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Method of forming a pattern and projection exposure apparatus    

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United States Patent5595857   
Link to this pagehttp://www.wikipatents.com/5595857.html
Inventor(s)Fukuda; Hiroshi (Kokubunji, JP); Terasawa; Tsuneo (Ome, JP)
AbstractA novel method of pattern formation and a projection exposure apparatus are disclosed, in which the pupil of a projection lens of the projection exposure apparatus used for forming an LSI pattern or the like has mounted thereon an optical filter having a complex amplitude transmittance distribution expressed substantially as T(r)=cos (2.pi..beta.r.sup.2 -.theta./2) as a function of a radial coordinate r normalized by the maximum radius of the pupil. Alternatively, Fourier transform of a layout pattern drawn on the LSI is obtained, an obtained Fourier transform data is multiplied by cos (2.pi..beta.f.sup.2 -.theta./2) (where f is a spatial frequency, and .beta., .theta. appropriate real numbers), the inverse Fourier transform of the resulting product is taken to produce a pattern, and this pattern or an approximate solution thereof is used as a mask pattern thereby to produce an LSI by exposure. As a result, even when the NA is increased and the wavelength shortened to improve the resolution limit, a large depth of focus and a high image quality are obtained at the same time. It is thus possible to form a pattern of 0.2 to 0.3 .mu.m by the use of an optical exposure system.
   














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Drawing from US Patent 5595857
Method of forming a pattern and projection exposure apparatus - US Patent 5595857 Drawing
Method of forming a pattern and projection exposure apparatus
Inventor     Fukuda; Hiroshi (Kokubunji, JP); Terasawa; Tsuneo (Ome, JP)
Owner/Assignee     Hitachi, Ltd. (Tokyo, JP)
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Publication Date     January 21, 1997
Application Number     08/543,254
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     October 18, 1995
US Classification     430/311 250/491.1 250/492.1 430/312 430/322 430/325
Int'l Classification     G03C 005/00
Examiner     Rosasco; S.
Assistant Examiner    
Attorney/Law Firm     Fay, Sharpe, Beall, Fagan, Minnich & McKee
Address
Parent Case     This is a continuation application of Ser. No. 08/445,949, filed May 22, 1995, now abandoned, which is a divisional application of U.S. Ser. No. 08/225,821, filed Apr. 11, 1994, now U.S. Pat. No. 5,418,598, issued May 23, 1995, which is a divisional application of U.S. Ser. No. 07/765,060, filed Sep. 24, 1991, now U.S. Pat. No. 5,316,896, issued May 31, 1994.
Priority Data     Oct 24, 1990[JP]2-284229 Feb 07, 1991[JP]3-016346 May 15, 1991[JP]3-110127
USPTO Field of Search     430/5 430/311 430/312 430/322 430/325 250/491.1 250/492.1
Patent Tags     forming pattern projection exposure
   
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4370405
O'Toole
430/312
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We claim:

1. A method of manufacturing a semiconductor device having a principal surface to be processed, comprising the steps of:

preparing a mask having a predetermined pattern;

preparing a projection lens structure having a filter;

forming first and second projected images of said predetermined pattern at a first image plane and a second image plane, respectively;

setting said principal surface between said first and second image planes; and

exposing said mask with light to project said predetermined pattern onto said principal surface through said projection lens structure.

2. A method of manufacturing a semiconductor device according to claim 1, wherein said light comprises an excimer laser beam.

3. A method of manufacturing a semiconductor device, comprising the steps of:

preparing a mask having a predetermined pattern;

preparing a projection lens structure having a filter for partially phase-shifting light passing therethrough and for increasing uniformity of light intensity distribution along a light axis in the vicinity of an image plane of said projection lens structure;

setting a principal surface of said semiconductor device in the vicinity of said image plane; and

exposing said mask with light to project said predetermined pattern onto said principal surface through said projection lens structure.

4. A method of manufacturing a semiconductor device according to claim 3, wherein said light comprises an excimer laser beam.

5. A method of manufacturing a semiconductor device, comprising the steps of:

preparing a mask having a predetermined pattern;

preparing a projection lens structure having a filter with a first region and a second region for passing light therethrough with different respective phases;

setting a principle surface of the semiconductor device at the exposure field of said projection lens structure; and

exposing said mask with light to project said predetermined pattern onto said principal surface through said projection lens structure.

6. A method of manufacturing a semiconductor device according to claim 5, wherein said light comprises an excimer laser beam.

7. A method of manufacturing a semiconductor device according to claim 5, wherein one of said first and second regions comprises a Cr pattern having a discrete thickness distribution.

8. A method of manufacturing a semiconductor device according to claim 5, wherein said filter comprises a substrate through which said light passes without shifting phase, and a phase-shifting film on said substrate which phase-shifts light passing through said phase-shifting film.

9. A method of manufacturing a semiconductor device according to claim 8, wherein said substrate comprises quartz and said film comprises one of Al, Cr, MgF.sub.2, SiO.sub.2, and layered Al/SiO.sub.2.

10. A method of manufacturing a semiconductor device having first and second layers to be processed, comprising:

preparing a mask having a hole pattern for projection onto said first layer and a line-and-space pattern for projection onto said second layer;

preparing a projection lens structure;

preparing a first filter operably corresponding to said hole pattern and comprising a first region and a second region for passing light having different respective phases;

preparing a second filter operably corresponding to said line-and-space pattern and comprising a third region and a fourth region for passing light having different respective phases;

inserting one of said first and second filters into said lens structure in response to presence of one of said hole pattern and said line-and-space pattern being in a projection light path;

setting said semiconductor device at the exposure field of said projection lens structure; and

exposing said mask with projection light to project one of said hole pattern and said line-and-space pattern onto a respective one of said first and second layers of said device through said projection lens structure.

11. A method of manufacturing a semiconductor device according to claim 10, further comprising the step of preparing a third, non-phase-shifting filter, said third filter being inserted into said projection lens structure in the absence of said first and second filters.

12. A method of manufacturing a semiconductor device according to claim 1, wherein said third filter comprises an optical parallel plate having the same material and thickness as those of said first and second filters.
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BACKGROUND OF THE INVENTION

The present invention relates to a method of forming a fine pattern for various types of solid state devices. This invention also relates to a projection exposure apparatus and a projection exposure mask used for the fine pattern formation, a method of fabricating the mask and a method of layout designing of the mask pattern. This invention further relates to an optical lens used for all optical apparatuses and an optical filter installed in the optical lens.

In order to improve the degree of integration and the operation speed of solid state devices such as LSI, circuit patterns have been miniaturized more and more. At present, a reduction projection exposure method superior in mass productivity and resolution capability is widely used for forming such circuit patterns. The resolution limit of this method is proportional to the exposure wavelength and inversely proportional to the numerical aperture (NA) of the projection lens. The depth of focus, on the other hand, is proportional to the exposure wavelength and inversely proportional to the square of NA. As a result, with the improvement in the resolution limit (increase in NA and shortening of wavelength), the depth of focus is greatly reduced.

Conventionally, there has been suggested a phase-shifting method for reversing the phase of light transmitted through an adjacent aperture on the mask as a method for remarkably improving the resolution of the projection exposure. Also, a FLEX (Focus Latitude Enhancement Exposure) method for effecting exposure by the use of images of the same mask pattern formed at a plurality of positions along the light axis has been suggested as a method for remarkably improving the depth of focus in the conventional projection exposure method. The phase-shifting method is discussed in Levenson, et al, IEEE Trans. Electron Devices, Vol. ED-29, pp. 1828-1836 (1982), and the FLEX method in Fukuda, et al, IEEE Electron Device Letters Vol. EDL-8, pp. 179-180 (1987), for example.

A method of changing the imaging characteristics by changing the distribution of amplitude or phase in a lens pupil, on the other hand, is generally known as an apodisation or an optical filtering. Further, the double diffraction method is known as a method for restoring the reduced contrast of an image. These methods are discussed in, for example, Tsujiuchi, Progress in Optics, Vol. 2, pp. 133-152 (1983), North-Holland Publishing Co.

SUMMARY OF THE INVENTION

In recent years, the circuit pattern has been more and more miniaturized with the increase in the degree of large scale integration, while electronic device structures of DRAM, a typical LSI, and the like are increasingly formed in three dimensions. As a result, the projection surface of a mask pattern on the LSI surface is undesirably affected by the ever-reducing depth of focus, thereby making it increasingly difficult to form a fine pattern on the whole surface of an LSI chip. It is therefore necessary to secure a high resolution with the required depth of focus.

If the above-mentioned phase-shifting method is applied to repetitive patterns such as an LSI wiring pattern under the illumination condition of about 0.3 in coherence factor, not only the resolution but also the depth of focus is improved greatly by a factor of two or more. In the conventional applications to hole patterns or other isolated patterns, however, both the resolution and the depth of focus are improved only by about 20%. Also, a transfer pattern identical to the mask shape cannot be obtained due to an increased proximity effect in the case of a pattern of complicated shape.

According to the above-mentioned FLEX method, on the other hand, the depth of focus of an isolated pattern like a hole pattern is improved greatly by a factor of two or three. In this method involving a plurality of exposures effected while moving the substrate stage mainly along the light axis, however, the exposure control is complicated and mechanical operation of the substrate stage is required during exposure of the chip. Another problem is that the image contrast is deteriorated in patterns having a comparatively large proportion of exposure area, or especially, repetitive patterns of LSI wirings or the like.

An object of the present invention is to provide a novel method of forming patterns, a projection exposure apparatus, a mask, a mask fabrication method and a pattern layout method which are capable of maintaining a large depth of focus in spite of a larger NA and a shorter wavelength to improve the resolution limit without posing any of the problems mentioned above.

In the references cited above, a multiple-foci filter is suggested by Dr. Tsujiuchi, et al. Such a filter, however, is intended for setting the focal point to a plurality of mutually-distant planes in a system having a large aberration, and fails to take into full consideration the phase relation between a plurality of images formed at the focal points. It is therefore not always possible to assure the desired effect in a diffraction limited optical system. Further, the spatial distribution of the transmittance (transmission) and phase of the filter for securing a uniform light intensity along the light axis in accordance with various patterns are not defined clearly.

Another object of the present invention is to provide a projection exposure apparatus using a novel optical filter, an optical lens and the above-mentioned lens which is capable of maintaining a large depth of focus and a resolution capability in a diffraction limited optical system of a projection exposure apparatus for LSI or the like.

A large depth of focus is required in various fields of optics in addition to the reduction projection exposure described above. More specifically, an optical microscope for observing objects having a three-dimensional structure such as living creatures and the surfaces of LSI, a microlens for an optical disk head, and general optical devices including cameras and telescopes are expected to find applications in wider areas and may be improved in capacity by increasing the depth of focus. As the second object, the present invention provides a novel optical lens capable of maintaining a large depth of focus also in such general optical devices, and an optical filter used for such a purpose.

According to one aspect of the present invention, when projection exposure is effected through a mask pattern on a predetermined region of a photoresist layer formed on a substrate having a topography in the surface thereof, images of the mask pattern having substantially the same amplitude are formed simultaneously at mutually-distant first and second positions having different distances from the reference level of the substrate along the light axis, and the phase correlation between the images formed at the two positions satisfies a predetermined condition, whereby the sum of exposure amounts in the region interposed between the first and second positions is equal to or more than the exposure amount capable of forming a pattern of the photoresist layer by development.

According to another aspect of the present inventions, when projection exposure of a mask is effected on a substrate through a projection lens by use of light, the distribution of the complex amplitude transmittance of the mask pattern or the pupil (or an aperture stop plane at a position conjugate therewith) of the projection lens or the illuminance distribution of an effective light source is set in such a manner that the amplitude distribution of the light transmitted through the pupil of the projection lens is equal or appropriately approximate to the amplitude distribution of the light obtained on the pupil when a mask having the desired design pattern is illuminated with a normal partially spatial coherent light or a spatial coherent light, multiplied by cos (2.pi..beta.r.sup.2 -.theta./2) (r: pupil radius coordinate, .beta., .theta.: appropriate real number).

According to still another aspect of the present invention, an optical filter having the distribution of complex amplitude transmittance expressed by

T(r)=cos (2.pi..beta.r.sup.2 -.theta./2).times.circ(r)

(.beta., .theta.: appropriate constant), or the distribution of complex amplitude transmittance with an appropriate discrete function of T(r), is disposed substantially at a pupil plane of the lens, a plane conjugate with the pupil plane or an aperture stop position determining the numerical aperture of the lens.

According to a further aspect of the invention, the Fourier transform of the layout pattern drawn on the LSI is obtained, the pattern data obtained after Fourier transform are multiplied by cos (2.pi..beta.f.sup.2 -.theta./2) (f:spatial frequency), and the inverse Fourier transform of the resulting product is taken, so that the pattern thus obtained or a solution approximate thereto is used as a mask pattern to fabricate an LSI by exposure.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a diagram typically showing the principle of the present invention.

FIGS. 2A to 2D are other diagrams typically showing the principle of the present invention and a process for producing a modified mask pattern from a designed mask pattern, FIG. 2E is a diagram showing the distribution of light intensity by a modified mask, and FIG. 2F is a diagram showing the distribution of light intensity by a conventional mask.

FIG. 3A is a diagram showing the phase-amplitude distributional of a projected image of a linear aperture pattern according to the prior art (conventional exposure method), FIG. 3B is a diagram showing the light intensity distribution of a projected image of a linear aperture pattern according to the prior art, FIG. 3C is a diagram showing the phase-amplitude distribution of a projected image of a linear aperture pattern according to the present invention, and FIG. 3D is a diagram showing the light intensity distribution of a projected image of a linear aperture pattern according to the present invention.

FIG. 4A is a diagram showing the complex amplitude transmittance of a filter according to the present invention, and FIG. 4B is a diagram showing the focus dependence of the light intensity distribution with a filter according to the present invention applied to a hole pattern.

FIG. 5A is a diagram showing the complex amplitude transmittance in a pupil according to the prior art, and FIG. 5B is a diagram showing the focus dependence of the light intensity distribution according to the prior art.

FIG. 6A is a plan view showing a contact hole pattern, FIG. 6B is a diagram showing the light intensity distribution under a just-focused condition without using any filter according to the present invention for the contact hole pattern shown in FIG. 6A, FIG. 6C is a diagram showing the light intensity distribution without using the filter according to the present invention with the contact hole pattern defocused by 1 .mu.m, FIG. 6D is a diagram showing the light intensity distribution in the case where the filter according to the present invention is used with the contact hole pattern according to the present invention just focused, and FIG. 6E is a diagram showing the light intensity distribution in the case where the filter according to the present invention is used for the contact hole pattern of FIG. 6A with the contact hole pattern defocused by 1 .mu.m.

FIG. 7A is a diagram showing the complex amplitude transmittance of another filter according to the present invention, and FIG. 7B is a diagram showing the focus dependence of the light intensity distribution in the case where another filter according to the present invention is applied to the hole pattern.

FIG. 8A is a diagram showing the complex amplitude transmittance of still another filter according to the present invention, FIG. 8B is a diagram showing the relation between the depth of focus and size when no filter is used, and FIG. 8C is a diagram showing the relation between the depth of focus and size in the case where a filter is used.

FIG. 9A is a diagram showing an example of a wiring pattern of an LSI circuit, FIGS. 9B to 9E are diagrams showing the light intensity distribution under various conditions when the conventional method is applied to the wiring pattern shown in FIG. 9A, and FIGS. 9F and 9G are diagrams showing the light intensity distribution under various conditions when the present invention is applied to the wiring pattern shown in FIG. 9A.

FIG. 10A is a diagram showing the complex amplitude transmittance of a filter, FIG. 10B is a diagram showing the Al layer thickness distribution on a filter, and FIG. 10C is a diagram showing the SiO.sub.2 layer thickness distribution on a filter.

FIG. 11A is a diagram showing the radial distribution of the thickness of an absorber formed on a filter according to the present invention, FIG. 11B is a diagram showing the radial distribution of thickness of an MgF.sub.2 layer formed on a filter according to the present invention, and FIG. 11C is a diagram showing the complex amplitude transmittance of a filter according to the present invention.

FIG. 12 is a diagram showing the complex amplitude transmittance of an optical filter according to the present invention.

FIG. 13 is a diagram showing the complex amplitude transmittance of another optical filter according to the present invention.

FIG. 14A is a diagram showing the radial distribution of the thickness of an annular absorber pattern formed on a filter according to the present invention, FIG. 14B is a diagram showing the light transmittance distribution of the same filter, FIG. 14C is a plan view of the phase filter pattern of the filter, and FIG. 14D is a diagram showing the complex amplitude transmittance of the filter.

FIG. 15A is a diagram showing an aperture pattern, FIG. 15B is a diagram showing the amplitude transmittance along line A--A' in FIG. 15A, FIG. 15C is a contour map showing the amplitude transmittance distribution of a mask obtained on the basis of the aperture shown in FIG. 15A, and FIG. 15D is a diagram showing the amplitude transmittance along line A--A' in FIG. 15C.

FIG. 16A is a diagram showing the focus dependence of the light intensity distribution according to the prior art, and FIG. 16B is a diagram showing the dependence of the light intensity distribution on the focal point according to the present invention.

FIGS. 17A to 17D are diagrams showing the light intensity distribution for various coherence factors using a mask according to the present invention.

FIG. 18A is a plan view of a mask according to the present invention, FIG. 18B is a diagram showing the amplitude transmittance of the mask shown in FIG. 18A, and FIG. 18C is a diagram showing the focus dependence of the light intensity distribution when the mask shown in FIG. 18A is used.

FIG. 19A is a plan view showing an example of the mask for the contact hole, and FIG. 19B is a plan view of the mask for the contact hole according to the present invention.

FIG. 20A is a diagram showing the light intensity distribution for 0 .mu.m defocus when the mask shown in FIG. 19A is used, FIG. 20B is a diagram showing the light intensity distribution for 1 .mu.m defocus when the mask shown in FIG. 19A is used, FIG. 20C is a diagram showing the light intensity distribution for 0 .mu.m defocus when the mask shown in FIG. 19B is used, FIG. 20D is a diagram showing the light intensity distribution for 1 .mu.m defocus when the mask shown in FIG. 19B is used, FIG. 20E is a diagram showing the light intensity distribution for 0 .mu.m defocus when the mask is used with the interference between patterns suppressed, and FIG. 20F is a diagram showing the light intensity pattern for 1 .mu.m defocus when the same mask is used with the interference between patterns suppressed.

FIG. 21A is a partial plan view of a conventional mask for the hole pattern, FIG. 21B is a partial plan view of a mask for the hole pattern according to the present invention, and FIG. 21C is a partial plan view of another mask for the hole pattern according to the present invention.

FIG. 22A is a plan view showing the light intensity distribution for 0 .mu.m defocus when the mask shown in FIG. 21A is used, FIG. 22B is a plan view showing the light intensity distribution for 1 .mu.m defocus when the mask shown in FIG. 21A is used, FIG. 22C is a plan view showing the light intensity pattern for 0 .mu.m defocus when the mask shown in FIG. 21B is used, FIG. 22D is a diagram showing the light intensity distribution for 1 .mu.m defocus when the mask shown in FIG. 21B is used, FIG. 22E is a plan view showing the light intensity distribution for 0 .mu.m defocus when the mask shown in FIG. 21C is used, and FIG. 22F is a plan view showing the light intensity distribution for 1 .mu.m defocus when the mask shown in FIG. 21C is used.

FIG. 23A is a diagram showing a mask for the hole pattern according to the present invention, FIG. 23B is a diagram showing the amplitude transmittance of the mask, FIG. 23C is a diagram showing the light intensity obtained when the same mask is used, FIG. 23D is a diagram showing another mask for the hole pattern according to the present invention, FIG. 23E is a diagram showing the amplitude transmittance of the same mask, FIG. 23F is a diagram showing the light intensity obtained when the same mask is used, FIG. 23G is a diagram showing another mask for the hole pattern according to the present invention, FIG. 23H is a diagram showing the amplitude transmittance of the same mask, and FIG. 23I is a diagram showing the light intensity obtained when the same mask is used.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

In order to facilitate a better understanding of the present invention, there will first be described the principle of the present invention with reference to FIGS. 1, 2A to 2F and 3A to 3D.

The amplitude distribution U.sub.0 of an image projected by coherent light is written as shown below as a function of the defocus z and the position vector x within the plane perpendicular to the light axis.

U.sub.0 (x,z)=exp(i.phi.).intg.a(f).multidot.p.sub.0 (.vertline.f.vertline.z).multidot.exp(2.pi.ix.multidot.fl)df p.sub.0 (r,z)=circ(r).multidot.exp((2.pi.izr.sup.2) (1)

where a(f) is the Fourier spectrum of the mask pattern, p.sub.0 (r,z) the pupil function, f the spatial frequency vector normalized by NA/.lambda., and r the radial coordinate of the pupil plane normalized by the maximum aperture radius. The amplitude transmittance distribution of the pupil plane of the projection lens is assumed to be a two-dimensional function circ(r) which becomes 1 when 0.ltoreq.r.ltoreq.1 and 0 when 1<r. The defocus z holds the relation D=2z.lambda./NA.sup.2 with the defocus amount D of real dimensions on the light axis. The term exp(i.phi.) represents the light please and .phi. is regarded as equal to 2.pi.D/.lambda.=4.pi.z/NA.sup.2.

Now, when the image plane of the original image is moved in parallel to the light axis (z) by +.beta. with the phase thereof displaced by +.DELTA..phi., the amplitude distribution thereof is given as U.sub.0 (x,z - .beta.)exp(i.DELTA..phi.). Therefore, the amplitude distribution U' (x,z) of a composite image composed of an image formed at z=+.beta. with the phase displaced by +.DELTA..phi. and an image formed at z=-.beta. with the phase displaced by -.DELTA..phi. is given as

U'(x,z)=[U.sub.0 (x,z-.beta.)exp (i.DELTA..phi.)+U.sub.0 (x,z+.beta.) exp(-i.DELTA..phi.]/2 (2)

Substituting Equation (1) into Equation (2),

U'(x,z)=exp(i.phi.)x.intg.a(f).multidot.cos (2.pi..beta.f.sup.2 -.theta./2).multidot.p.sub.0 (.vertline.f.vertline.,z).multidot.exp(2.pi.ix.multidot.f)df(3)

where .theta.=2.DELTA..phi.-8.pi..beta./NA.sup.2, which is equivalent to a net phase difference as expressed by the difference between the phase difference of the two images and the phase change caused by the change in the distance between the image planes. Comparison of Equations (1) and (3) shows that the amplitudes of the two images (with a distance 2.beta. between the image planes) formed at different positions along the light axis may be superimposed while controlling the phase difference (.theta.) of each image, by introducing cos (2.pi..beta.f.sup.2 -.theta./2) in the amplitude integration. In the case where the light source has a finite magnitude (partially coherent illumination), "a(f)" in Equation (3) may be changed to [.intg. S(s). a(f-s)ds] with S(s) as an effective light source.

The term cos (2.pi..beta.f.sup.2 -.theta./2) may be introduced into the integral of Equation (3) by either of the two methods mentioned below.

A first method consists in changing the pupil function to

p'(.vertline.r.vertline.,z)=cos (2.pi..beta.r.sup.2 -.theta./2).multidot.p.sub.0 (.vertline.r.vertline.,z) (4)

The pupil function can be regarded as a complex amplitude transmittance distribution of the pupil of the projection lens (or the aperture stop at a position conjugate therewith). As a result, in order to obtain the above-mentioned pupil function p', the amplitude transmittance distribution of the pupil or the aperture stop is set to cos (2.pi..beta.r.sup.2 -.theta./2). An outline of this method is shown as a model in FIG. 1. If a spatial filter expressed by a complex amplitude transmittance distribution

T(r)=cos (2.pi..beta.r.sup.2 -.theta./2).multidot.circ(r) (5)

is provided in the pupil or the aperture stop, it is possible to combine the amplitudes UI and UII of two images I and II formed at different positions along the light axis while controlling the phase difference between the two images. The distance between two image planes and the phase difference may be set as desired depending on the values .beta. and .theta. in Equation (5).

A second method of introducing the term cos (2.pi..beta.f.sup.2 -.theta./2) in the integral of Equation (3) consists in using a new mask pattern whose Fourier transform a'(f) becomes

a'(f)=a(f).times.cos (2.pi..beta.f.sup.2 -.theta./2) (6)

This method is briefly shown as a model in FIG. 2. The Fourier transform a(f) (See FIG. 2B) of the complex amplitude transmittance distribution A(x) of the designed mask pattern shown in FIG. 2A is determined, and the result is multiplied by cos (2.pi..beta.f.sup.2 -.theta./2).multidot.circ(r) as a'(f) (FIG. 2C). Further, the complex amplitude transmittance distribution A'(x) (See FIG. 2D) of a new mask pattern is determined by the inverse Fourier transform of a'(f). More specifically, when a mask with the amplitude transmittance distribution thereof is expressed as

A'(x)=F.sup.-1 [F{A(x)}.times.cos (2.pi..beta.f.sup.2 -.theta./2).multidot.circ(.vertline.f.vertline.)] (7)

the composite amplitude distribution of Equation (3) is obtained. Here, F[f(x)] and F.sup.-1 [g(t)] represent the Fourier transform of f(x) and the inverse Fourier transform of g(t), respectively. The distance between image planes and the phase difference can be set as desired by the values of .beta. and .theta. in Equation (7).

As shown in FIG. 2E, when a mask satisfying Equation (7) is used, it is possible to realize a satisfactory light intensity distribution with a large depth of focus as compared with the prior art (FIG. 2F). The term "circ(.vertline.f.vertline.)" in Equation (7) may be eliminated. Further, the area given as .vertline.f.vertline.>1 of the function a'(f) subjected to inverse Fourier transform may substantially take any value.

In the case of a light source having a finite capacity (partially coherent illumination), "a(f)" in Equation (1) or (3) is changed to [.intg.S(s).multidot.a(f-s)ds] with S(s) as an effective light source. In applying the present invention under (spatially) partially coherent illumination, therefore, it is necessary to determine a mask pattern whose Fourier transform a"(f) satisfies

.intg.S(s).multidot.a"(f-s)ds=.intg.S(s).multidot.a(f-s).multidot.cos (2.pi..beta.f.sup.2 .theta./2 )ds (8)

The amplitude transmittance distribution A"(x) of a desired mask pattern is given below with the equation above solved as to inverse Fourier transform.

A"(x)=F.sup.-1 [F{A(x).multidot.F.sup.-1 [S(f)]}.times.cos (2.pi..beta.f.sup.2 -.theta./2).multidot.circ(.vertline.f.vertline.)]/F.sup.-1 [S(f)](9)

In this equation, the convolution theorem relating to Fourier integration is used. By using a mask whose designed pattern is changed according to Equation (9), it is possible to obtain an effect under (spatially) partially coherent illumination similar to the one under spatially coherent illumination. Nevertheless, in the case of using Equation (9), there exists a singular point expressed as F.sup.-1 [S(f)]=0. In the case of almost coherent illumination, the singular point is situated far away from the main pattern and therefore the effect thereof may be ignored. With the decrease in spatial coherency, on the other hand, the singular point approaches the main pattern, with the result that the mask pattern becomes considerably complicated. Even when Equation (7) is used, a sufficient effect is obtained as long as the coherence of illumination is high to some degree. Desirable coherence conditions in such a case will be described later with reference to particular embodiments.

A similar effect is obtained in the case of a light source having a finite capacity by using an effective light source having an illumination distribution S' (s) satisfying

.intg.S'(s).multidot.a(f-s)ds=.intg.S(s).multidot.a(f-s).multidot.cos (2.pi..beta.f.sup.2 -.theta./2)ds (10)

as against the ordinary effective light source of partially coherent illumination.

Now, the depth of focus and the improvement in resolution by amplitude superposition described above will be explained with reference to FIG. 3.

The phase/amplitude distribution U.sub.0 and the light intensity distribution which is the square of the absolute value of the phase/amplitude distribution U.sub.0 of a projected image of a linear aperture pattern according to the prior art undergo a change in the manner shown in FIGS. 3A and 3B. This indicates that the image disappears by defocus.

On the other hand, FIGS. 3C and 3D show a similar result for the phase amplitudes U.sub.I, U.sub.II and the composite amplitude U.sub.I +U.sub.II of two images formed at z=.+-..beta. and having phases substantially opposite to each other. The phase change of the wavelength period, however, is not included.

The fact that follows becomes known from FIGS. 3C and 3D. First, a uniform amplitude distribution having a substantially opposite phase of an image defocused by (-)28 is superposed on a mount-shaped amplitude distribution of a focused image in the vicinity of each image plane. As a result, the amplitudes offset each other near the periphery of the pattern, thereby reducing the FWHM (full width at half maximum) of the amplitude (light intensity) distribution. In the neighborhood of an intermediate point between two image planes, in contrast, the amplitudes of the images defocused by .+-..beta. are superposed one on the other. Although the absolute value of amplitude remains substantially uniform, the phase is turned by about .+-.45 degrees at the center of the pattern while remaining almost unchanged at the periphery thereof. The amplitudes of the two images are thus superposed with a phase difference of about 90 degrees at the pattern center, whereas the composite amplitude is zero as substantially opposite phases are offset by each other at the periphery of the pattern. The result is that an image is formed with a smaller expansion of light intensity distribution than the original image. As a consequence, the effects of the focus latitude enhancement of the FLEX method and the phase-shifting method using a peripherally-added subphase shifter are obtained at the same time, thereby improving the depth of focus and the resolution. This is almost the case with other patterns.

The values of .beta. and .theta. (in radians) in the various equations shown above are preferably in the ranges set below.

0.3<.beta.<0.7

10.beta.-5<.theta.<10.beta.-2

Further, the desirable values of .beta. and .theta. are dependent on the pattern transferred. In the case of a periodic pattern, for example, the sign of the amplitude transmittance is preferably constant except for the outermost periphery of the pupil. This does not apply to the hole pattern or the like whose Fourier transform represents a continuous spectrum. Preferable values of .beta. and .theta. according to the pattern may be considered about those shown in the embodiments described below, for example.

The amplitude superposition described above is the simplest case. The number and the positions of planes of images to be superposed and the phase relation therebetween may be variously considered. In the case where three or more images are superposed by the use of a pupil filter, for instance, the cosine function in Equation (5) is changed to the sum of two or more distribution functions in the form of Equation (5) with an appropriate weight and having different values of .beta. and .theta.. More specifically, a general formula of the complex amplitude transmittance for securing amplitude superposition of a plurality of images is given as ##EQU1## In view of the fact that the light intensity of an image decreases extremely while the depth of focus increases with the increase in the number of image planes, however, the number of image planes is preferably two or three. In order to increase the transmittance of the optical filter, on the other hand, the value of each C.sub.i is preferably set in such a manner that the maximum value of T(r) (0.ltoreq.r.ltoreq.1) is about unity.

When the mask is illuminated with a point light source, the Fourier spectrum of the mask pattern is formed on the pupil plane. As a result, the amplitude transmittance T(r) of the pupil is equal to the coherent transmission function regarding r as the spatial frequency. An optical filter having a frequency smaller at the center than at the periphery functions as a high frequency-enhancing filter or a low frequency-suppressing filter for reducing the transmittance of lower spatial frequencies of an optical system. Depending on how to select .beta. and .theta., therefore, the imaging characteristics are affected.

In the case of a multi-focal filter in which the transmittance decreases with the increase in r, the high frequency transmission characteristics of the optical system are deteriorated, so that the contrast of a fine pattern is decreased. When a low frequency-suppressing filter having a proper transmittance distribution with the transmittance thereof smaller at the center than at the periphery is disposed at the position of the pupil in superposition with the multi-focal filter, it is possible to suppress the decrease in the image contrast while maintaining the FLEX effect.

A comparatively satisfactory result is obtained, for instance, when a low frequency-suppressing filter satisfying the relationship

T'(r)=a(r/r')+(1-a)(12)

where 0.7<a<1.0 and 0.5<r'<1.0, is superposed on a multi-focal filter satisfying the relationship T(r)=C.multidot.cos (2.pi..multidot.0.3.multidot.r.sup.2). In this case, the value C is preferably set in such a manner that the maximum value of the product of T(r) and T' (r) (0.ltoreq.r.ltoreq.1) is almost unity. Instead of superposing a low frequency-suppressing filter on a multi-focal filter, it is of course possible to use a filter having a complex amplitude transmittance equal to the product of the respective amplitude transmittances.

As an alternative to disposing a low frequency-suppressing filter at the pupil position of the projection optical system in superposition with a multi-focal filter, a low-contrast image that has been formed may be reproduced by the double diffraction method through the filter mentioned above.

Apart from the suppression of the low frequency components of the Fourier transform of a pattern in combining two or more images described above mainly with reference to the pupil filtering method, the same can be said of a method of modulating the phase amplitude transmittance of a mask.

First embodiment

A filter having a complex amplitude transmittance distribution (FIG. 4A) with .beta.=0.65 and .theta.=260.degree. in Equation (5) is inserted at the stop position (conjugate plane of the entrance pupil) determining the numerical aperture of a projection lens of a KrF excimer laser reduction projection exposure apparatus (coherence factor .sigma.=0.5) having a numerical aperture of 0.5. As a result, the focus dependence of the light intensity distribution shown in FIG. 4b is obtained for a 0.3 .mu.m hole pattern corresponding to the Rayleigh's resolution limit. A similar result obtained when lacking a filter is shown in FIGS. 5A and 5B for comparison. Comparison between FIGS. 4 and 5 shows that the insertion of the filter more than triples the depth of focus while reducing the FWHM of the light intensity distribution at the resolution limit by about 20%. The light intensity, however, decreases to one fifth of the normal level.

The above-mentioned pattern was transferred by the use of a positive-type chemically-amplified resist having a sensitivity of about 10 mJ/cm.sup.2. By regulating the exposure time, a hole pattern having a diameter of 0.22 .mu.m to 0.35 .mu.m was formed with a satisfactory section over the focal range of .+-.1.5 .mu.m. In spite of the fact that the light intensity decreased to one fifth, the exposure required only about 0.2 to 0.4 seconds.

Actual LSI contact hole patterns as shown in FIG. 6A were exposed by the use of the above-described optical system. (The numerical aperture was changed to 0.45) The resulting light intensity distributions are shown in FIGS. 6B to 6E. The insertion of a filter enables a pattern to be resolved even in the case of 1 .mu.m defocus. When the filter is lacking, on the other hand, a 1-.mu.m defocus causes the image to disappear almost entirely.

The wavelength of the exposure apparatus, the numerical aperture, the coherence conditions, the resist process used, the mask pattern feature size, etc. are not limited to those shown in the embodiments described herein. Also, the values of .beta. and .theta. are not confined to those used above. When .beta.=0.55 and .theta.=140.degree., for instance, the FWHM of the intensity profile is almost equal to the value obtained according to the prior art, while the FWHM of the intensity profile increases by about 30% when .beta.=0.35 and .theta.=0.degree.. In either case, the depth of focus increases as according to the present embodiment.

Second embodiment

A filter similar to that used for the first embodiment was fabricated as shown by a thick solid line in FIG. 7A. This filter was disposed at the conjugate plane of the entrance pupil of a projection lens as in the first embodiment to expose a mask pattern. The approximate complex amplitude transmittance distribution T'(r) shown by the solid line is given as

T=1.0 (when cos (2.pi..beta.r.sup.2 -.theta./2).gtoreq.0) or -0.6 (when cos (2.pi..beta.r.sup.2 -.theta./2)<0)

As a result, the focus dependence of the light intensity distribution as shown in FIG. 7B is obtained, thereby producing the same effect as in the first embodiment. In addition, the light intensity is increased by a factor of 1.5 as compared with the first embodiment, thus saving exposure time. In this way, Equation (5) may be appropriately subjected to discrete approximation.

There are various methods of approximation in addition to the one shown above.

In the case where a(f) (or .intg. S(s)a(f-s)ds