WikiPatents - Community Patent Review
Create Free Account  |  License or Sell Your Patent  |  WikiPatents Marketplace  |  WikiPatents Blog
Username:  Password:  
    
Advanced Search
Curable composition, thermal latent acid catalyst, method of coating, coated article, method of molding and molded article    
United States Patent5661219   
Link to this pagehttp://www.wikipatents.com/5661219.html
Inventor(s)Nakane; Yoshinori (Kanagawa-ken, JP); Mizutani; Hiroki (Chigasaki, JP); Ishibashi; Hayato (Yokohama, JP); Ishidoya; Masahiro (Chigasaki, JP)
AbstractA curable composition comprising (A) a compound having in the molecule two or more specific blocked carboxyl groups: (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the blocked carboxyl groups, and (C) a catalytic component selected from the following: (a) a thermal latent acid catalyst which comprises a compound having a epoxy group, a specific compound having a sulfur atom and a specific Lewis acid; (b) a thermal latent acid catalyst which comprises a specific compound, having at least one of a nitrogen atom, an oxygen atom, a phosphorus atom or a sulfur atom, a specific compound having a halogen atom and a specific Lewis acid having at least one of an aluminum atom, a zinc atom or a tin atom; or a mixture which comprises (c) a metallic chelate compound and a specific organic silicon compound or a condensate thereof. A two component curable composition is prepared by mixing (I) a main material composition or a solution thereof comprising the compound (A) and the compound (B) or a self-crosslinkable compound (D), and (II) an acid catalyst or the solution comprising at least one of a Bronsted acid, a Lewis acid or a mixture of a metallic chelate compound and a compound having a silanol group. The curable composition provides cured products having excellent chemical properties and physical properties and having desirable weathering resistance, stain resistance and appearance.
   














 Title Information Submit all comments and votes
 
Patent Text Patent PDF Print Page Summary File History
Plain text PDF images Print Summary File History
Inventor     Nakane; Yoshinori (Kanagawa-ken, JP); Mizutani; Hiroki (Chigasaki, JP); Ishibashi; Hayato (Yokohama, JP); Ishidoya; Masahiro (Chigasaki, JP)
Owner/Assignee     Nof Corporation (Tokyo, JP)
Patent assignment
All assignments
Publication Date     August 26, 1997
Application Number     08/297,588
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     August 29, 1994
US Classification     525/166 525/169 525/170 525/175 525/176 525/206 525/208 525/209 525/212 525/217 525/220 525/221 525/223 525/437 525/438 525/440 525/444 525/446
Int'l Classification     C08L 067/02 C08L 033/02 C08L 037/00 C08L 029/00 446
Examiner     Wilson; D. R.
Assistant Examiner    
Attorney/Law Firm     Frishauf, Holtz, Goodman, Langer & Chick, P.C.
Address
Parent Case    
Priority Data     Sep 06, 1993[JP]5-243512 Sep 06, 1993[JP]5-243513 Mar 04, 1994[JP]6-058368 Mar 11, 1994[JP]6-066470 Mar 22, 1994[JP]6-073778 Mar 28, 1994[JP]6-079239 May 23, 1994[JP]6-130900 May 23, 1994[JP]6-130901
USPTO Field of Search     525/116 525/117 525/166 525/169 525/170 525/175 525/176 525/206 525/208 525/209 525/212 525/217 525/220 525/221 525/223 525/437 525/438 525/440 525/444
Patent Tags     curable composition, thermal latent acid catalyst, coating, coated article, molding molded article
   
Enter a comma (,) or semicolon (;) between multiple tag words/phrases.
Describe this patent:
 Amusing   
 Clever   
 Complex   
 Efficient   
 Historic   
 Important   
 Innovative   
 Interesting   
 Practical   
 Simple   
[no votes]
Patent WIKI

Share information and news about this patent, including information and news about the technology, inventors, company, ligation and licensing.

 References Submit all comments and votes
 
*references marked with an asterisk below are user-added references
 U.S. References
 
Add a new US reference:  
ReferenceRelevancyCommentsReferenceRelevancyComments
3679618



[0 after 0 votes]
3505297



[0 after 0 votes]
5352740
Ishidoya
525/119
Oct,1994

[0 after 0 votes]
5319024
Ishidoya
525/123
Jun,1994

[0 after 0 votes]
5001207
Saegusa
528/49
Mar,1991

[0 after 0 votes]
4769400
Geist
523/408
Sep,1988

[0 after 0 votes]
4764430
Blackburn
428/413
Aug,1988

[0 after 0 votes]
4703101
Singer
528/87
Oct,1987

[0 after 0 votes]
4650718
Simpson
428/413
Mar,1987

[0 after 0 votes]
4644051
Van Geenen
528/323
Feb,1987

[0 after 0 votes]
4371667
Moller
525/208
Feb,1983

[0 after 0 votes]
4132686
Toyoshima
524/598
Jan,1979

[0 after 0 votes]
4681811
Simpson
428/413
Dec,1969

[0 after 0 votes]
5419929
Ishidoya
427/386
Dec,1969

[0 after 0 votes]
4579937
Masuda
528/363
Dec,1969

[0 after 0 votes]
 Foreign References
 Other References
 Market Review Submit all comments and votes
   
Market Size
Estimate the gross annual revenues of the relevant market sector:
> $10B
$5B - $10B
$2B - $5B
$500M - $2B
$100M - $500M
$10M - $100M
$1M - $10M
$500K - $1M
$100K - $500K
< $100K
[No votes]
$0
 
$0   $2.5B   $5B   $7.5B   $10B
Market Share
Estimate the percentage of the relevant market sector this invention will capture:
75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
[No votes]
0.0%
 
0%   25%   50%   75%   100%
Reasonable Royalty
What percentage of gross sales should the inventor or assignee be paid?
75% - 100%
50% - 74.99%
25% - 49.99%
10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
[No votes]
0.0%
 
0%   25%   50%   75%   100%
Public's "Guesstimation" of Royalty Value
Market SizeN/A[No votes]
xMarket ShareN/A[No votes]
xReasonable RoyaltyN/A[No votes]

N/A

License Availablity
If you are NOT the owner or assignee, answer here:
Yes, license is available for purchase

No, license is not currently available



[No votes]
License Availablity
If you ARE the owner or assignee, answer here:
Yes, license is available for purchase

No, license is not currently available



[No votes]
Competitive Advantage
Does this invention have a significant competitive advantage over similar technologies?
Yes

No



[No votes]
Most helpful competitive advantage comment
[No comments]

Commercial Alternatives
Are there viable commercial alternatives for this invention?
Yes

No



[No votes]
Most helpful commercial alternative comment
[No comments]

 Technical Review Submit all comments and votes
 Claims Submit all comments and votes
 


What is claimed is:

1. A thermosetting composition which comprises:

(A) a compound having in the molecule two or more functional groups of the formula (1): ##STR10## wherein R.sup.1, R.sup.2 and R.sup.3 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.4 is an organic group of 1 to 18 carbon atoms, Y.sup.1 is selected from the group consisting of an oxygen atom and a sulfur atom, wherein R.sup.3 and R.sup.4 are optionally bonded with each other to form a heterocyclic structure which comprises Y.sup.1 as the hereto atom component;

(B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the functional groups of the compound (A), the reactive functional groups of the compound (B) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optionally alkylated, an acetal group and a ketal group; the functional groups of the formula (1) of the compound (A) and the reactive functional groups of the compound (B) being in a ratio of 0.2:1.0 to 1.0:0.2; and

(C) a catalytic component which is at least one component selected from the group consisting of:

(a) a thermal latent acid catalyst which comprises (i) a compound having one or more epoxy groups, (ii) a compound having a sulfur atom of formula (2):

R.sup.5 --S--R.sup.6 ( 2)

wherein R.sup.5 and R.sup.6 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 40 carbon atoms, R.sup.5 and R.sup.6 are the same or different from each other, or R.sup.5 and R.sup.6 are bonded with each other to form a cyclic structure; and (iii) a Lewis acid of formula (3):

(X.sup.1).sub.n -M.sup.1 -(R.sup.7).sub.n2 ( 3)

wherein M.sup.1 is an atom selected from the group consisting of a boron atom, an aluminum atom, a tin atom, a lead atom and a transition element, X.sup.1 is one or more halogen atoms, R.sup.7 is one or more of an organic group of 1 to 40 carbon atoms, or R.sup.7 forms a chelate ring by coordinating to the M.sup.1 atom, n1 and n2 are each an integer from 0 to 6, and n1 plus n2 is an integer from 1 to 6 corresponding to the valency of M.sup.1 ; and optionally, (iv) a carboxylic acid compound and/or a carboxylic acid anhydride compound, the Lewis acid (iii) being in an amount of 0.01 to 20 weight parts based on 100 weight parts of the total solid component which is the sum of the compound (A) and the compound (B); a ratio of the epoxy groups of the compound (i) to the M.sup.1 atoms of the Lewis acid (iii) being 0.2 to 10 and a ratio of the sulfur atoms of the compound (ii) to the M.sup.1 atoms of the Lewis acid (iii) being 0.2 to 10;

(b) a thermal latent acid catalyst which comprises (v) a compound of formula (4):

(R.sup.8).sub.n3 --Y.sup.2 ( 4)

wherein Y.sup.2 is selected from the group consisting of a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom, R.sup.8 is one or more of an organic group of 1 to 12 carbon atoms and is selected from the group consisting of an alkyl group, an alkenyl group, an aryl group, an alkaryl group and an alkanol group, or two of R.sup.8 are bonded with each other to form a heterocyclic structure which comprises Y.sup.2 as the hetero atom component, and n3 is an integer of 2 or 3 corresponding to the valency of Y.sup.2 ; (vi) a compound having a halogen atom of formula (5):

R.sup.9 --X.sup.2 ( 5)

wherein R.sup.9 is an organic group of 1 to 12 carbon atoms and is selected from the group consisting of an unsubstituted benzyl group, a substituted benzyl group, an unsubstituted allyl group, a substituted allyl group, an unsubstituted cycloalkyl group, a substituted cycloalkyl group, an unsubstituted secondary alkyl group, a substituted secondary alkyl group, an unsubstituted tertiary alkyl group and a substituted tertiary alkyl group, and X.sup.2 is a halogen atom; and (vii) a Lewis acid of formula (6):

(X.sup.3).sub.n4 -M.sup.2 -(R.sup.10).sub.n3 ( 6)

wherein M.sup.2 is an atom selected from the group consisting of an aluminum atom, a zinc atom and a tin atom, X.sup.3 is one or more halogen atoms, R.sup.10 is one or more of an organic group of 1 to 20 carbon atoms, or R.sup.10 forms a chelate ring by coordinating to the M.sup.2 atom, n4 and n5 are each an integer from 0 to 6, and n4 plus n5 equals an integer of 1 to 6 corresponding to the valency of M.sup.2, the Lewis acid (vii) being in an amount of 0.01 to 20 weight parts based on 100 weight parts of the total solid component which is the sum of the compound (A) and the compound (B), a ratio of the Y.sup.2 atoms of the compound (v) to the M.sup.2 atoms of the Lewis acid (vii) being 0.5 to 10 and a ratio of the X.sup.2 atoms of the compound (vi) to the M.sup.2 atoms of the Lewis acid (vii) being 0.5 to 10; and

(c) a mixture comprising (viii) a metallic chelate compound formed from a chelating agent selected from the group consisting of an alkylacetoacetate and an acetylacetone; and (ix) an organic silicon compound of formula (7) or a condensate thereof: ##STR11## wherein R.sup.11 is an organic group of 1 to 18 carbon atoms and is selected from the group consisting of an alkyl group, an aryl group and an alkenyl group, R.sup.12 is a hydrogen atom or an organic group of 1 to 18 carbon atoms which is selected from the group consisting of an alkyl group, an aryl group and an alkaryl group, R.sup.13 and R.sup.14 are each an organic group of 1 to 18 carbon atoms and are each selected from the group consisting of an alkyl group and an aryl group, n6, n7, n8 and n9 are each an integer from 0 to 4, and the total of n6, n7, n8 and n9 equals 4, the metallic chelate compound (viii) being in an amount of 0.01 to 20 weight parts based on 100 weight parts of the total solid component which is the sum of the compound (A) and the compound (B), a ratio of the silicon atoms of the compound (ix) to the metallic atoms of the compound (viii) being 0.2 to 10.

2. A two component composition curable at temperatures of not less than 0.degree. C. and less than 50.degree. C. which is prepared by mixing:

(I) a main material composition or a solution thereof comprising (A) a compound having in the molecule two or more functional groups of the formula (1): ##STR12## wherein R.sup.1, R.sup.2 and R.sup.3 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.4 is an organic group of 1 to 18 carbon atoms, Y.sup.1 is selected from the group consisting of an oxygen atom and a sulfur atom and, wherein R.sup.3 and R.sup.4 are optionally bonded with each other to form a heterocyclic structure which comprises Y.sup.1 as the hereto atom component; and (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with the functional groups of the compound (A), the reactive functional groups of the compound (B) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optionally alkylated, an acetal group and a ketal group, the functional groups of the formula (1) of the compound (A) and the reactive functional groups of the compound (B) being in a ratio of 0.2:1.0 to 1.0:0.2; and

(II) an acid catalyst or a solution thereof comprising a mixture of a compound having a silanol group and a metallic chelate compound formed from a chelating agent selected from the group consisting of an alkylacetoacetate and an acetylacetone.

3. The composition as claimed in claim 1, or claim 2, wherein the compound (A) and/or the compound (B) are a polymer of an .alpha.,.beta.-unsaturated compound.

4. The composition as claimed in claim 1, or claim 2, wherein the compound (A) and/or the compound (B) are a polyester resin.

5. A thermosetting composition which comprises:

(D) a self-crosslinkable compound having in the molecule one or more functional groups (.alpha.) of the formula (8): ##STR13## wherein R.sup.15, R.sup.16 and R.sup.17 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.18 is an organic group of 1 to 18 carbon atoms, Y.sup.3 is selected from the group consisting of an oxygen atom and a sulfur atom, wherein R.sup.17 and R.sup.18 are optionally bonded with each other to form a heterocyclic structure which comprises Y.sup.3 as the hetero atom component; and one or more reactive functional groups (.beta.) which can form chemical bonds with the functional groups (.alpha.), the reactive functional groups (.beta.) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optionally alkylated, an acetal group and a ketal group; the functional groups (.alpha.) of the formula (8) and the reactive functional groups (.beta.) being in a ratio of 0.2:1.0 to 1.0:0.2; optionally a component selected from the group consisting of (A) a compound having in the molecule two or more functional groups of the formula (1): ##STR14## wherein R.sup.1, R.sup.2 and R.sup.3 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.4 is an organic group of 1 to 18 carbon atoms, Y.sup.1 is selected from the group consisting of an oxygen atom and a sulfur atom, wherein R.sup.3 and R.sup.4 are optionally bonded with each other to form a heterocyclic structure which comprises Y.sup.1 as the hetero atom component, (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with either one or both of the functional group of the formula (8) and the functional group of the formula (1), and mixtures of the compounds (A) and (B), the compound (B) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optional alkylated, an acetal group and a ketal group;

(C) a catalytic component which is at least one component selected from the group consisting of:

(a) a thermal latent acid catalyst which comprises (i) a compound having one or more epoxy groups, (ii) a compound having a sulfur atom of formula (2):

R.sup.5 --S--R.sup.5 ( 2)

wherein R.sup.5 and R.sup.6 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 40 carbon atoms, R.sup.5 and R.sup.6 are the same or different each other, or R.sup.5 and R.sup.6 are bonded with each other to form a cyclic structure; and (iii) a Lewis acid of formula (3):

(X.sup.1).sub.n1 -M.sup.1 -(R.sup.7).sub.n2 ( 3)

wherein M.sup.1 an atom is selected from the group consisting of a boron atom, an aluminum atom, a tin atom, a lead atom and a transition element, X.sup.1 is one or more halogen atoms, R.sup.7 is one or more of an organic group of 1 to 40 carbon atoms, or R.sup.7 forms a chelate ring by coordinating to the M.sup.1 atom, n1 and n2 are each an integer from 0 to 6, and n1 plus n2 is an integer from 1 to 6 corresponding to the valency of M.sup.1 ; and optionally, (iv) a carboxylic acid compound and/or a carboxylic acid anhydride compound, the Lewis acid (iii) being in an amount of 0.01 to 20 weight parts based on 100 weight parts of the total solid component which is the sum of the compound (D) and an optional component selected from the group consisting of a compound (A), a compound (B) and both compounds (A) and (B); a ratio of the epoxy groups of the compound (i) to the M.sup.1 atoms of the Lewis acid (iii) being 0.2 to 10 and a ratio of the sulfur atoms of the compound (ii) to the M.sup.1 atoms of the Lewis acid (iii) being 0.2 to 10;

(b) a thermal latent acid catalyst which comprises (v) a compound of formula (4):

(R.sup.8).sub.n3 --Y.sup.2 ( 4)

wherein Y.sup.2 is selected from the group consisting of a nitrogen atom, an oxygen atom, a phosphorus atom and a sulfur atom, R.sup.8 is one or more of an organic group selected from the group consisting of an alkyl group, an alkenyl group, an aryl group, an alkaryl group and an alkanol group, having 1 to 12 carbon atoms, or two of R.sup.8 are bonded with each other to form a heterocyclic structure which comprises Y.sup.2 as the hetero atom component, and n3 is an integer of 2 or 3 corresponding to the valency of Y.sup.2 ; (vi) a compound having a halogen atom of formula (5):

R.sup.9 --X.sup.2 ( 5)

wherein R.sup.9 is an organic group having 1 to 12 carbon atoms and is selected from the group consisting of an unsubstituted benzyl group, a substituted benzyl group, an unsubstituted allyl group, a substituted allyl group, an unsubstituted cycloalkyl group, a substituted cycloalkyl group, an unsubstituted secondary alkyl group, a substituted secondary alkyl group, an unsubstituted tertiary alkyl group and a substituted tertiary alkyl group, and X.sup.2 is a halogen atom; and (vii) a Lewis acid of formula (6):

(X.sup.3).sub.n4 -M.sup.2 -(R.sup.10).sub.n5 ( 6)

wherein M.sup.2 is an atom selected from the group consisting of an aluminum atom, a zinc atom and a tin atom, X.sup.3 is one or more halogen atoms, R.sup.10 is one or more of an organic group of 1 to 20 carbon atoms, or R.sup.10 forms a chelate ring by coordinating to the M.sup.2 atom, n4 and n5 are each an integer from 0 to 6, and n4 plus n5 equals an integer of 1 to 6 corresponding to the valency of M.sup.2, the Lewis acid (vii) being in an amount of 0.01 to 20 weight parts based on 100 weight parts of the total solid component which is the sum of the compound (D) and an optional component selected from the group consisting of the compound (A), the compound (B) and mixtures of the compounds (A) and (B), a ratio of the Y.sup.2 atoms of the compound (v) to the M.sup.2 atoms of the Lewis acid (vii) being 0.5 to 10 and a ratio of the X.sup.2 atoms of the compound (vi) to the M.sup.2 atoms of the Lewis acid (vii) being 0.5 to 10; and

(c) a mixture comprising (viii) a metallic chelate compound formed from a chelating agent selected from the group consisting of an alkylacetatoacetate and an acetylacetone; and (ix) an organic silicon compound of formula (7) or a condensate thereof: ##STR15## wherein R.sup.11 is selected from the group consisting of an alkyl group, an aryl group and an alkenyl group, having 1 to 18 carbon atoms, R.sup.12 is selected from the group consisting of a hydrogen atom, and an organic group having 1 to 18 carbons and is selected from the group consisting of an alkyl group, an aryl group and an alkaryl group, R.sup.13 and R.sup.14 are each an organic group having 1 to 18 carbon atoms and is selected from the group consisting of an alkyl group and an aryl group, n6, n7, n8 and n9 are each an integer from 0 to 4, and the total of n6, n7, n8 and n9 equals 4;

the metallic chelate compound (viii) being in an amount of 0.01 to 20 parts by weight based on 100 weight parts of the total solid component which is the sum of the compound (D) and said optional component, a ratio of the silicon atoms of the compound (ix) to the metallic atoms of the compound (viii) being 0.2 to 10.

6. A two component composition curable at temperatures of not less than 0.degree. C. and less than 50.degree. C. which is prepared by mixing:

(I) a main material composition or a solution thereof comprising (D) self-crosslinkable compound having in the molecule one or more functional groups (.alpha.) of the formula (8): ##STR16## wherein R.sup.15, R.sup.16 and R.sup.17 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.18 is an organic group of 1 to 18 carbon atoms, Y.sup.3 is selected from the group consisting of an oxygen atom and a sulfur atom, wherein R.sup.17 and R.sup.18 are optionally bonded with each other to form a heterocyclic structure which comprises Y.sup.3 as the hetero atom component; and one or more reactive function groups (.beta.) which can form chemical bonds with the functional group (.alpha.), the reactive functional group (.beta.) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optionally alkylated, an acetal group and a ketal group; and optionally a component selected from the group consisting of (A) a compound having in the molecule two or more functional groups of the formula (1): ##STR17## wherein R.sup.1, R.sup.2 and R.sup.3 are each selected from the group consisting of a hydrogen atom and an organic group of 1 to 18 carbon atoms, R.sup.4 is an organic group of 1 to 18 carbon atoms, Y.sup.1 is selected from the group consisting of an oxygen atom and a sulfur atom or R.sup.3 and R.sup.4 are bonded with each other to form a heterocyclic structure which comprises Y.sup.1 as the hetero atom component, (B) a compound having in the molecule two or more reactive functional groups which can form chemical bonds with either one or both of the functional group of the formula (8) and the functional group of the formula (1), the reactive functional groups of the compound (B) being at least one compound selected from the group consisting of an epoxy group, an oxazoline group, a silanol group, an alkoxysilane group, a hydroxyl group, an amino group, an imino group, an unblocked isocyanate group, a blocked isocyanate group, a cyclocarbonate group, a vinyl ether group, a vinyl thioether group, an aminomethylol group which is optionally alkylated, an acetal group and a ketal group, and mixtures of the compounds (A) and (B), the functional groups of the formula (1) of the compound (A) and the reactive functional groups of the compound (B) being in a ratio of 0.2:1.0 to 1.0:2; and

(II) an acid catalyst or a solution thereof comprising a mixture of a compound having a silanol group and a metallic chelate compound formed from a chelating agent selected from the group consisting of an alkylacetoacetate and an acetylacetone.

7. The composition as claimed in claim 5, or claim 6, wherein at least one of the compound (D) and the compound (A) and/or the compound (B) are a polymer of an .alpha.,.beta.-unsaturated compound.

8. The curable composition as claimed in claim 5, or claim 6, wherein at least one of the compound (D) and the compound (A)and/or the compound (B)are a polyester resin.

9. The thermosetting composition as claimed in claim 1, wherein the compound (A) is a compound prepared by reaction of a polycarboxyl compound prepared by a half-esterification of an acid anhydride with a polyol having two or more hydroxyl groups in the molecule and a vinyl ether compound.

10. The thermosetting composition as claimed in claim 1, wherein the compound (B) is a compound having two or more epoxy groups in the molecule.

11. The thermosetting composition as claimed in claim 1, wherein the compound (B) is a polymer of an .alpha.,.beta.-unsaturated compound.

12. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (a).

13. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of the formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component optionally containing (iv) a carboxylic acid compound and/or a carboxylic acid anhydride compound.

14. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of formula (3) comprising a zinc compound, and the catalytic component containing (iv) a carboxylic acid compound.

15. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of the formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component containing (iv) a carboxylic acid anhydride compound.

16. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of formula (3) comprising a zinc compound, and the catalytic component containing (iv) a mixture of a carboxylic acid compound and a carboxylic acid anhydride compound.

17. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (b).

18. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is the thermal latent acid catalyst (b), the compound (v) of the formula (4) comprising an alkyl sulfide, the compound having a halogen atom (vi) of the formula (5) comprising a benzyl halide, and the Lewis acid (vii) of the formula (6) comprising a zinc compound.

19. The thermosetting composition as claimed in claim 5, wherein the compound (D) is a compound having in the molecule one or more functional groups of the formula (8), and one or more epoxy groups.

20. The thermosetting composition as claimed in claim 5, wherein the compound (D) is a polymer of an .alpha.,.beta.-unsaturated compound.

21. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (a).

22. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component optionally containing (iv) a carboxylic acid compound and/or a carboxylic acid anhydride compound.

23. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of the formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component containing (iv) a carboxylic acid compound.

24. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component containing (iv) a carboxylic acid anhydride compound.

25. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (a), the epoxy compound (i) comprising a monoepoxide, the compound having a sulfur atom (ii) of the formula (2) comprising an alkyl sulfide, the Lewis acid (iii) of the formula (3) comprising a zinc compound, and the catalytic component containing (iv) a mixture of a carboxylic acid compound and a carboxylic acid anhydride compound.

26. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (b).

27. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is the thermal latent acid catalyst (b), the compound (v) of the formula (4) comprising an alkyl sulfide, the compound having a halogen atom (vi) of the formula (5) comprising a benzyl halide and the Lewis acid (vii) of the formula (6) comprising a zinc compound.

28. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is a thermal latent acid catalyst (a), a ratio of the epoxy groups of the compound (i) to the M.sup.1 atoms of the Lewis acid (iii) being 0.5 to 5 and a ratio of the sulfur atoms of the compound (ii) to the M.sup.1 atoms of the Lewis acid (iii) being 0.5 to 5.

29. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is a thermal latent acid catalyst (b), a ratio of the atoms of the compound (v) to the M.sup.2 atoms of the Lewis acid (vii) being 1 to 5 and a ratio of the X.sup.2 atoms of the compound (vi) to the M.sup.2 atoms of the Lewis acid (vii) being 1 to 5.

30. The thermosetting composition as claimed in claim 1, wherein the catalytic component (C) is a thermal latent acid catalyst (C), a ratio of the silicon atoms of the compound (ix) to the metallic atoms of the compound (viii) being 0.5 to 5.

31. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is a thermal latent acid catalyst (a), a ratio of the epoxy groups of the compound (i) to the M.sup.1 atoms of the Lewis acid (iii) being 0.5 to 5 and a ratio of the sulfur atoms of the compound (ii) to the M.sup.1 atoms of the Lewis acid (iii) being 0.5 to 5.

32. The thermosetting composition as claimed in claim wherein the catalytic component (C) is a thermal latent acid catalyst (b), a ratio of the Y.sup.2 atoms of the compound (v) to the M.sup.2 atoms of the Lewis acid (vii) being 1 to 5 and a ratio of the X.sup.2 atoms of the compound (vi) to the M.sup.2 atoms of the Lewis acid (vii) being 1 to 5.

33. The thermosetting composition as claimed in claim 5, wherein the catalytic component (C) is a thermal latent acid catalyst (c), a ratio of the silicon atoms of the compound (ix) to the metallic atoms of the compound (viii) being 0.5 to 5.
 Description Submit all comments and votes
 


BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a novel curable composition, a thermal latent acid catalyst, a method of coating, a coated article, a method of molding and a molded article. More particularly, it relates to a novel curable composition which is particularly excellent in storage stability and gives cured products having excellent chemical properties, physical properties, weathering resistance and stain resistance, which is able to be utilized in the field of coatings, ink, adhesive and molded plastics, a thermal latent catalyst capable to be utilized in the thermosetting composition, and a method of coating to provide a top coat having the above cured film properties and excellent appearance by using the curable composition as the top coat material and the obtained coated article. It also relates to a method of molding to provide a molded article having excellent mechanical properties, insulating characteristics, moisture resistance, corrosion resistance and cracking resistance by using the curable composition as the molding material and the obtained molded article.

2. Description of the Prior Art

It is generally known that thermosetting compositions can be prepared from compounds having carboxyl groups and compounds having reactive functional groups which can form chemical bonds with the carboxyl groups by heating, such as epoxy group, oxazoiine group, silanol group, alkoxysilane group, hydroxyl group, amino group, imino group, isocyanate group, blocked isocyanate group, cyclocarobonate group, vinyl ether group, vinyl thioether group, aminomethylol group, alkylated aminomethylol group, acetal group and ketal group. The thermosetting compositions give cured products having excellent chemical properties, physical properties and weathering resistance and are widely utilized in the field of coating composition, ink, adhesive and molded plastics.

As the thermosetting compositions described above, for example, compositions comprising combinations of carboxyl group and epoxy group have been disclosed in Laid Open Japanese Patent Application Showa 51-114429, Laid Open Europea