Circuit assembly for effectuating communication between a first and a second locally-positioned communication device

Claims

What is claimed is:

1. A circuit assembly for effectuating a two-way communication link between a first locally-positioned wireless headset and a second locally-positioned wireless headset where the second locally-positioned wireless headset forms a portion of an external communication system, the first locally-positioned wireless headset and the second locally positioned wireless headset together positioned within a local area, the circuit assembly comprising:

a first local interface module operably coupled to the first locally-positioned wireless headset, the first local interface module for transmitting, within at least the local area, a local transport-send signal generated by the first locally-positioned wireless headset, the first local interface further for receiving, within at least the local area, a local transport-receive signal and for providing the local transport-receive signal to the second locally-positioned wireless headset; and

a second local interface module operably coupled to the second locally-positioned wireless headset, the second local interface module for receiving the local transport-send signal transmitted by the first local interface module and for providing the local transport-send signal to the second locally-positioned wireless headset, the second local interface module further for transmitting, within at least the local area, the local transport-receive signal generated by the first locally-positioned wireless headset.

2. The circuit assembly of claim 1, wherein the first wireless headset further comprises:

a housing for attachment to the user's head;

a transceiver disposed in the housing for receiving and transmitting local communication signals;

an antenna coupled to the transceiver;

a controller for controlling the transceiver, the controller operably connected to the transceiver;

at least one earphone having a speaker, the at least one earphone attached to the housing;

a microphone attached to the housing;

a power source contained within the housing; and

an amplifier contained within the housing, the amplifier operably connected to the transceiver for amplifying local communication signals received by the transceiver.

3. The circuit assembly of claim 2, wherein the first wireless headset further comprises:

measuring means for measuring strength of received local communication signals; and

controlling means responsive to the measuring means for controlling transceiver output power.

4. The circuit assembly of claim 2, wherein the first wireless headset further comprises:

a device for measuring strength of received local communication signals, the device responsive to strength of received local communication signals for controlling transceiver output power.

5. The circuit assembly of claim 2, wherein the first wireless headset further comprises:

a device for providing a measurement of signal strength of local communication signals received from the second wireless headset;

means for sending the measurement of signal strength of local communication signals received from the second wireless headset to the second wireless headset; and

means for receiving a measurement made by the second wireless headset of signal strength of local communication signals received by the second wireless headset from the first wireless headset, the measurement being transmitted to the first wireless headset and the controller responsive to the measurement for controlling output power of the first wireless headset transceiver.

6. The circuit assembly of claims 2, 3, 4, or 5 wherein the first wireless headset further comprises a keypad.

7. The circuit assembly of claims 2, 3, 4, or 5, wherein the first wireless headset further includes voice recognition for voice dialing.

8. The circuit assembly of claim 2, 3, 4, or 5 wherein the first wireless headset further comprises activation means for activating the wireless headset responsive to voice command of user.

9. The circuit assembly of claim 1, wherein the second wireless headset further comprises:

a housing for attachment to the user's head;

a transceiver disposed in the housing for receiving and transmitting local communication signals;

an antenna coupled to the transceiver;

a controller for controlling the transceiver, said controller operably connected to said transceiver;

at least one earphone having a speaker, said at least one earphone attached to said housing;

a microphone attached to said housing;

a power source contained within said housing; and

an amplifier contained within said housing, the amplifier operably connected to the transceiver for amplifying local communication signals received by the transceiver.

10. The circuit assembly of claim 9, wherein the second wireless headset further comprises:

measuring means for measuring strength of received local communication signals; and

controlling means responsive to the measuring means for controlling transceiver output power.

11. The circuit assembly of claim 9, wherein the second wireless headset further comprises:

a device for measuring strength of received local communication signals, the device responsive to strength of received local communication signals for controlling transceiver output power.

12. The circuit assembly of claim 9, wherein the second wireless headset further comprises:

a device for providing a measurement of signal strength of local communication signals received from the first wireless headset;

means for sending the measurement of signal strength of local communication signals received from the first wireless headset to the first wireless headset; and

means for receiving a measurement made by the first wireless headset of signal strength of local communication signals received by the first wireless headset from the second wireless headset, the measurement being transmitted to the second wireless headset and the controller responsive to the measurement for controlling output power of the second wireless headset transceiver.

13. The circuit assembly of claim 9, 10, 11, or 12, wherein the second wireless headset further comprises a keypad.

14. The circuit assembly of claims 9, 10, 11, or 12 wherein the second wireless headset further includes voice recognition for voice dialing.

15. The circuit assembly of claim 9, 10, 11, or 12, wherein the second wireless headset further comprises activation means for activating the wireless headset responsive to voice command of user.

16. A circuit assembly for effectuating a communication link between a first locally-positioned communication device and a second locally-positioned communication device where the first locally-positioned communication device forms a portion of an external communication system, the first locally-positioned communication device and the second locally-positioned communication device together positioned within a local area, the circuit assembly comprising:

a first local interface module operably coupled to the first locally-positioned communication device, the first local interface module for transmitting a local transport-send signal generated by the first locally-positioned communication device and for receiving a local transport-receive signal transmitted by a second interface module and for providing the local transport-receive signal to the first locally-positioned communication device;

a second local interface module operably coupled to the second locally-positioned communication device, the second local interface module for transmitting a local transport-receive signal generated by the second locally-positioned communication device and for receiving the local transport-send signal transmitted by the first local interface module and for providing the received local transport-send signal to the second locally-positioned communication device, thereby to effectuate the communication link between the first locally-positioned communication device and the second locally-positioned communication device;

a transceiver for receiving the local transport-receive signal and transmitting the local transport-send signal;

a baseband modulator and demodulator for modulating and demodulating the local transport-send signal and the local transport-receive signal, the baseband modulator and demodulator operably coupled to the transceiver;

a controller, the controller generating control information, the controller being operably coupled to the transceiver and the baseband modulator and demodulator;

a device for providing a measurement of signal strength of local communication signals received from the second locally positioned communication device by the first locally positioned communication device, wherein said first and second locally positioned communication devices are wireless headsets;

means for sending the measurement of signal strength of local communication signals received from the second wireless headset by the first wireless headset to the second wireless headset; and

means for receiving a measurement made by the second wireless headset of signal strength of local communication signals received by the second wireless headset from the first wireless headset, the measurement being transmitted to the first wireless headset and the controller responsive to the measurement for controlling output power of the first wireless headset transceiver.

17. A circuit assembly for effectuating a communication link between a first locally-positioned communication device and a second locally-positioned communication device where the first locally-positioned communication device forms a portion of an external communication system, the first locally-positioned communication device