Apparatus and methods for processing work piece components in which a molten phase is produced by a local energy input from at least one of an electric arc, a jet of combustible gas, an electron plasma, and a laser beam. At least one transducer is included for imparting oscillations having a frequency above 15 kHz. The oscillations can be imparted to one or more of the components, the region of the molten phase, and/or to any filler material that is added to the region of the molten phase. The apparatus and methods can be used with known thermal soldering, welding and cutting methods to improve the quality of weld beads and cut edges that are formed, and to increase the processing rate.

An object of the present invention is to provide a sealing method by which an excellent bonding may be realized without thermal shock by bonding at a normal temperature due to ultrasonic coupling oscillation to seal a small size of surface mounting type quartz oscillator or the like. A bonding face (1a) of a sealing metal cap (1) is positioned on a bonded face (2a) of a package substrate (2), and ultrasonic oscillations of different directions are simultaneously imparted in the bonding plane while a suitable load is applied from an upper or a lower part of the bonding portion to the plane in a vertical direction so that the sealing metal cap (1) and the package substrate (2) are welded and fixed to be sealed on the bonding face.

A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.

There is provided an ultrasonic welding apparatus that includes a magnetic source and a ferromagnetic device to apply pressure to at least one component being joined during the ultrasonic welding process. The magnetic source is positioned proximate the ultrasonic transducer, and when the component to be ultrasonically welded is adjacent the ultrasonic transducer, the ferromagnetic device is positioned opposite the component from the magnetic source and the ultrasonic transducer to apply pressure. A magnetic source comprising an electromagnet provides an adjustable pressure to the component. The ferromagnetic device defines a generally spherical surface so that it advantageously remains in position relative to the magnetic source if the component is moved relative to the ferromagnetic device. In addition, the ferromagnetic device may comprise a magnet to increase the magnetic force between the magnetic source and ferromagnetic device, which increases the pressure applied to the component.

A method and apparatus for creating second order vibrational modes. The apparatus includes a signal generator, a piezoelectric transducer, a plurality of wave propagating beams and reflecting boards. An electric field applied by the signal generator to the piezoelectric transducer induces a unidirectional vibration of the transducer. The vibration is propagated through the beams and reflected by the reflecting boards in a closed polygonal loop. The final reflection direction is perpendicular to the original vibration. A circular or elliptical vibration of the apparatus results. The circular or elliptical vibrational energy can be imparted to the wire bond of an integrated circuit to add strength to the connection.