An abrasive molding predominantly comprised of manganese oxide is described, which has a bulk density of 0.4 to 4.0 g/cm.sup.3, a BET specific surface area of 0.2 to 250 m.sup.2 /g and an average particle diameter of 0.005 to 10 .mu.m. The abrasive molding has a multiplicity of minute pores, preferably with a pore diameter distribution such that the integrated pore volume of minute pores having a pore diameter of at least 1 .mu.m is at least 20%, the integrated pore volume of minute pores having a pore diameter of 10 to 100 .mu.m is at least 15%, and the integrated pore volume of minute pores having a pore diameter exceeding 100 .mu.m is not larger than 5%, based on the total integrated pore volume of the minute pores of the abrasive molding. The porosity is preferably in the range of 30 to 95% by volume based on the apparent volume of the abrasive molding. The minute pores are preferably interconnecting minute pores which are open to the exterior, wherein a solid is contained which is soluble in a polishing liquid. An abrasive disc having the abrasive molding fixed to a supporting auxiliary is used for polishing a material to be polished.

An abrasive molding comprising at least 90% by weight, based on the abrasive molding, of an inorganic material having a stock hardness of 50-400 kg/mm.sup.2, and said abrasive molding having a relative density of 20-70% and an average particle diameter of 0.001-50 .mu.m. The abrasive molding preferably has pores having a pore size distribution such that the integrated pore volume of pores having a diameter of 0.01-1 .mu.m is at least 20% of the integrated total pore volume of the entire pores, and the integrated pore volume of pores having a diameter of 1-360 .mu.m is in the range of 10% to 70% of the integrated total pore volume of the entire pores. The abrasive molding is suitable for polishing a material having a Vickers hardness not larger than 300 kg/mm.sup.2.

An aqueous dispersion containing abrasive particles comprises abrasive particles having superparamagnetic metal oxide domains in a non-magnetic metal oxide or non-metal oxide matrix. The abrasive particles of the aqueous dispersion can have an average particle size of below 400 nm and a BET surface area of 50 to 600 m.sup.2 /g. The dispersion can be produced by dispersing the abrasive particles with an energy of at least 200 kJ/m.sup.3 using a device in which the abrasive particles are first subjected to high pressure, then decompressed through a nozzle so that the abrasive particles collide with one another or against sections of wall in the device. The aqueous dispersion can be used for chemical mechanical polishing (CMP).

An abrasive film for polishing a workpiece, including: (a) a substrate; (b) a binder; (c) a multiplicity of abrasive grains which are fixed to a surface of the substrate by the binder; and (d) a water-soluble inorganic compound or a water-soluble organic acid alkali metal salt which is added to the binder. The water-soluble inorganic compound preferably consists of a weak-alkali metal salt or a weak-acid metal salt. The water-soluble organic acid alkali metal salt preferably consists of an anionic surface-active agent or a carboxylic acid alkali metal salt.

In a cemented carbide cutting tool made of a tungsten carbide-based alloy comprising 8 to 13 percent by weight of Co and 0.1 to 3 percent by weight of Cr as constituents for forming a binding phase, the balance being tungsten carbide as a constituent for forming a dispersing phase and incidental impurities, the rate of the dispersing phase to the total of the dispersing phase and the binding phase being in a range of 72 to 90 percent by area and the average particle diameter being 1 .mu.m or less according to measurement of an electron microscopic texture; the dispersing phase of the cemented carbide cutting tool made of a tungsten carbide-based alloy comprises a dispersing phase composed of ultra-fine particles dispersed in a matrix and having a particle diameter of 100 nm or less, and the ultra-fine particles comprise a Co based alloy.