The present invention provides a superconducting device having a weak link junction with an angle at the grain boundary between the two superconductor crystals being variable. The angle at the junction is substantially equivalent to a vicinal angle for the substrate. Accordingly, the magnitude of the angle at the junction can be varied by varying the vicinal angle of the substrate. This result can be realized by using buffer layers of different compositions underlying the superconducting materials on either side of the weak link junction. Weak link junctions and reproducible properties are essential for a variety of electronic and magnetic sensing devices.
The invention relates to an inverted JOFET with an at least bicrystalline electrically conductive substrate-layer bearing an insulating element and a superconductive element with a Josephson-junction. The substrate-layer is connected to a control-element. The invention further relates to a method for making such a JOFET. The grain boundary in the substrate-layer thereby maps into the Josephson-junction in the superconductive element.
A Josephson junction has a Si substrate, a two layer film comprising an amorphous MgO layer and a high orientation MgO layer on the Si substrate, and a NbN film or the NbCN film laminated on the two layer film.
Any oxide superconductor Josephson junction element having an oxide superconductor oriented in the c-axis direction with respect to a substrate, and a needle-like, a-axis (or b-axis) oriented oxide superconductor. Both sides of the needle-like, a-axis (or b-axis) oriented oxide superconductor are sandwiched between the c-axis oriented superconductors. The crystal boundary sections between the needle-like, a-axis (or b-axis) oriented oxide superconductor and each of the c-axis oriented superconductors form a weak link of the Josephson junction. The needle-like, a-axis (or b-axis) oriented oxide superconductor is grown such that the c-axis direction thereof is oriented in the (110) direction which is inclined at an angle of 45 degrees with respect to the (100) direction or (010) direction of the c-axis oriented superconductors.
A thin film transistor with multiple gates is fabricated using a super grain silicon (SGS) crystallization process. The thin film transistor a semiconductor layer formed in a zigzag shape on an insulating substrate, and a gate electrode intersecting with the semiconductor layer. The semiconductor layer has a high-angle grain boundary in a portion of the semiconductor layer that does not cross the gate electrode.
A thin film transistor with multiple gates using an MILC process which is capable of materializing multiple gates without increasing dimensions and a method thereof. The thin film transistor has a semiconductor layer which is formed on a insulating substrate in a zigzag shape; and a gate electrode which is equipped with one or more slots intersecting with the semiconductor layer, the semiconductor layer includes two or more body parts intersecting with the gate electrode; and one or more connection parts connecting each neighboring body part, wherein a part overlapping the semiconductor layer in the gate electrode acts as a multiple gate, and MILC surfaces are formed at a part which does not intersect with the gate electrode in the semiconductor layer.
