A miniature shunt connector for commoning a pair of adjacent terminal posts and a method for commoning a pair of adjacent terminal posts are provided. The shunt connector includes a housing formed of an insulating material which forms an internal contact cavity configured to receive an electrical shunt contact. A pair of terminal post receiving apertures communicate with the contact cavity to allow terminal post to be inserted therein. A surface feature is also formed in a wall of the contact for locking said contact element into said housing. An electrical shunt contact element is provided and configured to fit within the internal shunt cavity. The contact element is formed with two rear contact beams and two resilient front contact beams. The resilient front contact beams being provided with and anti-overstress feature in the form of flared ends configured to physically engage the contact housing. A shunt portion of the contact element provides an electrical short circuit between the contact beams.
A connector is disclosed. The connector comprises a housing, a plurality of terminal receiving grooves defined by a partition wall, a notch formed at one end portion of the respective partition wall, a plurality of terminals accommodated within the terminal receiving grooves, and an interconnecting portion which electrically interconnects at least two adjacent ones of the plurality of terminal portions each other and is disposed in the notch.
A semiconductor signal connector has a contact area provided with a contact part. The contact part is elongated in a transverse direction so that a signal terminal can contact at any location thereof. Further, the semiconductor signal connector has a first contact part to contact a first signal terminal, a second contact part to contact a second signal terminal, and a connecting part formed by a deformable member for connecting the first contact part and the second contact part.
