An adhesive composition for a vinyl halide resin is disclosed. This adhesive composition is formed by incorporating an aliphatic polyamine having a plurality or ether bonds, an alicyclic polyamine or an alkylene diamine into a blend of an epoxy resin and a vinyl chloride copolymer resin. This adhesive composition is effectively used in the solvent-free state for a molded body of a vinyl halide type resin such as a vinyl chloride resin or a vinylidene halide resin.
This is a division of application Ser. No. 07/959,479 filed Oct. 9, 1992, now abandoned; which is a continuation of application Ser. No. 07/569,586, filed Aug. 20, 1990, now abandoned; which is a continuation of application Ser. No. 07/292,391, filed Dec. 30, 1988, now abandoned.
