A system and method for communicating between local subscriber units and a local base station repeater cell in a two-way communication interactive video network. In one embodiment, a modem is used to enable communications between a subscriber unit and a local base station repeater cell when the subscriber units are unable to receive rf transmissions from the local base station repeater cell. The local base station repeater cell is connected via a telephone line to the modem. Data communications are sent from the local base station repeater cell to the modem. The modem is also connected via and rf link to the subscriber unit. The modem then transmits the data communications received from the local base station repeater cell to the subscriber unit. Responses from the subscriber unit are then transmitted over the rf link from the subscriber unit to the modem. The modem then transmits the responses over the telephone line to the local base station repeater cell.

A process for treating cutting tools to extend the useful duty cycles of the tools by immersing the tools to be treated in a bath of a solvent in sufficient amounts and at a temperature to remove contamination from the surface of the tools and to coat the tool surfaces with perfluoroethylene. The solvent and perfluoroethylene resin are circulated throughout the immersed tools for a time sufficient to coat the surfaces with polyfluoroethylene resin.

A composite resinoid/diamond dicing blade includes diamond particles and a dry lubricant dispersed in a resin binder. The dry lubricant can be in powdered form, and is preferably selected from graphite, talc, molybdenum disulfide, tungsten disulfide, niobium disulfide, boron nitride, and ditellurides and diselenides of group V and VI metals, with molybdenum disulfide being particularly preferred. The dicing blade can be used in cutting a variety of substrates, such as in the production of ink jet printheads, electrical semiconductor chips, raster input scan (RIS) sensor bars, and magnetic heads.

A tape assembly for use in wafer dicing includes a layer of adhesive dicing tape having a size at least as large as a footprint of a die, and a screening portion which is adhered to the tape. The screening portion is interposed between the layer of tape and the die when the die is adhered to the layer of tape. The screening portion covers an interior portion of the layer of tape. The screening portion is sized and shaped to leave a sufficient portion of the layer of tape underlying a perimeter of the die exposed to adhere the die to the layer of tape.

A printhead assembly with an elongate printhead and a plurality of power supply points and ground supply points spaced along its length. The assembly also has an elongate power busbar and an elongate ground busbar with an interconnect means 470 connecting said power supply points 553 to the power busbar and the ground supply points to said ground busbar; wherein, the interconnect means 470 attaches to the printhead along a single longitudinal edge 554 thereof. By attaching to one edge of the printhead IC only, the assembly design is less complex and more compact.