A transport-by-suction type die for use in a working machine having working stages, the die comprises a feed arm mounted in a position above the working stage in a lower part of the die to be slidable in the direction of consecutive feed and to be vertically movable with respect to a surface of the working stage; suction pads for supporting a piece part by suction, the suction pads being attached to the feed arm at the same interval as that of the working stages; a negative-pressure aspiration mechanism connected with each of the suction pads; and a drive control mechanism for causing the feed arm to move vertically and reciprocate in synchronism with working processes.
A semiconductor test system comprises a tray including a plurality of pockets for accommodating a plurality of semiconductor component parts, a sucking mechanism for sucking the semiconductor component parts to firmly maintain the semiconductor component parts in the tray and a mechanism for moving the tray of semiconductor component parts relative to the sucking mechanism.
Workpieces such as chips are removed from a receiving plane by a transfer unit, which carries them to a delivery plane. The workpieces are transported in two segments during two phases, each workpiece being deposited between the phases on an intermediate station arranged in the region of the feed path. The transfer unit has two working heads, which simultaneously transport one workpiece from the receiving plane to the intermediate station, and another workpiece from the intermediate station to the delivery plane. The workpiece can be pivoted or rotated at the intermediate station so that its lower surface can be grasped by the depositing head.
