thus an object of the present invention to provide a unique apparatus for handling devices such as integrated circuit packages for testing thereof. In a first aspect of the present invention, the apparatus is constructed to accommodate just about any size test head and to conform to a wide range of test head heights for easy docking and undocking. Further, the apparatus is of a compact size so it does not take up much space and also has easy mobility allowing it to pass through congested areas to the test location.

In a further object of the present invention, the apparatus provides fast changeover if testing of different devices having different package constructions is desired. In an aspect of the present invention, the conversion of the apparatus to handle a different device package requires minimal part replacement and provides rapid self alignment.

In a further object of the present invention, the apparatus provides thermally conditioned gas to the thermal socket removably holding the device under test and which is rotatable and reciprocal. In an aspect of the present invention, a thermal tube is reciprocal and movable with the thermal socket and does not rely upon flexibility or bending material characteristics to allow fluid communication of thermally conditioned gas having a wide temperature range such as from -60.degree. C. to 165.degree. C.

In yet another object of the present invention, the apparatus directs the thermally conditioned gas in a manner to rapidly heat and cool the device under test to the set point temperature without exposing the device under test to extreme gas temperatures and without subjecting the test head to harsh temperatures.

In another object of the present invention, the apparatus monitors and controls the die or core temperature of the device under test to insure that thermal conditioning is both fast and accurate over the testing temperature range. In this regard, the exterior package temperature is measured and compared to the temperature at a known thermally spaced location to determine the core temperature based upon heat flow through a temperature sensing loop.

The present invention will become clearer in light of the following detailed description of an illustrative embodiment of this invention described in connection with the drawings.

DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a perspective view of an apparatus for handling integrated circuit packages according to the preferred teachings of the present invention, with portions being shown in phantom to expose interior components.

FIG. 2 shows a partial, top view of the apparatus of FIG. 1, with portions being broken away to expose interior components and with portions being shown in phantom to show alternate positions.

FIG. 3 shows a partial, exploded view of the insert arm of the apparatus of FIG. 1, with portions being shown in phantom to expose constructional details.

FIG. 4 shows a partial, cross-sectional view of the apparatus of FIG. 1 according to section line 4--4 of FIG. 3.

FIG. 5 shows a partial, cross-sectional view of the apparatus of FIG. 1 according to section line 5--5 of FIG. 2, with portions being exploded to expose constructional details.

FIG. 6 shows a diagramatic view of the thermal model of the temperature monitoring and controlling system of the apparatus of FIG. 1.

All figures are drawn for ease of explanation of the basic teachings of the present invention only; the extensions of the Figures with respect to number, position, relationship, and dimensions of the parts to form the preferred embodiment will be explained or will be within the skill of the art after the following teachings of the present invention have been read and understood. Further, the exact dimensions and dimensional proportions to conform to specific force, weight, strength, and similar requirements will likewise be within the skill of the art after the following teachings of the present invention have been read and understood.

Where used in the various figures of the drawings, the same numerals designate the same or similar parts. Furthermore, when the terms "top", "first", "second", "vertical", "horizontal", "end", "side", and similar terms are used herein, it should be understood that these terms have reference only to the structure shown in the drawings as it would appear to a person viewing the drawings and are utilized only to facilitate describing the invention.

DESCRIPTION

Apparatus for handling devices such as integrated circuit packages, computer chips, or the like according to the preferred teachings of the present invention is shown in the drawings and generally designated 10. Generally, apparatus 10 includes a body 12 including a platform portion 14 and a control portion 16. In the most preferred form, body 12 is generally rectangu