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Atomized flux application to simulate soldering
 
   
Document Number
US Patent 5723796
Issued Date
March 3, 1998
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Abstract
The present invention describes a method for testing an electronic part which may be an integrated circuit by using an air brush spray gun to apply an atomized flux coating to the part. The purpose of the method is to simulate soldering and is used on only a sample of parts as part of a reliability procedure before subjecting the part to an additional stress test or before actually soldering the part. The method comprises the steps of: spraying each part with an atomized flux coating; heating each part to simulate a soldering process; and removing each part from a heat source.
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Atomized flux application to simulate soldering - US Patent 5723796 Drawing
Drawing from US Patent 5723796
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Number of Claims:
14
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Owner
Published
March 3, 1998
Application Number
08/866,974
Filed
June 2, 1997
US Classification
73/865.6  
Int'l Classification
B23K   1/20   (20060101)   G01N   17/00   (20060101)  
Examiner
Parent Case
This is a continuation of application Ser. No. 08/568,192 filed Dec. 6, 1995, now abandoned.
USPTO Field of Search
73/865.8   73/865.6   73/865.3  
Related Patents
6213636 - Furnace for testing integrated circuits - Owned by Winbond Electronics Corp. (Hsinchu,TW)

A furnace for testing integrated circuits has a furnace body for holding the integrated circuits undergoing testing. A water outlet pipe and an air exhaust pipe are connected to the furnace body. The water outlet pipe and the air exhaust pipe are automatically opened when a test is complete. An air supply pipe is connected to the furnace body. The air supply pipe is automatically opened when the test is complete for injecting low-temperature gas into the furnace body. A liquid inlet pipe is connected to the furnace body. The liquid inlet pipe is automatically opened when the test is complete for pouring cooling liquid into the furnace body. With the supply of low-temperature gas and cooling liquid, the furnace can be cooled down quickly thereby avoiding damages to the integrated circuits.

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