A high-density, staggered pin fin array, and a method for manufacturing the pin fin array, are disclosed. The pin fin array includes a plurality of fin members, each having a plurality of elongated, pin-shaped fins arranged in a row; and, at least one connector for connecting the fins together, each at one end thereof. The plurality of fin members is arranged in a stack, wherein respective fins of each fin member are in registration with slots formed in its adjacent fin members in the stack. The method for manufacturing the pin fin array includes forming a plurality of fin members from a raw planar, tape, or thin layer stock, positioning the fin members relative to each other so that the respective fins of each fin member are in registration with the slots formed in adjacent fin members, and joining each fin member with the adjacent fin members. The high-density, staggered pin fin array produces very high heat transfer coefficients by geometrically inducing turbulent mixing, thereby increasing the thermal performance of the pin fin array.

A heat sink and method of manufacture is described. In the preferred embodiment, an array of tubes are extruded from a block of conductive metal, such as aluminum. A series of plugs or pins are extruded in a first stage, and the plugs are reverse extruded by tooling pins to form tubes of considerable or varying length, integral with the base plate. The tube closed ends are punched so as to form holes through the base plate which has a groove crossing pattern aligned with the holes to provide an air convection flow path. The tubes may be assembled to a base plate as separate elements, and a channel member can also be utilized to provide flow passages extending to each tube.

A fluid cooling device, and a method for manufacturing the fluid cooling device, are disclosed. The fluid cooling device includes a plurality of cold plate members, each having a plurality of imperforate plate portions and perforate portions arranged in a line; and, at least one connector for connecting the plate portions together at one end thereof. The cold plate members are arranged in a stack, wherein respective plate portions of each cold plate member are in registration with perforate portions formed in its adjacent cold plate members in the stack. The fluid cooling device can provide very high heat transfer by close clearance laminar developing flow, thereby increasing the thermal performance of the fluid cooling device while maintaining low pressure drop. The method for manufacturing the fluid cooling device includes forming a plurality of cold plate members from a planar metal tape, or thin layer stock; positioning the cold plate members relative to each other so that the respective imperforate plate portions of each cold plate member are in registration with the perforate portions formed in adjacent cold plate members; and joining each cold plate member with the adjacent cold plate members.

A heat sink has a base plate and attached pin-fins with intake and discharge openings connected by a tubular channel. A pump moves cooling fluid across the exterior surface of the pin-fins, as well as the interior surface of the tubular channels, thereby increasing the surface area exposed to the cooling fluid. In one embodiment, the cooling fluid moves parallel to the base plate, and the discharge openings are oriented to discharge fluid in the same direction as the pump output, +/-90 degrees. Baffles may be added to duct the cooling fluid over the heat sink. In another embodiment, the cooling fluid moves perpendicular to the base plate and the discharge openings are oriented to vent the cooling fluid along lines that extend outward from a center point of the base plate, or along radial lines drawn from a central point through the pin-fins.