A sample semiconductor device which is processed and/or observed with the focused liquid metal ion beam can be returned again to the manufacturing process in this invention. The metal ions used in this apparatus are generally Ga ions. Ga ions contaminate a semiconductor device and a semiconductor manufacturing apparatus by auto-doping. An area which is irradiated with a focused liquid metal ion is doped by the metal ions which are subsequently removed by irradiation with a gas ion beam or covered by hard fusing metal.
An impurity doping apparatus for fabricating a liquid crystal display simplifies processes for heating a substrate and doping the substrate with impurities by providing: a substrate supporter on which the substrate is mounted, a first gun disposed above and at a fixed distance from the substrate supporter for supplying a heating gas for heating the substrate, a second gun adjacent to the first gun which dopes the heated with impurity ions, a transferring part for moving the first and second guns to a horizontal or vertical direction, a driver providing the transferring part with a driving force to the horizontal or vertical direction, and a controller controlling an moving operation of the transferring part. The apparatus: improves productivity; causes no heat damage to the substrate, since the process is carried out at low temperature; simplifies the total process by skipping an activating process accompanied by an impurity-ion doping step; and reduces the total volume of the apparatus, as no separate heating or cooling means is required, thereby also decreasing the total cost for the process.
An apparatus has a holder member (21) which holds a sample (3), and a removing beam source (13) which irradiates an inert ion beam onto a cross section (4) of the sample (3) held by a holder member (21) and removes a fracture layer on the cross section (4). Then, the removing beam source (13) is disposed on the holding end side of the sample (3) with respect to the normal L of the cross section (4) so that the irradiating direction of the inert ion beam is tilted at the tilt angle .theta. to the normal L with respect to the cross section (4).
There is provided a liquid metal ion beam irradiation device for irradiating a specific portion of a sample 6 with a prescribed liquid metal ion beam so as to form a cross section, and a gaseous ion beam irradiation device 7 for scanning a prescribed region (observation region) of the cross section using a gaseous ion beam focused to a prescribed diameter and removing a damaged layer on the prescribed region.
The invention relates to a ion beam preparation device for electron microscopy which is capable of observing the preparation process with the aid of a scanning electron microscope (3) and hence deliberately operate on the sample (4). The device is fitted with a multi-axis sample bench, at least on ion source (1, 2), a scanning electron microscope (3) with electron detectors (7, 9, 8) to image secondary electrons (SE), back-scatter electrons (RE) and transmitted electrons (TE), an electron source as a discharger for isolating samples and a light microscope (5). The ability to observe the etching process in situ permits precise monitoring of the etching stage, e.g. the degree of thickness reduction of the sample, at high resolution and, with the aid of a control device (19), it is possible automatically to terminate the thinning process to precise instructions.
A decelerating and focusing ion beam device is provided with an ion source, a focusing lens system having a plurality of focusing lenses and a multiple decelerating lens system having a plurality of decelerating lenses. It is possible to realize selective super-refined crystal growth and superficial etching with very high accuracy.
