A machine for terminating a computer chip with one or more stripes of a solderable paste, comprising a feed plate wheel defined by an outer marginal edge and having an upper exposed plate surface inclined to the horizontal against which an inventory of 3-dimensional chips is placed for loading, at least one narrow groove formed in the exposed plate surface directed outwardly toward the marginal edge wall and arranged to pass through the inventory and receive therein at least one of the chips in restricted orientation, a transfer cavity defined by enclosed side walls and a floor depending from the groove inboard the outer marginal edge for receipt therein of a chip from the groove in fixed orientation, the outer marginal edge wall having an aperture formed therethrough for transferring the chip from the cavity and, a transport device for urging the chip in a specific fixed orientation from the cavity outward through the aperture in a direction different than the direction from which the chip entered the cavity.
RELATION TO OTHER PATENT APPLICATIONS
This is a Continuation-In-Part of previously filed patent application, titled "IPC (CHIP) TERMINATION MACHINE", filed Jul. 11, 1996 and carrying Ser. No. 08/680,714 now abandoned.
An external electrode forming apparatus is used to form external electrodes on the component chips. The external electrode forming apparatus comprises a component conveyer belt, a belt feeding mechanism, a component-inserting machine, a component-reversing machine, a paste-coating machine, and a component-discharging machine. For the component-inserting machine, the component-reversing machine, and the component-discharging machine, pressure pins are used to insert or move the component chips. These pressure pins have at the tip part a taper portion with a tip shape smaller than that of the component holding hole. Since the pressure pins of this type are used, the tip portions of these pressure pins may be prevented from impinging upon the opening edges of the component holding holes, and the pressure pins after the impingement may be hindered from forcibly being inserted into the component holding holes, whereby damage to the interiors of the component holding holes can be extremely diminished.
An external electrode forming apparatus is used to form external electrodes on the component chips. The external electrode forming apparatus comprises a component conveyer belt, a belt feeding mechanism, a component-inserting machine, a component-reversing machine, a paste-coating machine, and a component-discharging machine. For the component-inserting machine, the component-reversing machine, and the component-discharging machine, pressure pins are used to insert or move the component chips. These pressure pins have at the tip part a taper portion with a tip shape smaller than that of the component holding hole. Since the pressure pins of this type are used, the tip portions of these pressure pins may be prevented from impinging upon the opening edges of the component holding holes, and the pressure pins after the impingement may be hindered from forcibly being inserted into the component holding holes, whereby damage to the interiors of the component holding holes can be extremely diminished.
Terminating the ends of passive electronic components entails applying a laser-ablative coating to each of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-ablative coating from multiple selected regions of the major surfaces is directed for incidence on the substrate. Relative motion between the UV laser beam and substrate effects removal of sufficient amounts of laser-ablative coating to expose the multiple selected regions of the opposed major surfaces. The substrate is then broken into multiple rowbars, each of which includes side margins along which are positioned different spatially aligned pairs of the selected regions of the opposed major surfaces. An electrically conductive material is applied to the side margins to form electrically conductive interconnects between each spatially aligned pair of the selected regions.
A component handler includes an improved test seat having a shape that ensures that an electronic component seated in the test seat is in an appropriate orientation for parametric testing. The test seat has a base surface and first and second opposed seat side surfaces separated by generally increasing distances from a narrower notch end to a wider notch end. There is an opening at the narrower notch end. An electronic component is seated within this test seat such that the first and second side surfaces of the electronic component rest against the first and second seat side surfaces. A side surface side margin on which is formed a wraparound electrode is exposed by an opening at the narrower notch end and a second side surface side margin on which is formed a second wraparound electrode is exposed by an opening at the wider notch end.
A laser beam (102) cuts through a component carrier mask (96) made of thin elastomeric material such as silicone rubber to form slots (98) having slot openings of a desired shape. In a preferred embodiment, a light absorptivity enhancement material such as iron oxide introduced into the silicone rubber causes formation of a flexible support blank that operationally adequately absorbs light within a light absorption wavelength range. A beam positioner (106) receiving commands from a programmed controller causes a UV laser beam of a wavelength that is within the light absorption wavelength range to cut into the mask multiple slots with repeatable, precise dimensions. Each of the slots cut has opposed side margins that define between them a slot opening of suitable shape to receive a miniature component (10) and to exert on it optimal holding and release forces.
