Microelectronic module having optical and electrical interconnects

Claims

That which is claimed:

1. A microelectronic module comprising:

an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips;

a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip;

a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means;

wherein at least one of said optical transmitting means and said optical detecting means is formed in one of said integrated circuit chips.

2. The microelectronic module of claim 1 wherein at least one of said optical transmitting means and said optical detecting means is on said substrate.

3. The microelectronic module of claim 1 wherein said hologram directs said first optical beam to produce said second optical beam therefrom.

4. The microelectronic module of claim 1 further comprising a heat sink positioned on said array of integrated circuit chips on a surface thereof opposite said predetermined surface.

5. A microelectronic module comprising:

an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips;

a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip;

a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means;

wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

6. A microelectronic module comprising:

an array of integrated circuit chips each having and an array of electrical contact pads on a predetermined surface thereof;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to at least one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to at least one of said integrated circuit chips;

a substrate overlying the surfaces of said array of integrated circuit chips, said substrate permitting passage therethrough of the first and second optical beams;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on a respective underlying integrated circuit chip;

a pattern of electrical interconnection lines on said substrate to electrically interconnect predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means;

wherein said optical transmitting means comprises an edge-emitting laser.

7. The microelectronic module according to claim 6 further comprising a mirror positioned opposite said edge-emitting laser for directing the first optical beam from said edge-emitting laser through said substrate.

8. A microelectronic module comprising:

a substrate;

an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof;

optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips;

optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips;

a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means;

wherein said first optical beam emerges from said microelectronic module in a position which is determined by the hologram and solder bumps and wherein said second optical beam originates from external to said microelectronic module and is aligned to the microelectronic module by the hologram and solder bumps.

9. The microelectronic module according to claim 8 further comprising a heat sink positioned on said array of integrated circuit chips on a surface thereof opposite said predetermined surface.

10. The microelectronic module of claim 8 wherein at least one of said optical transmitting means and said optical detecting means is on said substrate.

11. The microelectronic module of claim 8 wherein at least one of said optical transmitting means and said optical detecting means is formed in one of said integrated circuit chips.

12. A microelectronic module comprising:

a substrate;

an array of integrated circuit chips each having a predetermined surface positioned on said substrate, each of said integrated circuit chips including an array of electrical contact pads on the predetermined surface thereof;

optical transmitting means for generating a first optical beam through said substrate, said optical transmitting means being electrically connected to at least one of said integrated circuit chips;

optical detecting means for receiving a second optical beam through said substrate, said optical detecting means being electrically connected to at least one of said integrated circuit chips;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on said substrate corresponding to the array of electrical contact pads on respective integrated circuit chips;

a pattern of electrical interconnection lines on said substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said substrate and the respective electrical contact pad on the underlying integrated circuit chip, to establish an electrical connection between the electrical contact pad on the substrate and the electrical contact pad on the underlying integrated circuit chip and to optically align said integrated circuit chips with respect to said substrate such that said first optical beam which is generated by said optical transmitting means is optically aligned to said substrate and said second optical beam which is received by said optical detecting means from said substrate is optically aligned to said optical detecting means;

wherein said optical transmitting means comprises an edge-emitting laser.

13. The microelectronic module according to claim 12 further comprising a mirror positioned opposite said edge-emitting laser for directing the optical beam from said edge-emitting laser through said substrate.

14. A microelectronic module comprising:

a first substrate;

an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips;

a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip;

a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means;

wherein at least one of said optical transmitting means and said optical detecting means is formed in at least one of said first and second integrated circuit chips.

15. The microelectronic module of claim 14 wherein at least one of said optical transmitting means and said optical detecting means is on at least one of said second and said third substrates.

16. The microelectronic module of claim 14 wherein said hologram directs said first optical beam to produce said second optical beam therefrom.

17. The microelectronic module of claim 14 wherein said first optical beam emerges from said microelectronic module and wherein said second optical beam originates from external to said microelectronic module.

18. A microelectronic module comprising:

a first substrate;

an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips;

a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip;

a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means;

wherein said hologram is integrated into at least one of said second and third substrates.

19. A microelectronic module comprising:

a first substrate;

an array of integrated circuit chips each having a first surface positioned on said first substrate, each of said integrated circuit chips including an array of electrical contact pads on a second surface thereof opposite said first surface;

optical transmitting means for generating a first optical beam, said optical transmitting means being electrically connected to a first one of said integrated circuit chips;

optical detecting means for receiving a second optical beam, said optical detecting means being electrically connected to a second one of said integrated circuit chips;

a second substrate and a third substrate overlying respective second surfaces of said first and second integrated circuit chips, said second and third substrates permitting passage therethrough of the first optical beam from said optical transmitting means and of the second optical beam to said optical detecting means;

a hologram positioned in the path of at least one of said first and second optical beams for directing the at least one of said first and second optical beams;

an array of electrical contact pads on each of said second and third substrates corresponding to the array of electrical connection pads on the respective underlying first and second integrated circuit chip;

a pattern of electrical interconnection lines on said first substrate for electrically interconnecting predetermined ones of said array of integrated circuit chips; and

a solder bump between each electrical contact pad on said second and third substrates and the respective electrical contact pad on the underlying integrated circuit chips, to establish an electrical connection between the electrical contact pad on the integrated circuit chip and the electrical contact pad on said second and third substrates and to optically align said first integrated circuit chip and said second integrated circuit chip, with respect to said second and third substrates such that said first optical beam which is generated by said optical transmitting means is optically aligned to said second substrate and said second optical beam which is received by said optical detecting means from said third substrate is optically aligned to said optical detecting means;

wherein said optical transmitting means comprises an edge-emitting laser.

20. The microelectronic module according to claim 19 further comprising a mirror positioned opposite said edge-emitting laser for directing the optical beam from said edge-emitting laser through said second substrate.

21. An interconnect chip for facilitating interconnections with at least one optoelectronic transducer, said optoelectronic transducer being one of the group consisting of optical emitting means for generating a first optical beam and optical detecting means for receiving a second optical beam, said at least one optoelectronic transducer having a first surface adjacent a mounting substrate and including an array of electrical contact pads on a second surface thereof, the mounting substrate having an array of electrical contact pads thereon adjacent the periphery of the at least one optoelectronic transducer, said interconnect chip comprising:

a substrate for permitting at least one of said beams to pass therethrough to establish an optical interconnection with said at least one optoelectronic transducer, said substrate adapted to overlie said at least one optoelectronic transduce