A paper handling system for air mediated transport of sheets or pages of paper is disclosed. Microelectromechanical valves and sensors are embedded in a dielectric substrate for tracking and controlling paper transport. These microelectromechanical systems can be batch fabricated using resin impregnated dielectric laminates having photolithographically formed circuitry for electrical connections. Use of high speed sensor and valve control systems permit dynamic adjustments to paper trajectory during paper transport.
A valve array for supporting objects such as paper with controlled fluid flow is disclosed. Optional valve arrays can be used to controllably eject marking agents for marking or coating a paper or other suitable substrate. Each valve in the valve array has one or more flap elements positioned in a valve chamber. These flap elements are movable to alternatively block the fluid flow through valve chamber outlets with the aid of various catch mechanisms for controllably latching the flap elements. The catch mechanisms have a disabled state and an activated state for holding and allowing release of the flap elements. Once the catch mechanism are disabled, the flap elements are free to move to another position, provided they can overcome the mechanical fluid flow forces that tend to hold it in position. To counter and utilize such forces for moving the flap elements, an impulse mechanism kicks the flap element into the valve chamber, away from the catch mechanisms. Since the position of the flap elements is unstable, oscillations of the flap elements in the fluid flow will eventually bring the flap element into catchment range of another catch mechanism in an activated state.
A system determines the position of an object located on a transport assembly. Sensor arrays are embedded in the transport assembly for identifying boundary locations of the object. The sensor arrays are spaced apart in an arrangement for detecting the locations at which the object crosses the sensor arrays. These locations provide a set of boundary points. The system computes the equation of a rectangle that identifies the location of the object on the transport assembly by minimizing the deviation of the set of boundary points from the boundary of the equation of the rectangle.
An air assisted sheet guide device in a printing machine which is operable during either positive pressure (blast) air operation as well as suction air operation to permit reliable and stable sheet guidance with reduced air flow turbulence. The sheet guide device includes at least one module that defines a guide surface having air flow openings therein and an air flow channel, and a pneumatic system for creating either a positive or suction pressure generated air flow in the flow channel. One or more plate-like air directional elements are mounted within the air flow channel which create a uniform pressure distribution on the guide surface during positive (blast) air operation and which more uniformly direct air to the pneumatic system during suction pressure operation.
A device for guiding a sheet as it is conveyed through a deliverer or between printing units of a sheet-fed printing machine is provided. The sheet guiding device includes a guide surface which has a plurality of openings therein and a housing which is arranged below the guide surface and which together with the guide surface defines a flow duct. The guiding device also includes a air system which is in fluid communication with the flow duct. At least one flexible hollow seal member is arranged in the flow duct and is adapted such that it can be selectively filled with a fluid medium which expands the seal member into a sealing position wherein it seals off a predetermined portion of the openings in the guide surface from the air system.
A method for forming packaged substrates, including flip-chip dice individually or in a multi-die wafer. The method includes using a stereolithographic process to form a protective dielectric polymeric sealing structure on at least the active surface of the substrate. In addition, the invention encompasses forming a similar layer on a second substrate to be joined to the first substrate. Contact pads of the second substrate are exposed through the layer thereon to facilitate joining of the two substrates. Semiconductor devices formed by the method are also disclosed.