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Method of manufacturing an enclosed transceiver    
United States Patent5776278   
Link to this pagehttp://www.wikipatents.com/5776278.html
Inventor(s)Tuttle; Mark E. (Boise, ID); Tuttle; John R. (Boise, ID); Lake; Rickie C. (Eagle, ID)
AbstractThe present invention teaches a method of manufacturing an enclosed transceiver, such as a radio frequency identification ("RFID") tag. Structurally, in one embodiment, the tag comprises an integrated circuit (IC) chip, and an RF antenna mounted on a thin film substrate powered by a thin film battery. A variety of antenna geometries are compatible with the above tag construction. These include monopole antennas, dipole antennas, dual dipole antennas, a combination of dipole and loop antennas. Further, in another embodiment, the antennas are positioned either within the plane of the thin film battery or superjacent to the thin film battery.



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Drawing from US Patent 5776278
Method of manufacturing an enclosed transceiver - US Patent 5776278 Drawing
Method of manufacturing an enclosed transceiver
Inventor     Tuttle; Mark E. (Boise, ID); Tuttle; John R. (Boise, ID); Lake; Rickie C. (Eagle, ID)
Owner/Assignee     Micron Communications, Inc. (Boise, ID)
Patent assignment
All assignments
Publication Date     July 7, 1998
Application Number     08/781,107
PAIR File History     Application Data   Transaction History
Image File Wrapper   Patent Term   Fees
Litigation
Filing Date     January 9, 1997
US Classification    
Int'l Classification    
Examiner     Simmons; David A.
Assistant Examiner     Rivard; Paul M.
Attorney/Law Firm     Wells, St. John, Roberts, Gregory & Matkin, P.S.
Address
Parent Case     CROSS REFERENCE TO RELATED APPLICATION This is a continuation of U.S. patent application Ser. No. 08/602,686, filed on Feb. 16, 1996, now abandoned, and assigned to the assignee hereof, which is a file wrapper continuation of U.S. patent application Ser. No. 08/137,677, filed Oct. 14, 1993, now abandoned, which in turn is a continuation-in-part of U.S. patent application Ser. No. 07/899,777, filed Jun. 17, 1992 (now abandoned).
Priority Data    
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Patent Tags     manufacturing enclosed transceiver
   
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Market Size
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$5B - $10B
$2B - $5B
$500M - $2B
$100M - $500M
$10M - $100M
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Market Share
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25% - 49.99%
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2 - 4.99%
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10 - 24.99%
5 - 9.99%
2 - 4.99%
1 - 1.99%
< 1%
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0.0%
 
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