A foam producing apparatus has a first mixing chamber with an inner subchamber connected to a supply of gas at a first pressure and an outer subchamber connected to a supply of a foamable liquid at a second pressure higher than the first pressure. A plurality of orifices connect the outer subchamber to the inner subchamber. The foamable liquid is forced from the outer subchamber into the inner subchamber through the orifices and is atomized to form droplets carried by the gas to an outlet. A second mixing chamber is connected to the outlet of the first mixing chamber and is filled with an agitating medium so that droplets propelled through the second mixing chamber are violently agitated to produce the desired foam.
A precast concrete bridge system containing one or more sections wherein each section includes a horizontally disposed, load-bearing span that is integrally cast with a pair of vertical side walls. Each wall contains lightweight cores encapsulated in the concrete to create a series of longitudinally extended beams in each wall so that the beams in one wall are coaxially aligned with the beams in an adjacent wall. The cores constitute between 16-35 % of the total section volume.
A foam of very small, microscopic bubbles of surfactant, each bubble containing a small quantity of water, is mixed with a water/cement mixture having a water to cement ratio of less than 0.33. The small bubbles have a ball bearing effect on the smaller cement and sand particles, increasing plasticity or flowability and thus reducing the water requirements of the mixture. The foamed cement mixture is laid to form a desired concrete structure, and the bubbles disintegrate or transform to leave voids of similar size uniformly dispersed throughout the concrete structure.
An apparatus and method are disclosed in which a semiconductor substrate having a surface containing contaminants is cleaned or otherwise subjected to chemical treatment using a foam. The semiconductor wafer is supported either on a stiff support (or a layer of foam) and foam is provided on the opposite surface of the semiconductor wafer while the semiconductor wafer is supported. The foam contacting the semiconductor wafer is pressurized using a form to produce a jammed foam. Relative movement between the form and the semiconductor wafer, such as oscillation parallel and/or perpendicular to the top surface of the semiconductor wafer, is then induced while the jammed foam is in contact with the semiconductor wafer to remove the undesired contaminants and/or otherwise chemically treat the surface of the semiconductor wafer using the foam.
An apparatus for use in processing a substrate includes a brush enclosure extending over a length. The brush enclosure is configured to be disposed over a surface of the substrate and has an open region that is configured to be disposed in proximity to the substrate. The open region extends over the length of the brush enclosure and enables foam from within the brush enclosure to contact the surface of the substrate. A substrate cleaning system and method for cleaning a substrate are also described.
A method for transporting a substrate is provided. In this method, a non-Newtonian fluid is provided and the substrate is suspended in the non-Newtonian fluid. The non-Newtonian fluid is capable of supporting the substrate. Thereafter, a supply force is applied on the non-Newtonian fluid to cause the non-Newtonian fluid to flow, whereby the flow is capable of moving the substrate along a direction of the flow. Apparatuses and systems for transporting the substrate using the non-Newtonian fluid also are described.
