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Claims  |
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We claim:
1. An arrangement for coupling optoelectronic components and optical
waveguides to one another, said arrangement comprising a carrier substrate
(11); at least two elements selected from the group consisting of
optoelectronic components (9) and optical waveguides (1) to be coupled to
each other, said at least two elements being secured on the carrier
substrate (11); and at least one lens (8) provided with an essentially
planar surface and a spherical surface located opposite to said
essentially planar surface, said spherical surface having a curvature
center point; wherein the carrier substrate (11) is provided with a
depression (5) bounded by walls of said carrier substrate (11), one of the
at least one lens (8) is inserted in the depression (5) and the depression
(5) is formed so that said lens in said depression contacts the walls of
the depression (5) at points located on the spherical surface of said lens
in said depression (5) and said lens contacting said walls is supported so
as to be rotatable about the curvature center point of the spherical
surface.
2. The arrangement as defined in claim 1, further comprising means for
adjusting a position of said lens (8) in said depression (5) and means for
fixing said lens (8) in said position in said depression (5) after an
adjustment is performed by said means for adjusting, and wherein said
means for fixing said lens (8) in said position includes a portion of an
adhesive.
3. The arrangement as defined in claim 1, wherein said depression (5) is an
anisotropically etched cavity.
4. The arrangement as defined in claim 1, wherein at least one of said at
least two elements is secured in an anisotropically etched cavity in the
carrier substrate (11).
5. The arrangement as defined in claim 1, wherein the essentially planar
surface of the lens (8) in the depression (5) is inclined with respect to
a surface of the carrier substrate (11) so that, when a light beam passes
through said lens (8) in said depression (5), the light beam is deflected
to one of said at least two elements.
6. The arrangement as defined in claim 1, wherein the lens (8) in the
depression (5) has a hemispherical shape.
7. An arrangement for coupling optoelectronic components and optical
waveguides to one another, said arrangement comprising a carrier substrate
(11); at least two elements selected from the group consisting of
optoelectronic components (9) and optical waveguides (1) to be coupled to
each other, said at least two elements being secured on the carrier
substrate (11); at least one lens (8) provided with an essentially planar
surface and a spherical surface located opposite to said essentially
planar surface, said spherical surface having a curvature center point,
wherein the carrier substrate (11) is provided with a depression (5)
bounded by walls of said carrier substrate (11), one of the at least one
lens (8) is inserted in the depression (5) and the depression (5) is
formed so that said lens (8) in said depression (5) contacts the walls of
the depression (5) at points located on the spherical surface of said lens
in said depression (5) and said lens in said depression (5) includes means
for directing a light beam passing through said lens in said depression by
refraction; and means for rotatably supporting said lens (8) in the
depression (5) so that said lens is rotatable in said depression (5).
8. The arrangement as defined in claim 7, further comprising means for
adjusting a position of said lens (8) in said depression (5) and means for
fixing said lens (8) in said position in said depression (5) after an
adjustment is performed by said means for adjusting, said means for fixing
said lens (8) in said position including a portion of an adhesive.
9. The arrangement as defined in claim 7, wherein said depression (5) is an
anisotropically etched cavity.
10. The arrangement as defined in claim 7, wherein at least one of said at
least two elements is secured in an anisotropically etched cavity in the
carrier substrate (11).
11. The arrangement as defined in claim 7, wherein the essentially planar
surface of the lens (8) in the depression (5) is inclined with respect to
a surface of the carrier substrate (11) so that, when a light beam passes
through said lens (8) in said depression (5), the light beam is deflected
to one of said at least two elements.
12. The arrangement as defined in claim 7, wherein the lens (8) in the
depression (5) has a hemispherical shape.
13. An arrangement for coupling optoelectronic components and optical
waveguides to one another, said arrangement comprising a carrier substrate
(11); a plurality of elements selected from the group consisting of
optoelectronic components (9) and optical waveguides (1) to be coupled to
each other so that a light beam is passed between at least two of the
elements, each of said elements being secured on the carrier substrate
(11); and a lens (8) provided with an essentially planar surface and a
spherical surface located opposite to said essentially planar surface so
as to be able to direct said light beam when said light beam passes
through said lens (8) by refraction, said spherical surface having a
curvature center point;
wherein the carrier substrate (11) is provided with a depression (5)
bounded by walls of said carrier substrate (11), said lens (8) is inserted
in said depression (5), said depression is formed so that the lens (8)
contacts the walls of the depression (5) at points located on the
spherical surface of said lens (8), said lens (8) is supported in the
depression (5) so as to be rotatable about the curvature center point of
the spherical surface and said lens (8) and said depression (5) are
positioned in said carrier substrate (11) so that said lens (8) receives
said light beam from one of said elements and directs said light beam to
another of said elements.
14. The arrangement as defined in claim 13, further comprising at least one
other lens (8) for coupling two others of said elements, said at least one
other lens (8) provided with an essentially planar surface and a spherical
surface with a curvature center point located opposite to said essentially
planar surface so as to be able to direct said light beam when said light
beam passes through said at least one other lens; wherein the carrier
substrate (11) is provided with at least one other depression (5) bounded
by other walls of said carrier substrate (11), said at least one other
depressions (5) accommodating the at least one other lens (8) and being
formed so that the at least one other lens (8) held therein contacts the
other walls at points located on the spherical surface of said at least
one other lens (8) held therein and said at least one other lens (8) is
supported in said carrier substrate (11) so as to be rotatable about the
curvature center point.
15. The arrangement as defined in claim 14, wherein said at least one other
lens (8) has a hemispherical shape.
16. An arrangement for coupling optoelectronic components and optical
waveguides to one another, said arrangement comprising a carrier substrate
(11) having walls and provided with a depression (5) bounded by said
walls;
at least two elements selected from the group consisting of optoelectronic
components (9) and optical waveguides (1) to be coupled to each other,
said at least two elements being secured on the carrier substrate (11);
at least one lens (8) provided with an essentially planar surface and a
spherical surface located opposite to said essentially planar surface,
said spherical surface having a curvature center point, wherein one of the
at least one lens (8) is inserted in the depression (5) and the depression
(5) is formed so that said lens (8) in the depression contacts the walls
of the depression (5) at points located on the spherical surface of said
lens in said depression (5) and said lens in said depression (5) includes
means for directing a light beam passing through said lens in said
depression by refraction; and
means for fixing said lens (8) in a position in said depression (5) after
an adjustment is performed by means for adjusting lens position, wherein
said means for fixing said lens (8) in said position is a portion of an
adhesive.
17. The arrangement as defined in claim 16, wherein said depression (5) is
an anisotropically etched cavity.
18. The arrangement as defined in claim 16, wherein at least one of said at
least two elements is secured in an anisotropically etched cavity in the
carrier substrate (11).
19. The arrangement as defined in claim 16, wherein the lens (8) in the
depression (5) has a hemispherical shape.
20. The arrangement as defined in claim 16, wherein said at least two
elements comprise a semiconductor laser and one of said optical wave
guides coupled to each other by said lens in said depression. |
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Claims  |
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Description  |
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BACKGROUND OF THE SPECIFICATION
The invention relates to an arrangement for coupling optoelectronic
components and optical waveguides to one another using a carrier
substrate, at least one optoelectronic component or one optical waveguide
being secured on the carrier substrate and at least one lens being
provided which has an essentially planar surface and a spherical surface
located opposite the planar surface.
German Published Patent Application DE 35 43 558 A1 discloses an
optoelectronic coupling arrangement in which light conducted through an
optical waveguide is coupled to a photo-detector. Optical waveguide and
photodetector are secured on a carrier substrate. The coupling is carried
out via an optical deflection component. The depressions for mounting the
optical components can be produced, for example, by anisotropic etching.
If the light emerging from the optical waveguide has a large angular
divergence, a low-loss coupling to the photodetector can be achieved by a
lens. In the above-mentioned published patent application in the proposed
arrangement a hemispherical lens is arranged between the optical waveguide
and the photodiode. The planar surface of the hemispherical lens is
constructed as a deflection element and the lens is simultaneously used
for focusing.
For focusing the beam, it is also known to use Fresnel lenses or spherical
lenses. The production of Fresnel lenses on a carrier substrate, for
example a silicon surface, requires an increased expenditure with
additional process steps. However, Fresnel lenses have the advantage of a
flat structure. Spherical lenses can be inserted into anisotropically
etched depressions which are produced during the micromechanical
structuring, necessary anyway, of the carrier material. They have the
disadvantage that either they project beyond the substrate surface or, in
relation to the optically effective surface, they need very large
depressions to accommodate them, as a result of which the assembly of the
photodiode is impaired.
Whereas, in the case of an optical waveguide-photodiode coupling, because
of the relatively large tolerances, a purely passive adjustment is
possible using mounting structures made from anisotropically etched
silicon, in the case of coupling an optical waveguide to a laser, a
sufficiently high accuracy cannot be achieved by passive adjustment using
the anisotropic etching technique. To achieve a coupling between laser and
optical waveguide, at a high input coupling efficiency, an imaging optics
unit is necessary because of the mode field diameters of different sizes.
Adjustment between optical waveguide and laser should be possible.
SUMMARY OF THE INVENTION
It is the object of the invention to provide an arrangement for coupling
optoelectronic components and optical waveguides to one another which is
simply constructed and is adjustable.
The object is achieved by means of an arrangement for coupling
optoelectronic components and optical waveguides to one another comprising
a carrier substrate; at least two elements selected from the group
consisting of optoelectronic components and optical waveguides to be
coupled to each other and secured on the carrier substrate and at least
one lens provided with an essentially planar surface and a spherical
surface located opposite to the essentially planar surface and having a
curvature center point. The carrier substrate is provided with a
depression bounded by walls of the carrier substrate, one lens is inserted
in the depression and the depression is formed so that the lens in the
depression contacts the walls of the depression at points located on the
spherical surface of the lens in the depression. The lens in the
depression has means for directing a light beam passing through the lens
by refraction.
Advantageously means for rotatably supporting the lens in the depression is
provided so that the lens is rotatable in the depression. If the
depression has suitably formed walls the spherical surface of the lens
rests at three points on its surface on the walls and the lens is
rotatable about the center of its spherical surface. A hemispherical lens
is preferred.
The arrangement advantageously includes means for adjusting a position of
the lens in the depression and means for fixing the lens in position after
adjustment, which can be an adhesive.
In preferred embodiments of the invention the depression is an
anisotropically etched cavity and one of the at least two elements is
secured in an anisotropically etched cavity in the carrier substrate.
Advantageously the essentially planar surface of the lens in the
depression is inclined with respect to a surface of the carrier substrate
so that, when a light beam passes through the lens in the depression, the
light beam is deflected to one of the elements.
By using a lens having an essentially planar surface and having a spherical
surface located opposite the latter, the arrangement according to the
invention has the capability of simultaneously shaping and directing or
aligning light beams. The lens described can, for example, be designed to
be of spherical cap shape or hemispherical shape. A spherical or
cylindrical curvature of the essentially planar surface, with a radius of
curvature which is very large in relation to that of the spherical
surface, is also acceptable (this is what is meant by an essentially
planar surface). The lens is located with the spherical side in a
depression, for example an anisotropically etched cavity, of the carrier
substrate. In this depression, the lens is supported so as to be rotatable
about the center point of the curvature of its spherical surface. It can
be adjusted first and then fixed in position, e.g. by an adhesive. The
lens described can be used in various applications: for example for
focusing a light beam emerging from an optical waveguide into the active
surface of a photodiode, or for the distribution of optical signal paths
from a light-emitting board into a light-receiving board. The transmitting
elements in the light-emitting board can either be semiconductor lasers or
optical waveguides in this arrangement. The receiving elements in the
optical light-receiving board can either be optical waveguides or
receiving diodes in this arrangement. In this case, the lens has the
ability to direct a light beam passing through it by refraction. An
additional application is the coupling of semiconductor lasers and optical
waveguides. An adjustability of the optical coupling device is
advantageously provided by controlled tilting of the hemispherical lens
relative to the substrate.
BRIEF DESCRIPTION OF THE DRAWING
The objects, features and advantages of the present invention will now be
illustrated in more detail by the following detailed description,
reference being made to the accompanying drawing in which:
FIG. 1 is a cross-sectional view through a substrate on whose one side an
optical waveguide is mounted and on whose other side a photodiode is
fitted,
FIG. 2 is a detailed cross-sectional view showing the position of the lens
in the depression with angles of inclination,
FIG. 3 is an additional detailed cross-sectional view showing an example of
a position of the lens in a depression for reflecting light from a planar
surface of the lens,
FIG. 4 is a cross-sectional view of an arrangement for distributing optical
signal paths between a light-emitting board and a light-receiving board,
and
FIG. 5 is a cross-sectional view through another embodiment of the
arrangement according to the invention comprising a device for coupling a
laser and an optical waveguide.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
FIG. 1 shows an exemplary embodiment of the arrangement for coupling
optoelectronic components and optical waveguides according to the
invention. A Gaussian beam of light 2 emerging from a fiber 1 is deflected
obliquely upwards at an angle of 6.8.degree. to the wafer normal after
refraction at an etched surface 4. On the substrate upper side, the beam
is incident on an anisotropically etched cavity or depression 5 having a
level base surface 6, into which a hemispherical lens 8 is inserted and
fixed. The hemispherical lens focuses the light beam 2 into a photodiode
9. The light beam 2, which has been divergent until this point, is formed
into a convergent beam of light 7 by the hemispherical lens 8. The
hemispherical lens 8 has a radius and refractive index such that the image
point of the convergent beam falls just in the active zone 10 of the
photodiode 9. Since, in accordance with the arrangement in FIG. 1 for the
imaging of the fiber core on the active surface of the photodiode, the
image distance is smaller than the object distance, the diameter of the
image spot is also smaller than the diameter of the fiber core. Even
taking into account the aspheric distortion of the hemispherical lens, the
spot diameter in the case of this imaging is smaller than 10 .mu.m.
Therefore, even in the case of very small-area photodiodes having an
active surface of 30 .mu.m, a lateral assembly tolerance of 10 .mu.m in
any direction is still permissible.
A further advantageous property of the hemispherical lens consists in the
ability not only to focus or to collimate a divergent beam, but also to
adjust it in its direction. The geometric considerations here are
explained via FIG. 2. A light beam, represented by its central beam 21, is
incident on the spherical side of a hemispherical lens 8. This central
beam, according to the invention, is aligned so that it runs through the
center point M of the hemispherical lens. The hemispherical lens 8 is
supported in a depression 5 of a carrier plate 11, the spherical surface
of the hemisphere resting on the side walls of the depression. By this
type of support, the hemispherical lens can be tilted in two spatial
directions, the center point M of the sphere remaining spatially fixed
with respect to the carrier plate 11 and the incident light beam 21. The
light refraction at the spherical surface of the hemispherical lens is
therefore not altered during the tilting. If the beam diameter of the
incident light beam is located on the focal surface of the hemispherical
lens, the beam of light is then collimated within the hemispherical lens.
The focal surface Bf is formed by a hemispherical shell, which has the
radius r, around the center point M of the sphere. The focal radius
r.sub.f for beams close to the center point is calculated to be
r.sub.f =n.sub.1 *r/(n.sub.1 -n.sub.0) (1)
where n.sub.1 is the refractive index and r is the radius of the hemisphere
and n.sub.0 is the refractive index in external space.
If the lens is oriented in its tilted position in just such a way that the
surface normal of its base plane is parallel to the central ray of the
incident beam, the beam emerging from the lens is then not refracted. In
the case of a tilting of the direction of the normal with respect to the
incident central beam, an angular tilting of the emerging beam results
from the light refraction, because of the Snellius law of refraction. In
the process, a beam of light which is parallel in the lens interior
remains parallel. In this way it is possible not only to produce a
collimated beam but also to adjust it arbitrarily in terms of its beam
direction in a two-dimensional angle range, within specific limits which
are given by the refractive index of the hemispherical lens and the
adjustment range of the lens mounting.
For calculation of the beam direction before and after passing through the
hemispherical lens, the relationships given in the following text apply.
Here, the variables within the hemispherical lens are designated by the
subscript 1 and the variables in the external space adjacent to the base
plane of the hemispherical lens are designated by the subscript 2. The
variables in the external space which adjoins the spherical hemisphere
side receive the subscript 0. The angles between the substrate plane and
the beam direction are designated as direction angles .tau.. The angles
between the normal to the base surface of the spherical lens and the beam
direction are designated as angles of incidence .beta.. The angle
.epsilon. is the tilt angle of the lens, that is the angle between the
surface normals of the substrate and the hemisphere base surface. The
refractive indices are designated by n. The following relationships are
obtained:
.beta..sub.1 =.epsilon.-.delta..sub.1 (2)
.beta..sub.2 =.epsilon.-.delta..sub.2 (3)
sin .beta..sub.2 /sin .beta..sub.1 =n.sub.1 /n.sub.2 (4)
.tau..sub.1 =90.degree.+.delta..sub.1 (5)
.tau..sub.2 =90.degree.+.delta..sub.2 (6)
.tau..sub.1 =.tau..sub.0 (7)
By stipulating the tilt angle .epsilon. and a direction angle .tau..sub.2
of an incident beam, the direction angle .tau..sub.0 of the emergent beam
can be calculated using equations (2-7) and vice versa. On the other hand,
the necessary tilt angle .epsilon. can be calculated from the given
direction angles .tau..sub.0 and .tau..sub.2. The equations specified here
are derived, using FIG. 2, for a beam course in the drawing plane of FIG.
2. However, since incident and refracted beam always lie in one plane, the
plane of incidence, which contains the surface normal of the base plane of
the hemispherical lens and the incident and emergent beams, the above
equations are true for any beam directions, even outside the plane of the
drawing of FIG. 2, since in this general case a drawing plane can always
be found which lies in the plane of incidence.
Apart from the ability to direct a light beam by refraction, the
hemispherical lens can also direct the beam by reflection. To explain
this, reference is made to FIG. 3, in which a particular application is
shown. A semiconductor laser 50 is mounted on a carrier 11, preferably an
anisotropically etched silicon substrate, the silicon substrate being used
simultaneously as a very effective heat sink and as a carrier of the
conductive track structure for driving and contacting the laser (not drawn
here). A depression 5, into which a hemispherical lens is inserted, is an
anisotropically etched cavity in the carrier or substrate 11 in front of
the laser. The size and position of the depression determine the position
of the center point M of the sphere whose spherical surface includes the
spherical surface on the hemispherical lens and whose radius is equal to
that of the hemispherical lens. The height of the center point of that
sphere is selected such that it is located at the height of the active
zone of the laser. Likewise, the position of the depression is selected so
that M is located on the optical axis of the divergent beam of light 51
emerging from the laser. Here, differing from FIG. 2, the base plane of
the hemispherical lens is inclined significantly more steeply with respect
to the incident beam 51 and both the incident beam 51 and the emergent
beam 52 penetrate the spherical side 81 of the hemispherical lens.
According to the invention, when the angle between the normal of the base
surface and the rays of the incident beam, taking into account the
refraction of the edge rays of this beam, is greater than the limiting
angle of total reflection, all the light is totally reflected at the base
surface. When the angle of incidence on the base surface is smaller than
the limiting angle of total reflection, the base surface, likewise
according to the invention, can be silvered to produce reflection. The
focal radius r.sub.f is reduced to one half, with respect to the
calculation in accordance with equation 1, because of the twofold light
refraction at the spherical surface.
For photonic applications for coupling numerous input and output signal
paths, such as are needed, for example, in switching networks or in neural
networks, the process according to the prior art is carried out such that
a plurality of output paths are applied in a sub-switching plane and a
plurality of sub-switching planes are then arranged one above the other so
that a two-dimensional spatially staggered output element is present, in
which there are n.times.m light outputs in an exit plane in a particular
two-dimensional scanning grid. The divergent beams of radiation emerging
from these light outputs are collimated in one planar structure mounted in
front of the beams, for example via Fresnel lenses, and in a second planar
structure located directly thereafter, for example by holograms, a
two-dimensional deflecting structure converted into preselected directions
and a provided focusing structure, which directs the light beam into the
photodiodes of the respective receiving paths. The receiving paths are
again arranged in sub-switching planes stacked onto one another, similarly
to the transmitting paths. In this arrangement according to the prior art,
it is disadvantageous that a very high geometric precision must be
achieved in the arrangement of the sub-switching planes with respect to
one another, of the imaging and deflecting planar structures with respect
to one another and of these structures with respect to the input and
output stacks of the sub-switching planes.
According to the invention, the beam-shaping and beam-directing tasks of
the planar structures can be performed together by a hemispherical lenses.
An exemplary embodiment for this according to the invention is shown in
FIG. 4. A light-emitting board 60 contains, in a two-dimensional periodic
arrangement on its upper side 61, a number of n.times.m hemispherical
lenses 68, which are seated in depressions 65 and which are capable of
collimating and directing the beam. On the underside 62, there are
waveguides, whose beams of light, as described under application 1, are
deflected by refraction and/or reflection approximately perpendicular to
the substrate plane. By orienting the base surfaces of the hemispherical
lenses, each of the n.times.m light beams can be individually directed.
Instead of the waveguides, semiconductor lasers, as shown in FIG. 3, can
also be mounted on the underside of the substrate, the light from these
lasers being collimated and directed as described above. The receiving
side is constructed in accordance with the transmitting side. A receiving
board 70 contains on its underside a number of n.times.m hemispherical
lenses 78 in depressions 75. These hemispherical lenses 78 direct the
collimated beams of light directed onto them, by corresponding inclination
of their base surfaces, perpendicular to the substrate plane and focus the
light beams. Either optical waveguides or receiving diodes are mounted on
the upper side 72. In relation to the arrangement according to the prior
art, the specified solution according to the invention has the following
advantages: The tasks of beam shaping and beam alignment are combined in
one component, the hemispherical lens. Instead of 2.times.m sub-switching
planes, only one transmitting and one receiving board are necessary.
It is not necessary for 2.times.m sub-switching planes and 4 beam shaping
or beam deflecting planes to be adjusted with respect to one another, but
rather only one receiving board with respect to one transmitting board.
Adjustment of the two boards with respect to each other can be carried out
purely passively in this arrangement by anisotropically etched depressions
64 and 74 and adjusting elements 67 inserted into these. If the adjustment
depressions are produced in the same anisotropic etching process as the
depressions 65 and 75, a high accuracy of the alignment is then achieved.
The alignment of the hemispherical lenses can be achieved together for all
the lenses using a suitably formed adjusting device or gauge, which rests
on the base surfaces of the lenses during the fixing process. For other
path couplings, only another gauge must be used.
Whereas in the case of an optical waveguide-photodiode coupling, because of
the relatively large tolerances (see also application 1 with lateral
tolerances of 10 .mu.m), a purely passive adjustment is possible using
mounting structures made of anisotropically etched silicon, in the case of
coupling an optical waveguide to a laser a sufficiently high accuracy
cannot yet be achieved for a passive adjustment using the anisotropic
etching technique or even using other methods in accordance with the prior
art and even in the future can probably only be achieved with a very large
expenditure, since the laser requires a positional accuracy in the
sub-micrometer range because of its low mode field diameter of about 1
.mu.m. To achieve a good coupling between laser and optical waveguide, an
imaging optics unit is necessary because of the mode field diameters of
different sizes. According to the prior art, at least in the sensitive
directions perpendicular to the beam direction, an adjustment in the plane
of the end face of the optical waveguide is necessary. Here, an active
flange adjustment of the optical waveguide is normally carried out. Since
the adjustment plane lies perpendicular to the beam direction, the planar
construction of a module must be supplemented by a flange plane located
perpendicular to the substrate plane, which means an additional assembly
cost.
The cost for assembly and adjustment can be significantly reduced by using
an arrangement or adjusting device according to FIG. 5. A substrate 11
carries a semiconductor laser 50, mounted directly thereon. Etched in
front of the semiconductor laser is a depression 5 which holds a
hemispherical lens 8 which, in accordance with the embodiments of FIG. 3,
has a large angle of inclination .epsilon. of about 45.degree. with
respect to the substrate surface. The beam 51, 52, shaped and directed by
the hemispherical lens 8, is totally reflected and refracted,
respectively, at the surfaces 91 and 92 and is incident on the end face of
an optical waveguide 93. Apart from the surfaces 91 and 92, any other
suitable beam deflection device can be used for beam deflection, with
whose aid the beam can be deflected out of the virtually vertical
direction into a virtually horizontal direction, for example a mirrored
surface. The optical waveguide 93 can either be a fiber optic guide which
is inserted into an anisotropically etched V-groove 94 or can be a strip
light wave guide. By anisotropic structuring of the upper and lower side
of the substrate, using markings 95 as positioning aids for the laser and
a mounting 94 for the optical waveguide, and by means of the high accuracy
of the beam deflecting surfaces 91 and 92 produced by anisotropic etching,
a pre-positioning of these optical components results. However, as
explained above, the accuracy is still not sufficient. For an adjustment
according to the invention, the optical waveguide is not then moved, as is
normally done in accordance with the prior art, until an optimum coupling
is achieved but rather the optical waveguide remains in its fixed
position, just as the laser remains fixed. Instead, according to the
invention, the image, of the laser, generated by the hemispherical lens is
adjusted via the end face of the optical waveguide until an optimum
coupling has been achieved. For this purpose the angular orientation of
the base surface of the hemispherical lens relative to the substrate is
changed which, because of the reflection of the beam of light at the base
surface, leads to a pivoting of the reflected beam 52 and thus to a
movement of the image point on the end face of the optical waveguide.
Since the incident beam 51 is directed onto the center point M of the
sphere, only the beam direction changes during the adjustment, but not the
imaging properties of the lens.
Instead of tilting the hemispherical lens with respect to a stationary
substrate, the lens can also be held stationary and the substrate tilted
for this purpose. In FIG. 5, an adjustment device according to the
invention is shown. The substrate 11 is seated on a goniometer table 101,
102 which can be pivoted in the angles .theta..sub.x and .theta..sub.y and
whose axes of rotation R.sub.x and R.sub.y intersect at right angles at a
point M.sub.R. An XY-table 103, 104 placed on the goniometer table moves
the substrate before the adjustment in such a manner that the center point
M of the sphere of the hemispherical lens 8 falls in the center point
M.sub.R of the rotation. Before the adjustment, the goniometer table is
brought into the horizontal position and the hemispherical lens is held
using a tube 100, for example by vacuum suction, and pressed with a gentle
force into the depression 5, the tube being oriented at an angle of
approximately 45.degree. to the wafer normal. For the subsequent fixing,
an adhesive, preferably an adhesive which can be hardened using UV light,
can be used, which can already be introduced into the depression 5 before
the fixing. The adhesive can also entirely occupy the space underneath the
lens between lens and carrier material, preferably silicon. To calculate
the lens refractive power (see equation 1), the refractive index of the
adhesive must then accordingly be used. By tilting the goniometer table in
a two-dimensional angle range, the beam can now be pivoted to achieve an
optimum coupling efficiency. Using normal goniometer tables, an angular
resolution of 0.001.degree. can be achieved. In the case of a light path s
corresponding to the substrate thickness of 500 .mu.m, a pivoting angle
.DELTA..epsilon. of 0.001.degree. results in a deflection of the image
point .DELTA.x of
.DELTA.x=2.multidot.s.multidot.tan(.DELTA..epsilon.)=0.017 .mu.m.(8)
This adjustment is therefore at least as accurate as conventional lateral
displacement tables having an accuracy of typically 0.1 .mu.m. Since the
hemispherical lens during the adjustment always rests with its spherical
surface on the side surfaces of the depression 5, no deadjustment is to be
expected during the subsequent fixing. Adhesive friction, which can easily
lead to a disturbing jerky movement during adjusting in the case of the
conventional flange method, is not to be feared here, since the adhesive
is liquid during the adjustment and a fluid friction free of adhesive
friction is therefore present.
A further advantage of the adjustment method according to the invention is
that the adhesive is not located between metallic flange surfaces but
between the optically transparent hemispherical lens and the silicon. For
this reason, above all, only an adhesive which can be hardened using light
can be used. The UV light necessary for hardening is beamed through the
lens onto the adhesive. An optical waveguide 105 for UV light can
preferably be simultaneously guided in the tube 100 which is used for
holding the lens fast. After achieving the optimum adjustment position,
the UV light is directed, via the optical waveguide located in the tube,
through the base surface of the hemispherical lens, which is transparent
to the beams 51, 52 in the case of perpendicular incidence, in contrast
with its total reflection, through to the adhesive locations on the
spherical side of the hemispherical lens.
To automate the adjustment and fixing process, even for modules having a
plurality of lasers on one substrate, the tube 100 can pick up the
hemispherical lenses from a storage container by vacuum suction, and, in
conjunction with an axial movement device for the tube and with the X-Y
tables 103, 104, place them in the corresponding depressions 5.
Normally, semiconductor lasers have no circular symmetrical mode field like
optical fibers, but an elliptical mode field. In particular, the high
power lasers which are used for the pumping of optical fiber amplifiers
have an elliptical near field with an axis ratio of about 3:1. With the
image in the circular-symmetrical field of a fiber, an optimum coupling
cannot be achieved using a circular-symmetrical lens. This optimum
coupling would, however, be of extraordinary importance just in this
application. Recent proposals for solving this problem provide a
cylindrical lens which is placed transversely in front of a
circular-symmetrical lens. Even if an improved coupling efficiency can be
achieved by this method, this method has the disadvantage that the
additional optical component must be adjusted.
By a slight modification of the hemispherical lens, this problem can also
be solved in a simple way. For this purpose, the previously flat base
surface of the hemispherical lens is cylindrically machined. This can
either be carried out by grinding and polishing the base surface
cylindrically or by pressing the base surface via a suitably shaped die
during heating above the softening temperature. This pressing method is
used at present in the production of aspherical lenses. By suitable
shaping of the pressing tool, the base surface can also be shaped such
that, apart from the cylindrical component for matching an elliptical mode
field to a circular-symmetrical mode field, an aspherical component for
reducing or preventing the spherical distortions through the sphere
surfaces can additionally be achieved. Likewise, an additional beam
correction or an effect on the beam can be achieved by applying a Fresnel
structure to the base surface of the lens. The shaping of the base surface
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