WikiPatents - Community Patent Review
Create Free Account  |  License or Sell Your Patent  |  WikiPatents Marketplace  |  WikiPatents Blog
Username:  Password:  
    
Advanced Search
Polyamide resin composition and connector    
United States Patent5306754   
Link to this pagehttp://www.wikipatents.com/5306754.html
Inventor(s)Yamamoto; Sanehiro (Yamaguchi, JP); Sugiyama; Kazuto (Yamaguchi, JP); Toyota; Akinori (Yamaguchi, JP); Amimoto; Yoshikatsu (Yamaguchi, JP); Ikejiri; Fumitoshi (Yamaguchi, JP); Kato; Tetsuo (Haibara, JP); Kanda; Masahiro (Haibara, JP)
AbstractThe resin composition of the invention comprises as resin components specific aromatic polyamide (A), a specific graft-modified polymer (B), an aliphatic polyamide (C), and plural antioxidants comprising a hindered phenol type antioxidant (D) having a molecular weight of not less than 500 and a TGA 10% weight loss temperature of not lower than 300.degree. C. and a sulfur type antioxidant (E) having a molecular weight of not less than 600 and a TGA 10% weight loss temperature of not lower than 280.degree. C. The connector of the invention has housing formed from the above-mentioned resin composition. The resin composition of the invention shows excellent heat resistance. The connector of the invention is lightweight and is excellent in heat resistance, water resistance and chemical resistance.
   














 Title Information Submit all comments and votes
 
Patent Text Patent PDF Print Page Summary File History
Plain text PDF images Print Summary File History
Inventor     Yamamoto; Sanehiro (Yamaguchi, JP); Sugiyama; Kazuto (Yamaguchi, JP); Toyota; Akinori (Yamaguchi, JP); Amimoto; Yoshikatsu (Yamaguchi, JP); Ikejiri; Fumitoshi (Yamaguchi, JP); Kato; Tetsuo (Haibara, JP); Kanda; Masahiro (Haibara, JP)
Owner/Assignee     Mitsui Petrochemical Industries, Ltd. (Tokyo, JP); Yazaki Corporation (Tokyo, JP)
Patent assignment
All assignments
Publication Date     April 26, 1994
Application Number     08/032,864
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     March 17, 1993
US Classification     524/289 524/291 524/302 524/322
Int'l Classification     C08K 013/00
Examiner     Hoke; Veronica P.
Assistant Examiner    
Attorney/Law Firm     Sherman and Shalloway
Address
Parent Case    
Priority Data     Mar 19, 1992[JP]4-064089 Dec 25, 1992[JP]4-347189
USPTO Field of Search     525/66 525/432 524/302 524/222 524/291 524/606 524/289 528/347
Patent Tags     polyamide resin composition connector
   
Enter a comma (,) or semicolon (;) between multiple tag words/phrases.
Describe this patent:
 Amusing   
 Clever   
 Complex   
 Efficient   
 Historic   
 Important   
 Innovative   
 Interesting   
 Practical   
 Simple   
[no votes]
Patent WIKI

Share information and news about this patent, including information and news about the technology, inventors, company, ligation and licensing.

 References Submit all comments and votes
 
*references marked with an asterisk below are user-added references
 U.S. References
 
Add a new US reference:  
ReferenceRelevancyCommentsReferenceRelevancyComments
3677965



[0 after 0 votes]
3772403



[0 after 0 votes]
5216054
Iwanami
524/120
Jun,1993

[0 after 0 votes]
5183843
Sakai
524/318
Feb,1993

[0 after 0 votes]
5071924
Koch

Dec,1991

[0 after 0 votes]
4795782
Lutz
525/66
Jan,1989

[0 after 0 votes]
4576734
Ishii
252/404
Mar,1986

[0 after 0 votes]
4410661
Epstein
525/66
Oct,1983

[0 after 0 votes]
 Foreign References
 Other References
 Market Review Submit all comments and votes
   
Market Size
Estimate the gross annual revenues of the relevant market sector:
> $10B
$5B - $10B
$2B - $5B
$500M - $2B
$100M - $500M
$10M - $100M
$1M - $10M
$500K - $1M
$100K - $500K
< $100K
[No votes]
$0
 
$0   $2.5B   $5B   $7.5B   $10B
Market Share
Estimate the percentage of the relevant market sector this invention will capture:
75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
[No votes]
0.0%
 
0%   25%   50%   75%   100%
Reasonable Royalty
What percentage of gross sales should the inventor or assignee be paid?
75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
[No votes]
0.0%
 
0%   25%   50%   75%   100%
Public's "Guesstimation" of Royalty Value
Market SizeN/A[No votes]
xMarket ShareN/A[No votes]
xReasonable RoyaltyN/A[No votes]

N/A

License Availablity
If you are NOT the owner or assignee, answer here:
Yes, license is available for purchase

No, license is not currently available



[No votes]
License Availablity
If you ARE the owner or assignee, answer here:
Yes, license is available for purchase

No, license is not currently available



[No votes]
Competitive Advantage
Does this invention have a significant competitive advantage over similar technologies?
Yes

No



[No votes]
Most helpful competitive advantage comment
[No comments]

Commercial Alternatives
Are there viable commercial alternatives for this invention?
Yes

No



[No votes]
Most helpful commercial alternative comment
[No comments]

 Technical Review Submit all comments and votes
 Claims Submit all comments and votes
 


What is claimed is:

1. A polyamide resin composition comprising resin components and antioxidants,

said resin components comprising:

(A) aromatic polyamide in an amount of 50 to 85% by weight, which comprises repeating units formed from dicarboxylic acid constituent units and diamine constituent units, said dicarboxylic acid constituent units comprising 40-100% by mol of terephthalic acid constituent units, 0-50% by mol of aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and/or 0-60% by mol of aliphatic dicarboxylic acid constituent units having 4 to 20 carbon atoms, said diamine constituent units comprising aliphatic diamine constituent units and/or alicyclic diamine constituent units,

said aromatic polyamide having an intrinsic viscosity, as measured in a concentrated sulfuric acid at 30.degree. C., of 0.5 to 3.0 dl/g and a melting point of higher than 290.degree. C.;

(B) at least one modified polymer selected from the group consisting of a graft-modified .alpha.-olefin polymer, a graft-modified product of a cycloolefin copolymer which is an addition polymer of cycloolefin and ethylene, a graft-modified aromatic vinyl type hydrocarbon/conjugated diene copolymer, a hydrogenation product of this copolymer and an ethylene copolymer containing a carboxyl group and a carboxylic metal salt in the side chain, in an amount of 10 to 40% by weight, wherein said graft-modified polymers have been graft-modified with a modifier selected from the group consisting of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, an unsaturated carboxylic acid halide, an unsaturated carboxylic acid imide and an unsaturated carboxylic acid ester; and

(C) aliphatic polyamide in an amount of 1 to 15% by weight;

said antioxidants comprising:

(D) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a 10% weight loss temperature of not lower than 300.degree. C. in a thermogram measured in air; and

(E) a sulfur type antioxidant having a molecular weight of not less than 600 and a 10% weight loss temperature of not lower than 280.degree. C. in a thermogram measured in air;

wherein, the total amount of the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 0.2 to 4 parts by weight based on 100 parts by weight of the resin components, and a weight ratio between the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 1:5 to 5:1.

2. The polyamide resin composition as claimed in claim 1, said polyamide resin composition further comprising (F) graft-modified crystalline polyolefin in an amount of 1 to 20% by weight as the resin component wherein said graft-modified crystalline polyolefin has been graft-modified with a modifier selected from the group consisting of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, an unsaturated carboxylic acid halide, an unsaturated carboxylic acid imide and an unsaturated carboxylic acid ester.

3. The polyamide resin composition as claimed in claim 1 or claim 2, wherein the hindered phenol type antioxidant (D) is 3,9-bis[2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy}-1,1-dime thylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane and/or N,N'-hexamethylenebis(3,5-di-tert-butyl-4-hydroxycinnamamide).

4. The polyamide resin composition as claimed in claim 1 or claim 2, wherein the sulfur type antioxidant (E) is a compound represented by the following formula [VI]:

(R.sup.1 S--R.sup.2 --COOCH.sub.2).sub.4 C [VI]

wherein R.sup.1 is a hydrocarbon group of 3 to 20 carbon atoms, and R.sup.2 is a divalent hydrocarbon group of 1 to 5 carbon atoms.

5. The polyamide resin composition as claimed in claim 1 or claim 2, wherein the sulfur type antioxidant (E) is penta(erythrityl-tetra-.beta.-mercaptolauryl)propionate.

6. A connector having housing made of a polyamide resin composition comprising resin components and antioxidants,

said resin components comprising:

(A) aromatic polyamide in an amount of 50 to 85% by weight, which comprises repeating units formed from dicarboxylic acid constituent units and diamine constituent units, said dicarboxylic acid constituent units comprising 40-100% by mol of terephthalic acid constituent units, 0-50% by mol of aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and/or 0-60% by mol of aliphatic dicarboxylic acid constituent units having 4 to 20 carbon atoms, said diamine constituent units comprising aliphatic diamine constituent units and/or alicyclic diamine constituent units,

said aromatic polyamide having an intrinsic viscosity, as measured in a concentrated sulfuric acid at 30.degree. C., of 0.5 to 3.0 dl/g and a melting point of higher than 290.degree. C.;

(B) at least one modified polymer selected from the group consisting of a graft-modified .alpha.-olefin polymer, a graft-modified product of a cycloolefin copolymer which is an addition polymer of cycloolefin and ethylene, a graft-modified aromatic vinyl type hydrocarbon/conjugated diene copolymer, a hydrogenation product of this copolymer and an ethylene copolymer containing a carboxyl group and a carboxylic metal salt in the side chain, in an amount of 10 to 40% by weight, wherein said graft-modified polymers have been graft-modified with a modifier selected from the group consisting of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, an unsaturated carboxylic acid halide, an unsaturated carboxylic acid imide and an unsaturated carboxylic acid ester; and

(C) aliphatic polyamide in an amount of 1 to 15% by weight;

said antioxidants comprising:

(D) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a 10% weight loss temperature of not lower than 300.degree. C. in a thermogram measured in air; and

(E) a sulfur type antioxidant having a molecular weight of not less than 600 and a 10% weight loss temperature of not lower than 280.degree. C. in a thermogram measured in air;

wherein, the total amount of the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 0.2 to 4 parts by weight based on 100 parts by weight of the resin components, and a weight ratio between the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 1:5 to 5:1.

7. The connector as claimed in claim 6, wherein the polyamide resin composition further comprises (F) graft-modified crystalline polyolefin in an amount of 1 to 20% by weight as the resin component wherein said graft-modified crystalline polyolefin has been graft-modified with a modifier selected from the group consisting of an unsaturated carboxylic acid, an unsaturated carboxylic acid anhydride, an unsaturated carboxylic acid halide, an unsaturated carboxylic acid imide and an unsaturated carboxylic acid ester.

8. The connector as claimed in claim 6 or claim 7, wherein the hindered phenol type antioxidant (D) is 3,9-bis[2-{3-(3-tert-butyl-4-hydroxy-5-methylphenyl)propionyloxy}-1,1-dime thylethyl]-2,4,8,10-tetraoxaspiro[5,5]undecane and/or N,N'-hexamethylenebis(3,5-di-tert-butyl-4-hydroxycinnamamide).

9. The connector as claimed in claim 6 or claim 7, wherein the sulfur type antioxidant (E) is a compound represented by the following formula [VI]:

(R.sup.1 S--R.sup.2 --COOCH.sub.2).sub.4 C [VI]

wherein R.sup.1 is a hydrocarbon group of 3 to 20 carbon atoms, and R.sup.2 is a divalent hydrocarbon group of 1 to 5 carbon atoms.

10. The connector as claimed in claim 6 or claim 7, wherein the sulfur type antioxidant (E) is penta(erythrityl-tetra-.beta.-mercaptolauryl)propionate.
 Description Submit all comments and votes
 


FIELD OF THE INVENTION

The present invention relates to a thermoplastic resin composition of excellent heat resistance and a connector having housing formed from this thermoplastic resin composition. More particularly, the invention relates to a lightweight thermoplastic resin composition which is hardly reduced in toughness even after heating and is hardly reduced in heat resistance for a long period of time, and also relates to a connector having housing formed from this thermoplastic resin composition, particularly a connector suitable for automobile.

BACKGROUND OF THE INVENTION

Connectors used as connecting terminals of electrical circuits have been conventionally formed from thermosetting resins such as phenol resin, but in these years, thermoplastic resins having high moldability have come to be used instead of the thermosetting resins. Further, the connectors have come to be used not only under mild conditions such as conditions within OA machine, for example, as connectors of electric devices, but also under extremely severe conditions such as those within an automotive engine room. Therefore, the connectors used under the severe conditions such as those within an automotive engine room are required to have extremely high heat resistance. In addition, the connectors are required to have such new features that they are hardly changed in their properties even after repeated heating due to engine heating and that they are hardly changed in their properties even if they are brought into contact with water, oil, etc.

Furthermore, under the world-wide proposal of efficient utilization of petroleum energy, it has been studied to make more lightweight automobiles for the purpose of reducing fuel cost of automobiles and it has been also studied to develop small sized automotive parts.

As the thermoplastic resins for connectors, there have been conventionally used poypropylene (PP), aliphatic polyamide (NY) such as polycapramide (nylon 6, NY 6) or polyhexamethylene adipamide (nylon 66, NY 66), polyphenylene ether (PPE) and acrylonitrile/butadiene/styrene resin (ABS resin).

In these thermoplastic resins, PP is insufficient in heat resistance and low in rigidity as the resin for a connector used under severe conditions. Moreover, PP has such a problem that the rate of crystallization is slow. PPE has a certain level of heat resistance, but it is low in chemical resistance, particularly oil resistance, so that PPE is unsuitable as a resin for a connector used near machines such as an engine room. In addition, PPE has such a problem that the moldability thereof is bad because of its low flowability. The ABS resin is also unsuitable as a resin for a connector used under severe conditions in viewpoints of heat resistance, chemical resistance and rigidity, and additionally, it has such a problem that the moldability thereof is bad because of its low flowability.

Of the above-mentioned thermoplastic resins, the polyamide resin is relatively well balanced between the characteristics. Generally used as the polyamide resin is an aliphatic polyamide, but this aliphatic polyamide has a high water absorption rate. Therefore, a connector formed from this aliphatic polyamide varies in its dimension, electrical resistance value, etc. when the connector absorbs water. Especially when the connector is warped, the connector is unable to be connected with the device.

By the way, an aromatic polyamide is known as a polyamide other than the aliphatic polyamide. The aromatic polyamide is obtained from an aromatic dicarboxylic acid as a dicarboxylic acid component and diamine and subjecting this aromatic dicarboxylic acid and diamine to polycondensation reaction.

The aromatic polyamide has a low water absorption rate differently from the aliphatic polyamide, and hence the above-mentioned problems such as decrease of dimensional accuracy and change of electrical resistance value occurring associated with the water absorption of the connector can be solved by using the aromatic polyamide.

However, as a result of further studies on the connector formed from the aromatic polyamide in more detail, the followings have been found. That is, when the connector is exposed to a high temperature, the aromatic polyamide is sometimes thermally deteriorated, and this thermal deterioration of the aromatic polyamide causes lowering of toughness of the connector. The connector thus lowered in toughness becomes poor in stretchability, and thereby the connector is hardly connected smoothly with the device.

Particularly in these years, electrical parts such as connectors are often incorporated into a device by soldering them through an infrared reflow method. If the connector is lowered in toughness by the heat of the infrared reflowing, reduction of workability in the assembly operation of the device or lowering of durability of the device is induced. Further, especially when the connector is used under such conditions that heating and cooling are repeatedly carried out, for example, under conditions within an automotive engine room, the toughness of the connector is easily reduced.

Japanese Patent Laid-Open Publication No. 60(1985)-44362 by the present applicant describes a composition of an aromatic polyamide having improved toughness. Concretely, the composition described in this publication contains the aromatic polyamide and a modified .alpha.-olefin elastic polymer.

In the above publication, studies on heat resistance required for engineering plastic products formed from the polyamide composition by a conventional melt molding method are disclosed, but there is not taken into account any property required for the case where a product made of the polyamide composition is exposed to an extremely high temperature as in the case of a connector of automobile. Accordingly, in order to improve reliability of connectors, resin molded products should be further improved in the long-term heat resistance.

For improving heat resistance of polyamide, there is known a method of adding various stabilizers to the polyamide, as well as the method of adding other resins to the polyamide. For example, Japanese Patent Laid-Open Publications No. 2(1990)-212533, No. 2(1990)-214752, No. 2(1990)-173059 and No. 62(1987)-273256 disclose a polyamide resin composition comprising a specific phenol type stabilizer, a specific sulfur type stabilizer and a specific phosphorus type stabilizer and an aliphatic polyamide such as polyamide 66 or polyamide(.epsilon.-caprolactam)/66. The aliphatic polyamide is used as the polyamide and the melting point of the aliphatic polyamide is much lower than that of the aromatic polyamide. Therefore, molded products formed from the compositions comprising the aliphatic polyamide and the stabilizers as described in the above publications exhibit excellent properties. However, if the aromatic polyamide is used instead of the aliphatic polyamide in the composition, foaming of the stabilizers is brought about during the preparation of a composition or the molding procedure of the composition, since the melting point of the aromatic polyamide is high.

Japanese Patent Laid-Open Publication No. 57(1982)-123254 discloses a composition comprising a polyamide, a specific phenol type stabilizer, a specific sulfur type stabilizer and a copper compound. In this composition, the copper compound is used as an essential component to exhibit sufficient thermal aging resistance, and hence the composition can be enhanced in heat stability when the copper compound is used in combination with the specific phenol type stabilizer and the specific sulfur type stabilizer. However, the composition sometimes suffers evil effects of metal caused by the copper compound which is added as the stabilizer. Especially when the composition is contaminated with metallic copper liberated from the copper compound, electrical properties of the resin sometimes vary, and the resin having such variability of electrical properties should not be used as a connector. Further, this resin composition also has such a problem that foaming is brought about during the preparation of the composition or the molding procedure thereof, similarly to the above-mentioned case. In other words, formulation of stabilizers having been conventionally applied to the aliphatic polyamide is not always satisfactory for the aromatic polyamide.

OBJECT OF THE INVENTION

It is an object of the present invention to provide a thermoplastic resin composition suitable for a lightweight molded product having high impact strength and heat resistance, particularly suitable for a connector.

It is another object of the present invention to provide a connector having housing formed from the above-mentioned resin composition, said connector being excellent in heat resistance.

It is a further object of the present invention to provide a thermoplastic resin composition capable of forming a molded product excellent in heat resistance, toughness, low water absorption properties and thermal aging resistance, said resin composition being free from foaming during the preparation of the composition and the processing procedure such as a molding procedure of the composition, having no evil effects of metal, and being free from gas burning during the molding procedure.

It is a still further object of the present invention to provide a connector having housing formed from the above-mentioned resin composition, said connector being excellent in heat resistance.

SUMMARY OF THE INVENTION

The polyamide resin composition of the present invention is a polyamide resin composition containing resin components and antioxidants,

said resin components comprising:

(A) aromatic polyamide in an amount of 50 to 85% by weight, which comprises repeating units formed from dicarboxylic acid constituent units and diamine constituent units, said dicarboxylic acid constituent units comprising 40-100% by mol of terephthalic acid constituent units, 0-50% by mol of aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and/or 0-60% by mol of aliphatic dicarboxylic acid constituent units having 4 to 20 carbon atoms, said diamine constituent units comprising aliphatic diamine constituent units and/or alicyclic diamine constituent units,

said aromatic polyamide having an intrinsic viscosity, as measured in a concentrated sulfuric acid at 30.degree. C., of 0.5 to 3.0 dl/g and a melting point of higher than 290.degree. C.;

(B) at least one modified polymer selected from the group consisting of a graft-modified .alpha.-olefin polymer, a graft-modified product of a cycloolefin copolymer which is an addition polymer of cycloolefin and ethylene, a graft-modified aromatic vinyl type hydrocarbon/conjugated diene copolymer, a hydrogenation product of this copolymer and an ethylene copolymer containing a carboxyl group and a carboxylic metal salt in the side chain, in an amount of 10 to 40% by weight; and

(C) aliphatic polyamide in an amount of 1 to 15% by weight;

said antioxidants comprising:

(D) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a 10% weight loss temperature of not lower than 300.degree. C. in a thermogram measured in air; and

(E) a sulfur type antioxidant having a molecular weight of not less than 600 and a 10% weight loss temperature of not lower than 280.degree. C. in a thermogram measured in air;

wherein, the total amount of the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 0.2 to 4 parts by weight based on 100 parts weight of the resin components, and a weight ratio between the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 1:5 to 5:1.

The connector of the present invention is a connector having housing made of a polyamide resin composition containing resin components and antioxidants,

said resin components comprising:

(A) aromatic polyamide in an amount of 50 to 85% by weight, which comprises repeating units formed from dicarboxylic acid constituent units and diamine constituent units, said dicarboxylic acid constituent units comprising 40-100% by mol of terephthalic acid constituent units, 0-50% by mol of aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and/or 0-60% by mol of aliphatic dicarboxylic acid constituent units having 4 to 20 carbon atoms, said diamine constituent units comprising aliphatic diamine constituent units and/or alicyclic diamine constituent units,

said aromatic polyamide having an intrinsic viscosity, as measured in a concentrated sulfuric acid at 30.degree. C., of 0.5 to 3.0 dl/g and a melting point of higher than 290.degree. C.;

(B) at least one modified polymer selected from the group consisting of a graft-modified .alpha.-olefin polymer, a graft-modified product of a cycloolefin copolymer which is an addition polymer of cycloolefin and ethylene, a graft-modified aromatic vinyl type hydrocarbon/conjugated diene copolymer, a hydrogenation product of this copolymer and an ethylene copolymer containing a carboxyl group and a carboxylic metal salt in the side chain, in an amount of 10 to 40% by weight; and

(C) aliphatic polyamide in an amount of 1 to 15% by weight;

said antioxidants comprising:

(D) a hindered phenol type antioxidant having a molecular weight of not less than 500 and a 10% weight loss temperature of not lower than 300.degree. C. in a thermogram measured in air; and

(E) a sulfur type antioxidant having a molecular weight of not less than 600 and a 10% weight loss temperature of not lower than 280.degree. C. in a thermogram measured in air;

wherein, the total amount of the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 0.2 to 4 parts by weight based on 100 parts weight of the resin components, and a weight ratio between the hindered phenol type antioxidant (D) and the sulfur type antioxidant (E) is in the range of 1:5 to 5:1.

As described above, the polyamide resin composition of the invention comprises at least three kinds of resin components, a specific hindered phenol type antioxidant and a specific sulfur type antioxidant, and hence the resin composition has extremely high heat stability. Particularly, since no foaming takes place in the process for preparing the resin composition of the invention and the process for preparing a molded product from the resin composition, a molded product almost free from defects and having high accuracy can be prepared from the composition. Further, the resin composition of the invention contains no metal compound, so that any evil effect of metal is not brought about.

The connector of the present invention has housing made of at least three kinds of resin components, a specific hindered phenol type antioxidant and a specific sulfur type antioxidant as described above, and hence the connector has a low specific gravity and is lightweight. Moreover, the connector of the invention shows extremely high heat resistance and is hardly reduced in toughness even when exposed to a high temperature for a long period of time.

BRIEF DESCRIPTION OF THE DRAWING

FIG. 1 is a perspective view showing one example of female housing of a connector according to the present invention.

FIG. 2 is a perspective view showing one example of male housing of a connector according to the present invention.

FIG. 3 is a schematic sectional view of a connector according to the present invention.

DETAILED DESCRIPTION OF THE INVENTION

The polyamide resin composition and the connector according to the present invention are described in detail hereinafter.

First, the polyamide resin composition of the invention is described below.

The polyamide resin composition of the invention comprises at least three kinds of resin components, namely, a specific aromatic polyamide (A), a specific graft-modified polymer (B) and an aliphatic polyamide (C), and a specific hindered phenol type antioxidant (D) and a specific sulfur type antioxidant (E), all described below.

The aromatic polyamide (A) for the polyamide resin composition of the invention comprises a specific dicarboxylic acid constituent unit [a] and a specific aliphatic diamine constituent unit or a specific alicyclic diamine constituent unit [b].

The specific dicarboxylic acid constituent unit [a] for the polyamide has a terephthalic acid constituent unit (a-1) as an essential constituent unit. The repeating unit having the terephthalic acid constituent unit (a-1) can be represented by the following formula [I-a]. ##STR1## wherein R.sup.1 is a divalent aliphatic or alicyclic hydrocarbon group, preferably an alkylene group of 4 to 18 carbon atoms.

All of the dicarboxylic acid constituent units [a] are not necessarily constituent units represented by the above formula [I-a], and a part of the above-mentioned terephthalic acid constituent units (a-1) may be other dicarboxylic acid constituent units.

The dicarboxylic acid constituent units other than terephthalic acid constituent units include (a-2) aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units and (a-3) aliphatic dicarboxylic acid constituent units.

Examples of the aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units (a-2) include an isophthalic acid constituent unit, a 2-methylterephthalic acid constituent unit and a naphthalene dicarboxylic acid constituent unit. When the aromatic polyamide for forming the composition of the invention contains constituent unit derived from other aromatic dicarboxylic acids than the terephthalic acid, the isophthalic terephthalic acid constituent unit is particularly preferably used as this constituent unit (a-2).

Among from the aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units (a-2), the repeating unit having this preferred isophthalic acid constituent unit can be represented by the following formula [I-b]. ##STR2## wherein R.sup.1 is a divalent aliphatic or alicyclic hydrocarbon group, preferably an alkylene group of 4 to 18 carbon atoms.

The aliphatic dicarboxylic acid constituent unit (a-3) is derived from an aliphatic dicarboxylic acid having an alkylene group of generally 4 to 20 carbon atoms, preferably 6 to 12 carbon atoms. Examples of the aliphatic dicarboxylic acids employable for deriving the aliphatic dicarboxylic acid constituent unit (a-3) include succinic acid, adipic acid, azelaic acid and sebacic acid.

When the polyamide has the aliphatic dicarboxylic acid constituent unit, particularly preferred as this constituent unit are an adipic acid constituent unit and a sebacic acid constituent unit.

The repeating unit having the aliphatic dicarboxylic acid constituent unit (a-3) for the dicarboxylic acid constituent unit [a] can be represented by the following formula [II]. ##STR3## wherein R.sup.1 has the same meaning as defined above, and n is an integer of generally 2 to 18, preferably 4 to 10.

The diamine constituent units [b] for forming the aromatic polyamide together with the above-mentioned dicarboxylic acid constituent units [a] can be derived from aliphatic alkylenediamine of 4 to 18 carbon atoms and alicyclic diamine.

Concrete examples of the aliphatic alkylenediamine include 1,4-diaminobutane, 1,6-diaminohexane, trimethyl-1,6-diaminohexane, 1,7-diaminoheptane, 1,8-diaminooctane, 1,9-diaminononane, 1,10-diaminodecane, 1,11-diaminoundecane and 1,12-diaminododecane. A concrete example of the alicyclic diamine is diaminocyclohexane.

Particularly preferred as the diamine constituent units in the invention are those derived from straight-chain aliphatic alkylenediamine. As the straight-chain aliphatic alkylenediamine, 1,6-diaminohexane, 1,8-diaminooctane, 1,10-diaminodecane and 1,12-diaminododecane are preferred. Also preferred are mixtures of those alkylenediamines. Of these, 1,6-diaminohexane is particularly preferred.

A content of the terephthalic acid constituent units (a-1) in all of the dicarboxylic acid constituents (100% by mol) for the aromatic polyamide (A) used in the invention is in the range of 40 to 100% by mol, preferably 45 to 100% by mol, more preferably 50 to 100% by mol, most preferably 50 to 80% by mol, and the total content of the aromatic dicarboxylic acid constituent units other than terephthalic acid constituent units (a-2) and/or the aliphatic dicarboxylic acid constituent units (a-3) is in the range of 0 to 65% by mol, preferably 0 to 60% by mol, more preferably 0 to 50% by mol, most preferably 0 to 30% by mol. A content of the aliphatic dicarboxylic acid constituent units (a-3) is generally in the range of 0 to 50% by mol, preferably 1 to 45% by mol.

The aromatic polyamide (A) may contain constituent units derived from tribasic or more basic polyvalent carboxylic acid such as trimellitic acid or pyromellitic acid in a small amount, in addition to the above-mentioned aromatic dicarboxylic acid constituent units, namely, the terephthalic acid constituent units which are host constituent units, the constituent units derived from divalent aromatic dicarboxylic acids other than the terephthalic acid (typically isophthalic acid constituent units) and the aliphatic dicarboxylic acid constituent units. The constituent units derived from the polyvalent carboxylic acid are contained in the aromatic polyamide (A) for the composition of the invention in an amount of 0 to 5% by mol.

The aromatic polyamide (A) used for the composition of the invention may be a mixture of aromatic polyamide mainly comprising the repeating units represented by the aforementioned formula [I-a] and aromatic polyamide mainly comprising the repeating units represented by the aforementioned formula [I-b]. In this case, a content of the aromatic polyamide mainly comprising the repeating units represented by the formula [I-a] is usually not less than 50% by weight, preferably not less than 60% by weight.

The aromatic polyamide (A) has an intrinsic viscosity [.eta.], as measured in a concentrated sulfuric acid at 30.degree. C., of usually 0.5 to 3.0 dl/g, preferably 0.5 to 2.8 dl/g, more preferably 0.6 to 2.5 dl/g. This aromatic polyamide (A) shows a melting point higher than that of aliphatic polyamide conventionally used. In detail, the aromatic polyamide (A) used in the invention has a melting point of higher than 290.degree. C. A composition comprising the aromatic polyamide having a melting point of preferably not lower than 300.degree. C., more preferably in the range of 305.degree. to 340.degree. C., particularly preferably in the range of 310.degree. to 340.degree. C., is prominently excellent in the heat resistance. Further, the aromatic polyamide generally has a glass transition temperature of not lower than 80.degree. C. at its non-crystalline portion. A resin composition comprising the aromatic polyamide having a melting point and a glass transition temperature at the non-crystalline portion in the above ranges hardly becomes molten even when a molded product formed from the composition is exposed to a high temperature. Moreover, since the above-mentioned aromatic polyamide is excellent in moldability, a molded product can be easily prepared by using this aromatic polyamide. Furthermore, since this aromatic polyamide has a glass transition temperature of not lower than 80.degree. C. at the non-crystalline portion as described above, a dimensional change of a molded product formed from the aromatic polyamide hardly takes place even when the molded product is exposed to a high temperature.

The aromatic polyamide shows a low value with respect to the water absorption, the water absorption properties being a problem for the conventional aliphatic polyamide.

It is necessary that the aromatic polyamide (A) is contained in the resin components of the polyamide resin composition of the invention in an amount of 50 to 85% by weight. Especially when the amount of the aromatic polyamide (A) is 66 to 84% by weight, preferably 67 to 83% by weight, more preferably 69 to 81 by weight, particularly preferably 70 to 80% by weight, there can be obtained a composition capable of forming a molded product which has well balanced various properties such as heat resistance, low water absorption properties and toughness.

The polyamide resin composition of the invention comprises at least one modified polymer (B) selected from the group consisting of a graft-modified .alpha.-olefin polymer (B-1), a graft-modified product of a cycloolefin copolymer obtained by addition polymerization of cycloolefin with ethylene (B-2), a graft-modified aromatic vinyl type hydrocarbon/conjugated diene copolymer or a hydrogenation product of this copolymer (B-3) and an ethylene copolymer containing a carboxyl group and a carboxylic metal salt in the side chain (B-4).

The graft-modified .alpha.-olefin polymer (B-1) used as the modified polymer (B) in the invention is a graft-modified .alpha.-olefin random elastic copolymer having low-crystalline to non-crystalline properties.

The graft-modified .alpha.-olefin random elastic copolymer (B-1) is a graft-modified product of a copolymer in which two kinds of repeating units derived from different .alpha.-olefins are arranged at random.

This graft-modified .alpha.-olefin random elastic copolymer is a low-crystalline to non-crystalline copolymer, preferably, substantially non-crystalline. In other words, a crystallinity of the copolymer, as measured by means of X-ray diffractometry, is not more than 10%, preferably not more than 5%, particularly preferably 0%. Accordingly, most of the graft-modified .alpha.-olefin random elastic copolymers show no definite melting point. Further, the graft-modified .alpha.-olefin random elastic copolymer is a soft polymer because of its low crystallinity, and this elastic copolymer has a tensile modulus of generally not less than 0.1 kg/cm.sup.2 but less than 20,000 kg/cm.sup.2, preferably in the range of 1 to 15,000 kg/cm.sup.2.

A melt index of the graft-modified .alpha.-olefin random elastic copolymer (measured at 190.degree. C.) is usually in the range of 0.1 to 30 g/10 min, preferably 1.0 to 20 g/10 min, particularly preferably 2.0 to 15 g/10 min, and a Mw/Mn value thereof measured by GPC is usually not more than 5.5, preferably not more than 4.5, particularly preferably not more than 3.5.

Further, the graft-modified .alpha.-olefin random elastic copolymer has a glass transition temperature (Tg) of usually -150.degree. to +50.degree. C., preferably -80.degree. to -20.degree. C., an intrinsic viscosity [.eta.] as measured in decalin at 135.degree. C. of usually 0.2 to 10 dl/g, preferably 1 to 5 dl/g, and a density of usually 0.82 to 0.96 g/cm.sup.3, preferably 0.84 to 0.92 g/cm.sup.3.

Concrete examples of the graft-modified .alpha.-olefin random elastic copolymer (B-1) having the above-mentioned properties include:

(i) a graft-modified ethylene/.alpha.-olefin copolymer rubber prepared mainly from ethylene, and

(ii) a graft-modified propylene/.alpha.-olefin copolymer rubber prepared mainly from propylene.

The graft-modified .alpha.-olefin random elastic copolymer is described in more detail with reference to its typical examples, namely, the graft-modified ethylene/.alpha.-olefin copolymer rubber (i) and the graft-modified propylene/.alpha.-olefin copolymer rubber (ii).

As the .alpha.-olefin for forming the graft-modified ethylene/.alpha.-olefin copolymer rubber (i), .alpha.-olefin of 3 to 20 carbon atoms is generally employed. Examples of such .alpha.-olefin include propylene, 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene and mixtures thereof. Of these, propylene and/or 1-butene is particularly preferred.

As the .alpha.-olefin for forming the graft-modified propylene/.alpha.-olefin copolymer rubber (ii), .alpha.-olefin of 4 to 20 carbon atoms is generally employed. Examples of such .alpha.-olefin include 1-butene, 1-pentene, 1-hexene, 4-methyl-1-pentene, 1-octene, 1-decene and mixtures thereof. Of these, 1-butene is particularly preferred.

In the graft-modified ethylene/.alpha.-olefin copolymer rubber (i), a molar ratio of ethylene to .alpha.-olefin (ethylene/.alpha.-olefin) varies depending on the kind of .alpha.-olefin, but is usually in the range of 10/90 to 99/1, preferably 50/50 to 95/5. When the .alpha.-olefin is propylene, the molar ratio is preferably in the range of 50/50 to 90/10, and when the .alpha.-olefin is .alpha.-olefin of 4 or more carbon atoms, the molar ratio is preferably in the range of 80/20 to 95/5.

This .alpha.-olefin random copolymer may contain other constituent units than those derived from .alpha.-olefin, such as constituent units derived from diene compounds, with the proviso that the properties of the .alpha.-olefin random elastic copolymer are not marred.

Examples of the constituent units permitted to be contained in the .alpha.-olefin random elastic copolymer include:

constituent units derived from chain non-conjugated dienes such as 1,4-hexadiene, 1,6-octadiene, 2-methyl-1,5-hexadiene, 6-methyl-1,5-heptadiene and 7-methyl-1,6-octadiene;

constituent units derived from cyclic non-conjugated dienes such as cyclohexadiene, dicyclopentadiene, methyltetrahydroindene, 5-vinylnorbornene, 5-ethylidene-2-norbornene, 5-methylene-2-norbornene, 5-isopropylidene-2-norbornene and 6-chloromethyl-5-isopropenyl-2-norbornene;

constituent units derived from diene compounds such as 2,3-diisopropylidene-5-norbornene, 2-ethylidene-3-isopropylidene-5-norbornene and 2-propenyl-2,2-norbornadiene; and

constituent units derived from cycloolefins.

These diene constituent units are contained in the .alpha.-olefin random elastic copolymer in an amount of generally not more than 10% by mol, preferably not more than 5% by mol.

Examples of ethylene/.alpha.-olefin copolymer forming the graft-modified ethylene/.alpha.-olefin copolymer rubber (i) include:

copolymers such as ethylene/propylene copolymer, ethylene/1-butene copolymer, ethylene/4-methyl-1-pentene copolymer, ethylene/1-hexene copolymer, ethylene/1-octene copolymer and ethylene/1-decene copolymer; and

copolymers such as ethylene/propylene/1,4-hexadiene copolymer, ethylene/propylene/dicyclopentadiene copolymer, ethylene/propylene/5-ethylidene-2-norbornene copolymer, ethylene/propylene/2,5-norbornadiene copolymer, ethylene/1-butene/dicyclopentadiene copolymer, ethylene/1-butene/1,4-hexadiene copolymer and ethylene/1-butene/5-ethylidene-2-norbornene copolymer.

In the graft-modified propylene/.alpha.-olefin copolymer