A discrete circuit component having an up-right circuit die with lateral electrical connections. The component comprises a substrate having a pair of electrically conductive traces, and a circuit die is planted between the pair of consecutive traces, wherein one electrode of the circuit die on the surface thereof vertical to the substrate is electrically bonded to one of the conductive trace immediately next thereto, while the other electrode of the circuit die on the opposite surface thereof vertical to the substrate is electrically bonded to the other of the pair of conductive traces immediately next thereto. A body of electrical insulation material hermetically seals the circuit die, and a pair of surface electrodes formed on the surface of the body of insulation material are each electrically connected to the corresponding one of the pair of electrically conductive traces extending from the circuit die.

Microelectronic packages include a first microelectronic substrate, a second microelectronic substrate that is oriented at an acute angle relative to the first microelectronic substrate, and first solder bumps between the first and second microelectronic substrates, adjacent an edge of the second microelectronic substrate, that connect the second microelectronic substrate to the first microelectronic substrate and that are confined to within the edge of the second microelectronic substrate. The edge of the second microelectronic substrate is adjacent the vertex of the acute angle. A third microelectronic substrate also may be provided on the first microelectronic substrate that laterally overlaps the second microelectronic substrate. Second solder bumps connect the third microelectronic substrate to the first microelectronic substrate. The second and third microelectronic substrates may be oriented parallel to one another at the acute angle relative to the first microelectronic substrate. Alternatively, second solder bumps are adjacent a first edge of the third microelectronic substrate and opposite a second edge of the third microelectronic substrate, wherein the second edge of the third microelectronic substrate is adjacent the vertex and wherein the first edge of the third microelectronic substrate is opposite the vertex.

A multi-mode integrated circuit structure. In one embodiment, an integrated circuit structure includes a first die having at least one first component disposed on a face, the first die fabricated using a first process that is optimal for operating the component in an first mode and a second die stacked on the first die, the second die having at least one second component disposed on a face and the second die fabricated using a second process separate from the first process that is optimal for operating the second component in a second mode. As such, the integrated circuit structure provides an electronic device with a single integrated circuit structure for performing operations optimally in more than one mode, such as operations in enhancement mode and operations in depletion mode.

An electronic device such as a semiconductor module comprises a printed circuit board and a socket attached to the printed circuit board and in electrical communication therewith. The socket comprises a plurality of electrically-conductive surfaces. The device further comprises a plurality of die and a plurality of supports each attached to the socket. At least one die is mechanically connected with each support, and each die has a plurality of electrically-conductive pads thereon. The plurality of electrically-conductive pads contact the electrically-conductive surfaces of the socket. A method for forming the electronic device is also described.

A multi-mode integrated circuit structure. In one embodiment, an integrated circuit structure includes a first die having at least one first component disposed on a face, the first die fabricated using a first process that is optimal for operating the component in an first mode and a second die stacked on the first die, the second die having at least one second component disposed on a face and the second die fabricated using a second process separate from the first process that is optimal for operating the second component in a second mode. As such, the integrated circuit structure provides an electronic device with a single integrated circuit structure for performing operations optimally in more than one mode, such as operations in enhancement mode and operations in depletion mode.