A system (30) and method for preheating molding compound in the form of resin pellets (20) used in molding integrated circuits (50). A slanted plate (36) is connected to an electrode (31) to preheat resin pellets (20). The slanted plate (36) produces a temperature gradient in pellets (20) with a high temperature end (21) and a lower temperature end (22). A preheated pellet (20) with the lower temperature end (22) first is placed in a mold pot (40). A transfer ram (46) contacts the high temperature end (21) of the pellet (20) to deform the pellet (20) and fill any void spaces between the pellet (20) and surrounding mold pot bushing (44). The ram (46) continues to deform the pellet (20) to force air or other gases from the mold pot bushing (44) and to inject molding compound into a mold cavity (42).
This application is a Continuation of Ser. No. 08/160,371, filed Nov. 29, 1993 now abandoned, which is a Divisional of prior application Ser. No. 07/951,643, filed Sep. 25, 1992 now abandoned.
A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of the molding dies. A member to be molded by the molding dies is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
A die preparation and exchange method wherein dies to be inserted into an injection molding machine are electrically and fluidly heated prior to insertion so as to prepare the dies to make parts more quickly. The die exchange sequence wherein a first set of dies are removed from the machine and are replaced by a second set of dies has been changed from a generally serial sequence to a sequence wherein most steps are performed in parallel or simultaneously, greatly reducing the downtime associated with mold change.
A method of resin molding for molding regular products and a resin molding machine for the same. In the method of the present invention, release film, which is capable of easily peeling off from molding dies and resin, is provided on faces of molding dies. A member to be molded by the molding dies 15 is clamped together with the release film. An inner face of a pot of the molding die is covered with the release film. A resin tablet is supplied into the pot.
Powdered starting material utilized for molding (e.g., rotational molding, injection molding, blow molding), extrusion, and the like can be preheated to reduce the time required to complete the processing of the material. After being preheated to a temperature below a melting temperature of the powder, the powder is transferred to a processing station. For example, in a rotational molding system, the preheated powder is transferred to a mold, where the preheated powder is melted and the mold is rotated such that the molten material adheres to the walls of the mold. After obtaining a desired distribution of the material over the walls of the mold, the temperature of the mold is decreased as rotation of the mold continues. When the article is sufficiently cooled, the article is removed from the mold.
