This invention relates to an improved method for curing polyepoxide resins at elevated temperature and particularly to a method for reducing the time required to effect cure of thermosetting resins at elevated temperature without sacrificing performance. In the basic process, an epoxide resin comprising a polyglycidyl ether of a polyhydric phenol is mixed with cycloaliphatic amine, e.g., di(4-aminocyclohexyl)methane, di(4-amino-3-methylcyclohexyl)methane, and isophoronediamine in an amount sufficient to effect cure of the polyepoxide resin at an initial temperature and then raised to a final cure temperature. The improvement for reducing the time necessary for cure comprises: effecting an initial and partial cure of the epoxy resin at a temperature between 60.degree. and 100.degree. C.; increasing the temperature of the epoxy resin at a point when the ratio of the slope of the equilibrium modulus to the initial slope of the equilibrium modulus in megapascals plotted as a function of time in minutes for the curing epoxy resin as determined by the equation: ##EQU1## is greater than about 20:1 to a final cure temperature between about 160.degree. and 200.degree. C.; and, then maintaining a final cure temperature until the slope of said equilibrium modulus falls below about 0.1:1. Cure is deemed complete when the slope of the curve falls below 0.1:1.
