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| United States Patent | 5373080 |
| Link to this page | http://www.wikipatents.com/5373080.html |
| Inventor(s) | Imashiro; Yasuo (Tokyo, JP);
Takahashi; Ikuo (Tokyo, JP) |
| Abstract | The present invention provides a process for producing a polycarbodiimide
resin from an aliphatic diisocyanate and a terminal-blocking agent in the
presence of a carbodiimidization catalyst, wherein the aliphatic
diisocyanate is tetramethylxylylene diisocyanate represented by the
following formula
##STR1##
and polymerization is conducted using no solvent. The polycarbodiimide
resin obtained by the above process has good storage stability and
excellent miscibility with organic solvents. |
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Title Information  |
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| Publication Date |
December 13, 1994 |
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| Filing Date |
August 3, 1993 |
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| Priority Data |
Aug 10, 1992[JP]4-235331 |
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Title Information  |
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Market Review  |
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Technical Review  |
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Claims  |
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What is claimed is:
1. A process for producing a polycarbodiimide resin comprising reacting a
tetramethylxylylene diisocyanate represented by the following formula
##STR4##
with an aliphatic monoisocyanate at a molar ratio of the
tetramethylxylylene diisocyanate to the aliphatic monoisocyanate of 2:1 to
2:30 in the presence of a carbodiimidization catalyst selected from the
group consisting of phospholeneoxides at a temperature in the range of
about 120.degree. C. to about 250.degree. C. and in the absence of a
solvent.
2. The process of claim 1, wherein the carbodiimidization catalyst is
selected from the group consisting of 1-phenyl-2-phospholene-1-oxide,
3-methyl-2-phospholene-1-oxide, 1-ethyl-3-methyl-2-phospholene-1-oxide,
1-ethyl-2-phospholene-1-oxide, 3-methyl-1-phenyl-2-phospholene-1-oxide,
and 3-phospholene isomers thereof. |
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Claims  |
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Description  |
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BACKGROUND OF THE INVENTION
(1) Field of the Invention
The present invention relates to a process for producing a polycarbodiimide
resin. More particularly, the present invention relates to a process for
producing a polycarbodiimide resin having good storage stability and
excellent miscibility with organic solvents.
(2) Description of the Prior Art
Polycarbodiimide resins having a structure of --N.dbd.C.dbd.N-- in the
molecule are known to have high heat resistance and other excellent
properties and are in use in various fields as a thermosetting resin.
Polycarbodiimide resins have been produced in a reaction system using a
solvent, except for few exceptional cases, because since the reactivity of
carbodiimide group is high, carbodiimidization in high degree invites
gelling due to the occurrence of side reactions. Consequently, the
resulting polycarbodiimide resin has had limited applications owing to the
solvent used.
For example, a polycarbodiimide resin produced using a high-boiling solvent
finds no applications where a low-boiling solvent must be used.
The above polycarbodiimide resin may be used in said applications by
conducting concentration to remove part or all of the high-boiling solvent
and replace it with a low-boiling solvent. However, since the reactivity
of carbodiimide group is so high as to invite gelling even in a solution,
it is virtually very difficult to remove part or all of the high-boiling
solvent.
Even if the above problem caused by the use of a solvent in
polycarbodiimide production could be solved, problems still exist when the
produced polycarbodiimide resin has low storage stability or poor
miscibility with organic solvents.
SUMMARY OF THE INVENTION
The present invention has been brought about in order to eliminate the
above drawbacks of the prior art and provide a process for producing a
polycarbodiimide resin having good storage stability and excellent
miscibility with organic solvents.
According to the present invention there is provided a process for
producing a polycarbodiimide resin from an aliphatic diisocyanate and a
terminal-blocking agent in the presence of a carbodiimidization catalyst,
wherein the aliphatic diisocyanate is tetramethylxylylene diisocyanate
represented by the following formula
##STR2##
and polymerization is conducted using no solvent.
DETAILED DESCRIPTION OF THE INVENTION
The present invention is hereinafter described in detail.
The aliphatic diisocyanate used in the present invention is
tetramethylxylylene diisocyanate represented by the above formula. More
specifically, it is exemplified by p-tetramethylxylylene diisocyanate
represented by the following formula
##STR3##
or m-tetramethylxylylene diisocyanate represented by the following
formula.
In the present invention, no other aliphatic diisocyanate can be used. That
is, the first feature of the present invention lies in that a
polycarbodiimide resin having good storage stability and excellent
miscibility with organic solvents is produced by using tetramethylxylylene
diisocyanate.
The terminal-blocking agent used in the present invention includes, for
example, an aliphatic monoisocyanate. It can be exemplified by n-butyl
isocyanate, tert-butyl isocyanate, isobutyl isocyanate, ethyl isocyanate,
n-propyl isocyanate, isopropyl isocyanate, cyclohexyl isocyanate and
n-octadecyl isocyanate. Of these, n-butyl isocyanate is particularly
preferable.
In the present process, tetramethylxylylene diisocyanate and the
terminal-blocking agent are subjected to a condensation reaction (wherein
removal of carbon dioxide takes place) to produce a polycarbodiimide
resin. The basic reaction is the same as in the conventional processes for
polycarbodiimide resin production [U.S. Pat. No. 2,941,956; Japanese
Patent Publication No. 33279/1972; J. Org. Chem., 28,2069-2075 (1963);
Chemical Review 1981, vol. 81, No. 4, 619-621].
The condensation reaction between tetramethylxylylene diisocyanate and an
aliphatic monoisocyanate as terminal-blocking agent (wherein removal of
carbon dioxide takes place) proceeds in the presence of a
carbodiimidization catalyst. As said catalyst, there can be used, for
example, phospholeneoxides such as 1-phenyl-2-phospholene-1-oxide, 3-
methyl-2-phospholene-1-oxide, 1-ethyl-3-methyl-2- phospholene1-oxide,
1-ethyl-2-phospholene1-oxide, 3methyl-1-phenyl-2-phospholene-1-oxide and
3-phospholene isomers thereof. 3-methyl-1-phenyl-2-phospholene-1-oxide is
preferable in view of the reactivity.
As mentioned above, an organic solvent has ordinarily been used in the
conventional processes for aliphatic polycarbodiimide resin production. In
the condensation reaction of the present process, however, no solvent is
used, and this is a second feature of the present invention.
The temperature of the above condensation reaction is in the range of
preferably about 120.degree. C. to about 250.degree. C., more preferably
about 150.degree. C. to about 190.degree. C.
The amount ratio of tetramethylxylylene diisocyanate to the aliphatic
monoisocyanate (terminal-blocking agent) is preferably in the range of 2:1
to 2:30 (molar ratio). Consequently, the polymerization degree of the
resulting polycarbodiimide resin becomes 1 to 30.
The reaction between tetramethylxylylene diisocyanate and the aliphatic
monoisocyanate as terminal-blocking agent is conducted in an inert gas
(e.g. nitrogen) current to complete the reaction quickly.
The polycarbodiimide resin obtained in the present process using no solvent
is a viscous liquid resin and has no problem of limited applications seen
in polycarbodiimide resins produced by the conventional processes using a
solvent. Further, the polycarbodiimide resin obtained in the present
process not only has very good storage stability but also is soluble in
various organic solvents and can be used in various applications (e.g.
crosslinking agent for aqueous resin) by selecting an appropriate solvent
suitable for each application.
The present invention is hereinafter described in more detail by way of
Examples.
EXAMPLE 1
244 g of m-tetramethylxylylene diisocyanate and 22 g of butyl isocyanate
were reacted in the presence of 5.32 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
180.degree. C. for 66 hours to obtain a polycarbodiimide resin
(polymerization degree=9). The resin had a stability of more than one
month at room temperature, which was excellent.
The solubility of the polycarbodiimide resin in various organic solvents is
shown in Table 1.
TABLE 1
______________________________________
Solvent Solubility
______________________________________
Benzene Yes
Toluene Yes
Xylene Yes
Acetone Yes
Methyl ethyl ketone Yes
Ethyl acetate Yes
Amyl acetate Yes
Propylene glycol monomethyl ether acetate
Yes
Chloroform Yes
Carbon tetrachloride Yes
Methylene chloride Yes
Trichloroethylene Yes
Tetrachloroethylene Yes
Dimethylformamide Yes
______________________________________
EXAMPLE 2
244 g of m-tetramethylxylylene diisocyanate and 22 g of butyl isocyanate
were reacted in the presence of 5.32 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
150.degree. C. for 100 hours to obtain a polycarbodiimide resin
(polymerization degree=9). The resin had a stability of more than one
month at room temperature, which was excellent.
EXAMPLE 3
244 g of m-tetramethylxylylene diisocyanate and 22 g of butyl isocyanate
were reacted in the presence of 5.32 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
170.degree. C. for 103 hours to obtain a polycarbodiimide resin
(polymerization degree=9). The resin had a stability of more than one
month at room temperature, which was excellent.
EXAMPLE 4
244 g of m-tetramethylxylylene diisocyanate and 22 g of butyl isocyanate
were reacted in the presence of 5.32 g of a carbodiimidization catalyst
(3-methyl-l-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
190.degree. C. for 77 hours to obtain a polycarbodiimide resin
(polymerization degree=9). The resin had a stability of more than one
month at room temperature, which was excellent.
EXAMPLE 5
244 g of m-tetramethylxylylene diisocyanate and 66 g of butyl isocyanate
were reacted in the presence of 6.2 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
180.degree. C. for 28 hours to obtain a polycarbodiimide resin
(polymerization degree=3). The resin had a stability of more than one
month at room temperature, which was excellent.
EXAMPLE 6
244 g of m-tetramethylxylylene diisocyanate and 10.4g of butyl isocyanate
were reacted in the presence of 5.1 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
180.degree. C. for 126 hours to obtain a polycarbodiimide resin
(polymerization degree=19). The resin had a stability of more than one
month at room temperature, which was excellent.
EXAMPLE 7
244 g of m-tetramethylxylylene diisocyanate and 6.83g of butyl isocyanate
were reacted in the presence of 5.0 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
180.degree. C. for 134 hours to obtain a polycarbodiimide resin
(polymerization degree =29). The resin had a stability of more than one
month at room temperature, which was excellent.
The polycarbodiimide resins obtained in Examples 2-7, similarly to the
polycarbodiimide resin obtained in Example 1, were soluble in various
organic solvents.
COMPARATIVE EXAMPLE 1
193.5 g of 4,4'-dicyclohexylmethane diisocyanate and 16.5 g of butyl
isocyanate were reacted in the presence of 2.10 g of a carbodiimidization
catalyst (3-methyl-1-phenyl2-phospholene-1-oxide) in a nitrogen gas
current at 180.degree. C. Gelling occurred in 10 hours and no
polycarbodiimide resin was obtained.
COMPARATIVE EXAMPLE 2
181.6 g of isophorone diisocyanate and 18 g of butyl isocyanate were
reacted in the presence of 2.0 g of a carbodiimidization catalyst
(3-methyl-1-phenyl-2-phospholene-1-oxide) in a nitrogen gas current at
180.degree. C. Gelling occurred in 3 hours and no polycarbodiimide resin
was obtained.
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