Semiconductor chip carrier affording a high-density external interface

Claims

What is claimed is:

1. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier, the semiconductor die carrier being housed within a cable device.

2. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier, wherein the contact sections of the second array are arranged in a configuration providing a density of at least 600 contacts per square inch on the surface of the second support element.

3. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact Sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, When each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier, wherein the contact sections of the second array are arranged in a configuration providing a density of at least 1,000 contacts per square inch on the surface of the second support element.

4. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier,

wherein each of the groups of contact sections of the second array forms an electrical interconnect component and wherein each of the electrical interconnect components is a projection-type electrical interconnect component comprising a plurality of contact sections of conductive posts formed around an insulative buttress, each buttress having a 0.5 mm.times.0.5 mm square cross-section.

5. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier,

wherein each of the groups of contact sections of the second array forms an electrical interconnect component and wherein each of the electrical interconnect components is a projection-type electrical interconnect component comprising a plurality of contact sections of conductive posts formed around an insulative buttress, each buttress having a 0.9 mm.times.0.9 mm square cross-section.

6. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier,

wherein each of the groups of contact sections of the second array forms an electrical interconnect component and wherein each of the electrical interconnect components is a projection-type electrical interconnect component comprising a plurality of contact sections of conductive posts formed around an insulative buttress, each buttress having a cross-shaped cross-section.

7. A semiconductor die carrier according to claim 6, wherein opposing arms of the cross are equal in length, and adjacent arms of the cross are different in length.

8. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier,

wherein each of the groups of contact sections Of the second array forms an electrical interconnect component and wherein each of the electrical interconnect components is a projection-type electrical interconnect component comprising a plurality of contact sections of conductive posts formed around an insulative buttress, each buttress having an H-shaped cross-section.

9. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a second plurality of electrically conductive contacts secured to the second support element, each of the contacts of the second plurality of contacts having a contact section extending from a surface of the second support element, the contact sections of the second plurality of contacts being arranged in a second array of groups of multiple contact sections positioned on the surface of the second support element, and each group of contact sections from the second array being configured to be pluggably connected to a corresponding single one of the groups of contact sections from the first array such that, when each group of contact sections from the second array is pluggably connected to a corresponding one of the groups of contact sections from the first array, each group of contact sections from the second array pluggably receives or is pluggably received within a corresponding one of the groups of contact sections from the first array and each contact section of the second array contacts a corresponding one of the contact sections of the first array;.

a semiconductor die; and

electrically conductive material providing electrical connection between the semiconductor die and at least one of the electrically conductive contacts of the semiconductor die carrier, wherein each of the electrically conductive contacts of the semiconductor die carrier comprises a concave well for holding at least one ball of solder used to form a C4 interconnection.

10. A semiconductor die carrier configured to be pluggably connected to a first plurality of electrically conductive contacts secured to a first support element, each of the contacts of the first plurality of contacts having a contact section extending from a surface of the first support element, and the contact sections of the first plurality of contacts being arranged in a first array of groups of multiple contact sections positioned on the surface of the first support element, the semiconductor die carrier comprising:

a second support element;

a