A headphone having ear pieces joined by a head band with an electrical cable interconnecting the ear pieces, including a first plurality of outward opening grooves in the head band and a second plurality of inward opening grooves in the head band, with the first and second grooves alternately positioned along the head band defining a path for the electrical cable between the ear pieces. Preferably the grooves are formed integrally with the head band, with the portions of the head band forming the grooves projecting from the head band with the grooves in alignment with each other. The headphone may also include a comfort sling underlying the head band and connected at each end to the head band.
