A system for extending the life span of electronic components in a high temperature well. A thermal electric cooler is located in a position thermally communicating with the electronic component in the well. The thermal electric cooler lowers the temperature of the electronic component to a temperature that retards the deterioration of the electronic component, and is particularly useful in well completion tools requiring an extended life. One or more thermal electric coolers or other electrical equipment may be connected to a common electric wire, and a surface controller may selectively adjust the power supplied to each thermal electric cooler to prevent the electric wire from being overloaded. The power to each component can be controlled to produce the lowest attainable temperature for each thermal electric cooler, which reduces the deterioration of electronic components to the greatest extent possible.
A system for extending the life span of electronic components in a high temperature well. A thermal electric cooler is located in a position thermally communicating with the electronic component in the well. The thermal electric cooler lowers the temperature of the electronic component to a temperature that retards the deterioration of the electronic component, and is particularly useful in well completion tools requiring an extended life. A vacuum is maintained about the thermal electric cooler or the electronic components to reduce convection energy losses.
Electric power is generated downhole in a well using a thermoelectric device. A temperature gradient or differential .DELTA.T present in the well is applied to the thermoelectric device to produce a voltage potential across the output terminals of the device. The thermoelectric device includes a first thermocouple coupled to a heat source and a second thermocouple coupled to a heat sink source. The electric power generated by the thermoelectric device is used to recharge battery packs located downhole or to power electrical devices or systems.
A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermally conductive chassis. The heat received by the first heat transfer surface is transferred within the chassis to a second heat transfer surface that then transfers the heat to a housing. The housing transfers the heat to the drilling fluid flowing over the housing. To ensure good conductive heat transfer between the chassis and the housing, the chassis portions are urged outwardly toward the housing surface. A conformable thermal interface material preferably forms the chassis second heat transfer surface. The system may also includes a thermoelectric cooler mounted in a drill pipe portion of the downhole assembly that transfer heat from the an electronic component mounted in the drill pipe to the drill pipe, which then transfers the heat to the drilling fluid.
Systems and methods for cooling a component within a housing adapted for subsurface disposal using a vortex tube. The housing contains a first pressure chamber; a vortex tube coupled to the first pressure chamber; a cooling chamber coupled to the vortex tube; and a second pressure chambercoupled to the cooling chamber; wherein the pressure chambers are adapted to stimulate a cool fluid flow from the vortex tube into the cooling chamber. A cooling method entails disposing the component to be cooled within the cooling chamber and adapting the system pressure chambers to stimulate a cool fluid flow from a vortex tube into the cooling chamber.
A system for cooling electronic components in the downhole assembly of a drill string through which a drilling fluid flows. The cooling system includes a thermoelectric cooler that conducts heat from the electronic component to a first heat transfer surface of a thermal conductor. The heat received by the first heat transfer surface is transferred within the thermal conductor to a second heat transfer surface that then transfers the heat to a housing. The housing transfers the heat to the drilling fluid flowing over the housing. To ensure good conductive heat transfer between the electronic component, the thermoelectric cooler, the thermal conductor and the housing, and to absorb shock, vibration and differential thermal expansion, these components are supported on a spring mechanism that generates a force that biases the electronic component against the thermoelectric cooler, the thermoelectric cooler against the thermal conductor and the thermal conductor against the housing.