A process for forming a package of hot melt adhesive material includes forming a bottom layer of molten non-tacky polymeric material in a container and depositing a bead of molten non-tacky polymeric material along the top edges of an open-faced rigid container and allowing the bead of polymeric material to pour down the walls of the rigid container by gravity so as to coat the inside wall surfaces and bottom surface of the container with a substantially uniform layer of the non-tacky polymeric material. The layer of non-tacky polymeric material is allowed to solidify in the container and form a substantially rigid mold of the polymeric material within the container. The mold is located in a rigid support structure and is conveyed to a molten adhesive filling station. The mold is filled at the filling station with a metered amount of molten adhesive which is allowed to cool and solidify within the mold thereby forming a solidified package of hot melt adhesive material.
A thermoplastic compound useful in filling pores and voids in wooden materials, particularly edge regions, wherein the thermoplastic compound comprises a blend of two copolyesters and optionally fillers, wherein the first copolyester has a melting point of 140.degree. C. to 260.degree. C. and a glass transition temperature of -10.degree. C. to 80.degree. C., and wherein the second copolyester has a melting point of 120.degree. C. to 190.degree. C. and a glass transition temperature of -70.degree. C. to 10.degree. C. Also, a method of filling pores in a wooden material comprising using a thermoplastic compound having a softening point of 140.degree. C. to 200.degree. C., an open time of 2 to 15 seconds, and a viscosity number of 30 to 150 ml/g, with the thermoplastic compound preferably being a blend of two different copolyesters, wherein the application of such thermoplastic compounds enable the surfaces of chipboard panels and the like to be smoothed in a continuous one-pass process. In particular, immediate aftertreatment such as milling is possible through the use of the thermoplastic compounds.
The present invention relates to the packaging of a hot melt adhesive in a plastic film to prevent the adhesive from blocking during shipping and storage. The hot melt adhesives of the present invention may be thermoplastic or thermosetting in nature. The films used to wrap the adhesive are flexible in nature and are made of polymer composition, which become part of the adhesive once the adhesive is melted.
A dual component molding assembly for packaging hot melt adhesives wherein a mold, preferably in the form of an open top pan, includes a cavity which is lined with a thin film of plastic material. The mold has openings formed therein which communicate with the cavity to facilitate vacuum forming of the film to the cavity's interior surface. The second component is a carrier for the mold and is also preferably in the form of an open top pan. The carrier also includes a cavity for receiving the mold, and functions not only to support the mold when nested therein, but also to act as a heat sink to effectively and rapidly remove, dissipate or absorb the heat from molten adhesive dispensed into the mold. After filling the mold with a mass of adhesive, the exposed open top surface of the adhesive is covered with a second layer of thin film of plastic material which is then sealed to the first film lining the interior of the mold. After cooling, the packaged adhesive is cut adjacent the seal to form individual adhesive blocks for further processing.
