A method for packaging and identifying integrated circuits. The method includes providing integrated circuit packages each having a respective set of identifying electrical nodes coupled thereto. For each of the packages, a respective one of the integrated circuits is mounted therein. For each of the packages, members of the respective set of electrical nodes are electrically interconnected in a manner associated with a respective identity of the respective integrated circuit mounted therein. For each of the packages, members of the respective set of electrical nodes are electrically interconnected in a manner associated with a respective identity of the respective integrated circuit mounted therein. For each of the packages, electrical signals are applied to members of the respective set of nodes. The integrated circuits are efficiently and reliably identified by sensing the electrical signals conducted between electrically interconnected members of the respective set of nodes.
