A chemical-mechanical polishing apparatus includes a wafer carrier with a very low center of gravity which allows pressure to be applied evenly on a wafer being polished. The wafer carrier includes top, center, and bottom mating subassemblies with only the center and bottom subassembly or wafer holder actually rotating. The bottom of the central subassembly and the top of the bottom subassemblies are shaped as negative and positive, mating truncated pyramids with a downward extension at the center axis of the central subassembly which terminates in a ball in a recess in the top of the lower subassembly. The ball is positioned as low as possible to provide a very low center of gravity to ensure even pressure distribution over a wafer being polished. The truncated pyramidal shapes are to provide a geometry which exhibits a rigid structure with incrementally decreasing mass with distance from the central axis.

An apparatus and a method for off-line pre-conditioning a conditioning disc that is used in a chemical mechanical polishing process are provided. In the apparatus, an upper platform for mounting a conditioning disc thereto and a lower platform for mounting a polishing pad thereto are engaged together under a pre-set pressure and rotated in opposite directions for a pre-set length of time. The apparatus is effective in removing loose particles from the surface of the conditioning disc such that the possibility of any such particles causing scratches on a wafer surface during a subsequently conducted chemical mechanical polishing process is eliminated. The present invention novel apparatus can be used off-line for pre-conditioning a conditioning disc such that valuable machine time of a chemical mechanical polishing apparatus is not wasted.

A polishing pad conditioner for a chemical-mechanical polishing apparatus includes a conditioning plate having a first recess and a holder having a second recess. The first recess is formed on the upper face of the conditioning plate, and the second recess is formed on the bottom face of the holder. A first filling member having a specific gravity smaller than that of the conditioning plate fills up the first recess, and a second filling member having a specific gravity smaller than that of the holder fills up the second recess. Therefore, the weight of the polishing pad conditioner can be reduced, and the durability and service life of an air bladder that adjusts the height of the polishing pad conditioner can be improved.

A conditioner assembly and a conditioner back support for conditioning a polishing pad of a chemical mechanical polishing device. The conditioner assembly comprises a conditioning head having a gimbal assembly, a shaft engaged to the conditioning head, and a linear torque bearing assembly slidably receiving the shaft. The linear torque bearing assembly is configured to operatively rotate the shaft assembly contemporaneously with allowing the shaft to extend and retract from a first open end of the linear torque bearing assembly. The conditioner assembly additionally comprises a bellows secured over the first open end and engaged to the conditioning head and a bearing housing disposed over a second open end of the linear torque bearing assembly. The bearing housing rotatably supports the linear torque bearing assembly such that a motor assembly can operatively drive the linear torque bearing assembly, the shaft, and the conditioning head. The conditioner back support respectively opposes the conditioner assembly such that the polishing belt supporting the polishing pad is disposed intermediate to the conditioner back support and the conditioner assembly. The conditioner back support comprises a frame assembly which adjustably support a backing plate. The frame assembly comprises a positioning assembly which allows a user to adjust the position of the backing plate. The position of the backing plate can be adjusted such that a front surface of the backing plate is parallel to and disposed on or proximal to a plane defined by a backside of the polishing belt. As a result, when the conditioner assembly compresses against the polishing pad, the polishing pad does not significantly deflect. The conditioner back support further includes a polymeric compound disposed on the front surface of the backing plate for reducing the frictional force between the backing plate and the polishing belt.

A method and apparatus for resurfacing a polishing pad using non-abrasive techniques. These techniques include shaving, milling, or planing the upper working surface of the polishing pad using an edged cutting tool to alter the microtexture and micro-topology of the surface to produce a desired surface contour or planarity. This precise conditioning of the microscopic features of the polishing pad surface controls dishing in workpieces during polishing.