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Supply tank for electrostatic spraying system
   
Document Number
US Patent 5861060
Issued Date
January 19, 1999
Link
Inventors
Maugans; James R. (Newport Beach, CA)
Knight; Kevin J. (Bolingbrook, IL)
Flint; Paul (Oak Park, IL)
Map
Abstract
A grounded insulated electrostatic supply tank comprised of a conductive tank that has several liners to fully insulate a waterborn fluid in the tank from ground. The interior of the tank and a sealed lid are coated with an insulating liner. An intermediate lining is placed in the tank and third interior insulating inner liner is inserted in the tank and has a lip that wraps around the upper rim of the tank and is sealed between the lid and the tank. Electrostatic spray equipment is connected to the tank by a coaxial hose having an inner non-conductive hose and preferably, an outer hose that is conductive. Inner non-conductive hose extends through the lid into an insulating teflon pick-up tube that extends to near the bottom of the tank. Depleted waterborn fluid in the tank is grounded after use by a manual probe or by a piston operated automatic grounding system.
Drawing
Supply tank for electrostatic spraying system - US Patent 5861060 Drawing
Drawing from US Patent 5861060
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Number of Claims:
20
Comments:
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Owner
Binks Sames Corporation (Franklin Park, IL)
Published
January 19, 1999
Application Number
08/583,653
Filed
January 11, 1996
US Classification
118/50.1   118/300 118/621 239/690 239/706 239/708
Int'l Classification
B05B   5/16   (20060101)   B05B   5/00   (20060101)   B05B   9/04   (20060101)  
Examiner
Assistant Examiner
Attorney/Law Firm
USPTO Field of Search
118/50.1   118/50   239/690   239/690.1   239/3   239/706   361/215   361/227  
Related Patents
6695318 - Electronic device processing equipment having contact gasket between chamber parts - Owned by Tokyo Electron Limited (Tokyo,JP)

An arrangement for improved thermal and/or electrical coupling between parts disposed in electronic device processing equipment is provided. In an illustrated embodiment, an improved coupling between a chamber liner and a chamber wall is provided which can be utilized in semiconductor processing equipment. The arrangement includes a compressible coupling or gasket which is compressed between a wedge ring and the chamber wall. The chamber liner is coupled to the wedge ring, so that the chamber liner is coupled to the chamber wall by way of the wedge ring and compressible coupling.

Claims
Description
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