A semiconductor microwave amplifier includes input- and output-side microstrip lines formed on a printed-circuit board to oppose each other, input and output electrodes formed on the microstrip lines to be parallel to the microstrip lines, a pair of ground electrodes formed in a direction perpendicular to the input and output electrodes to oppose each other, and a semiconductor amplification device connected to all of the electrodes. This amplifier further has a metal plate connected to the ground electrodes to ensure high-frequency isolation between the input electrode and the output electrode and shield electromagnetic connection, and a through hole for connecting a ground portion of the semiconductor device to a ground surface for the microstrip lines, the ground surface being formed on the printed-circuit board.
The present invention provides a method for manufacturing a highly reliable electronic component in which the shield case is securely fixed to a substrate without requiring a step for filling a solder paste in engaging holes, and a highly reliable electronic component with a shield case manufactured by the method, wherein engaging pins of the shield case are inserted into the engaging holes of the mother substrate, reflow soldering is applied when the solder paste is coated on the circumference of the engaging holes as well as on the area including the circumference of the engaging hole and at least a part of the engaging hole at the reversed face (back face) of the component mounting face covered with the shield case of the mother substrate, and mother substrate is divided into individual electronic component with the shield case after soldering the engaging pins of the shield case to the case fixing electrodes disposed on the circumference face of the engaging holes.
A device, comprising a first substrate having a transmission line formed on a surface thereof and a second substrate connected to the first substrate and the transmission line such that the transmission line is substantially between the first substrate and the second substrate. The device also includes a circuit chip connected to the transmission line.
