A bulk mail processing system (10) conveys bulk mail containers (C) from a receiving station (R) at which the container is placed on a conveyor (12) to an unloading station (D) at which the contents of the container are dumped. A video camera (22) obtains an image of the container which is transmitted to a processor (24). The image is processed to determine if residual mail (M) is left in the container after it is emptied. A mechanism (18) removes the container from the conveyor, empties the container, and then returns the container back to the conveyor. A controller (20) controls operation of the emptying mechanism. The controller is responsive to an input from the processor that all the contents of a container have been removed to replace the empty container on the conveyor. The controller is further responsive to an input from the processor that there is residual mail left in the container to have the mechanism re-empty the container and so insure container is completely empty before being returned to the conveyor.

To facilitate the debugging an imaging device having a large number of pixels, a debugging apparatus has an image view display for qualitatively displaying pixel characteristics in a first range of the imaging device, and a code view displaying unit for quantitatively displaying numerical or symbolic data of individual pixels in a second range that is smaller than the first range and designated in an area displayed by the image view display.

A substrate transfer apparatus (20) transfers a substrate between a first substrate support member (21) for supporting a plurality of substrates and a second substrate support member (15). This apparatus (20) includes a transfer apparatus main body (60) movable between a first transfer operation position where it can perform a substrate transfer operation with respect to the first substrate support member, and a second transfer operation position where it can perform a substrate transfer operation with respect to second substrate support member, a substrate receiving member (59b) arranged to be movable back and forth with respect to the transfer apparatus main body to support the substrate and to transfer the substrate to/from the first or second substrate support member, and non-contact sensors (70a, 70b) mounted on two side portions of the substrate receiving member (59b) and movable back and forth integrally with the substrate receiving member to detect a distance to the substrate and a position of the substrate in a horizontal plane.

The present invention is directed to a method and apparatus for testing integrated circuit package devices using automatic testing equipment. The automatic testing equipment may be provided with a light source to enable the testing of image capture type integrated circuit devices. Alternatively, the automatic testing equipment may be provided with an imaging device, e.g., a camera, or both an imaging device and a light source to additionally enable the testing of display type integrated circuit devices.

A yoke is supported on a frame for vertical movement in a Z direction above a transparent work support that is mounted on the frame for horizontal adjustment in a Y direction, normal to the Z direction. A carriage which is mounted for horizontal adjustment on the yoke in an X direction, normal to the Y and Z directions, carries a video camera and lens system which overlies the work support to project an image of an inspected workpiece to the camera. A substage collimator which is mounted on the frame beneath the work support for adjustment in the X direction, has thereon a souce of collimated light that registers with the lens system. The collimator is connected to the carriage to be moved in unison therewith in the X direction, and always to maintain the light source in registry with the lens system.