A handling device, in particular for handling probes of a wafer testing device, includes a receiving device for a probe being disposed in such a way as to be adjustable in a vertical direction and in a horizontal direction relative to at least one vertical bearer. The receiving device is guided adjustably in a horizontal direction on a supporting part. The supporting part is guided adjustably in a vertical direction on the at least one vertical bearer. Furthermore, a counterweight device is constructed so as to counterbalance the weight of the probe, the receiving device and the supporting part. The counterweight device includes a carrying device for receiving counterbalance weights. The carrying device is aligned horizontally and for parallel motion includes at least three suspension devices for fixing a connector which is turned round associated guide pulleys and is connected to the supporting part.
A manipulator for a test head comprises a base and a tower having vertical tracks. The tower is mounted on the base. A vertical shaft is mounted on the base adjacent to the tower. An outer carriage is in engagement with the vertical tracks. The outer carriage is movable relative to the tower along a vertical axis of the vertical tracks. The inner carriage is in engagement with the vertical shaft. The inner carriage is moveable relative to the tower along a vertical axis of the vertical shaft. A spring is disposed between the inner carriage and the outer carriage. The spring supports the outer carriage. An arm is coupled to the outer carriage. The arm is adapted for supporting the test head.
A cable includes an inner conductor, an inner dielectric, and a guard conductor, where the inner dielectric is between the inner conductor and the guard conductor. The cable also includes an outer dielectric, and a shield conductor, where the outer dielectric is between the guard conductor and the shield conductor. The cable further includes an additional layer of material between the outer dielectric and the shield conductor of suitable composition for reducing triboelectric current generation between the outer dielectric and the shield conductor to less than that which would occur were the outer dielectric and the shield conductor to directly adjoin each other.
