The invention relates to a process for depositing copper on a gravure roll comprising the steps of: immersing a gravure roll in an electroplating bath comprising A) copper, B) sulfuric acid, C) at least one alkoxythio compound, D) at least one sulfonated, sulfurized hydrocarbyl compound and E) at least one grain refining thio compound, and passing electric current through the bath to deposit copper on the gravure roll.
This is a continuation of application Ser. No. 08/125,596 filed on Sep. 23, 1993, abandoned, which is a continuation of U.S. Ser. No. 07/562,398 filed on Aug. 3, 1990, abandoned.
The invention relates to an acid electrolyte for depositing tin-copper alloys. Said electrolyte comprises one or more alkylsulfonic acids and/or alkanolsulfonic acids, one or more soluble tin(II) salts, one or more soluble copper(II) salts, and one or more organic sulfur compounds having one or more thioether functions and/or ether functions of general formula --R--Z--R'--(R and R' are the same or different non-aromatic organic radicals, and Z represents S or O). The invention also relates to a method, which involves the use of the electrolyte, to the coating obtained using said method, and to the use of the electrolyte for coating electronic components.
The present invention is directed to an improved copper plating bath for depositing a copper layer onto a printing cylinder, the copper plating bath comprising: (a) a source of copper ions; (b) a source of methane sulphonate ions; (c) a source of chloride ions; (d) an organosulphur compound having the formula R--S--R'--SO.sub.3.sup.-X.sup.+ or X.sup.+--O.sub.3S--R'--S--R--S--R'--SO.sub.3--X.sup.+, wherein R is alkyl, hydroxyalkyl or alkyl ether, R' is a C.sub.2 C.sub.4 alkyl group, and X.sup.+ is a cation; and (e) a polyether compound and method of using the same. The copper plating bath produces a plating deposit that has a stable hardness and is free from self-annealing during high speed plating.
The present invention provides an aqueous electroplating solution. The aqueous electroplating solution includes a copper salt comprising a weight by weight percent of the electroplating solution between about 0.1% to about 2.5%. The electroplating solution also includes an inorganic acid having a dissociation constant of less than about 2.0, and comprising a weight by weight percent of the electroplating solution between about 0.1% to about 10%. The electroplating solution further includes a hydrogenated halide and a modulator, each that comprises a weight by weight percent of the electroplating solution between about 0.0001% to about 1%.
One aspect of the invention relates to an aqueous copper plating bath containing sulfuric acid with a specific ratio to at least one supplemental acid selected from the group consisting of fluoboric acid, alkane sulfonic acids, and alkanol sulfonic acids; a copper salt; chloride ions; and at least one sulfate bath brightener. Another aspect of the invention relates to aqueous copper plating bath containing fluoboric acid and/or an alkane sulfonic acid but no sulfuric acid, copper sulfate, chloride ions, and at least one sulfate bath brightener. Yet another aspect of the invention relates to methods of plating copper from the aforementioned copper plating baths. Still yet another aspect of the invention relates to methods of plating copper at high speed using relatively high current densities.
A copper electroplating process using alkoxylated dimercaptan ethers as an additive. The additives prevent dendritic formations which short out electrodes. Also provided is a method for polarizing the electrodes, allowing for current reduction and cost savings.
