Apparatus and method of removing unnecessary matter and coating process using such method

Claims

What is claimed is:

1. A method of removing selected matter on an edge portion of a substrate, said substrate having a top face and a bottom face and a perimeter, said top face having said edge portion at the perimeter thereof, said top face having a middle area surrounded by said edge portion, said method comprising the steps of:

supporting said substrate by a support contacting only said bottom face of said substrate;

applying an AC voltage across a pair of plasma generating electrodes, to generate plasma at or about atmospheric pressure, said plasma generating electrodes being disposed within a gas supply path, said gas supply path having a gas outlet at one end thereof, said gas supply path having a gas capable of plasma discharge flowing therethrough;

activating said gas capable of plasma discharge in said gas supply path by said plasma to form activated gas species and excited molecules;

blowing said activated gas species and excited molecules against said edge portion of said substrate from said gas outlet, said gas outlet being disposed at a position opposed to said edge portion, said gas outlet including a ring-shaped gas passage formed therein at a position corresponding to and opposed to said edge portion;

removing said selected matter from said edge portion of said substrate by reaction of said selected matter with said activated gas species and excited molecules; and

exhausting said activated gas species and excited molecules and said removed selected matter away from said middle area of said substrate.

2. The method of removing selected matter of claim 1, wherein said substrate is a semiconductor wafer or liquid crystal substrate which has a flat portion of said edge portion, said flat portion being used to orient placement of said semiconductor wafer or liquid crystal substrate, and said pair of plasma generating electrodes includes a flat electrode part having a configuration corresponding to said flat portion, and further comprising the step of

conducting said substrate onto said support while said flat portion of said substrate is oriented in a given direction, thereby setting said flat portion of said substrate at a position directly opposed to said flat electrode part.

3. The method of removing selected matter of claim 1 wherein said substrate has said selected matter on said edge portion thereof, formed from a coating formed on said substrate by spin-coating.

4. The method of removing selected matter of claim 3 wherein said coating is at least one member of the group consisting of silicon oxide, organic resist and polyimide.

5. The method of removing selected matter of claim 1 wherein said gas capable of plasma discharge contains fluorine and said removing step includes etching said selected matter by the use of fluorine radicals formed from said plasma discharge.

6. The method of removing selected matter of claim 1 wherein said gas capable of plasma discharge contains oxygen and said removing step includes ashing said selected matter by the use of oxygen radicals formed from said plasma discharge.

7. The method of removing selected matter of claim 1 wherein said substrate supporting step includes contacting said bottom face of said substrate only at a position opposite said middle area on said bottom face of said substrate and not contacting said edge portion of said substrate, and said removing step includes conducting said activated gas and excited molecules onto said bottom face at said edge portion of said substrate, whereby said selected matter formed on said bottom face of said edge portion will be removed.

8. A method of removing selected matter on an edge portion of a substrate, said substrate having a top face and a bottom face and a perimeter, said top face having a middle portion surrounded by said edge portion at the perimeter, said method comprising the steps of:

supporting said substrate on a support, said support having a ring-shaped configuration defining a ring-shaped gas passageway and contacting only with said bottom face of said substrate;

applying an AC voltage across a pair of plasma generating electrodes, to generate plasma at or about atmospheric pressure said plasma generating electrodes being disposed within a gas supply path through which a gas capable of plasma discharge flows, said gas supply path having a gas outlet at one end thereof;

activating said gas capable of plasma discharge in said gas supply path by said plasma to form activated gas species and excited molecules;

blowing said activated gas species and excited molecules against said edge portion of said substrate from said gas outlet, said gas outlet is disposed at a position opposed to and proximate said edge portion;

removing said selected matter from said edge portion of said substrate by reaction with said activated gas species and excited molecules; and

blowing a carrier gas against and outwardly from said middle portion of said top face of said substrate and conducting said carrier gas from said middle portion to said edge portion of said substrate so that said carrier gas prevents said activated gas species and excited molecules and said removed selected matter from depositing on said middle portion of said substrate.

9. The method of removing selected matter of claim 8 wherein said carrier gas blowing step includes blowing a portion of said gas capable of plasma discharge in said gas supply path directly against said middle portion of said substrate without exposure of said gas capable of plasma discharge to said plasma.

10. The method of removing selected matter of claim 8, further comprising the step of exhausting said activated species and excited molecules, said carrier gas and said removed selected matter away from said middle portion for preventing contamination of said middle portion with dust of said selected matter.

11. A method of removing selected matter on an edge portion of a substrate, said substrate having a top face and a bottom face and a perimeter, said top face containing a middle portion surrounded by said edge portion at the perimeter thereof, said method comprising the steps of:

supporting said substrate by a support contacting only with said bottom face of said substrate;

applying an AC voltage across a pair of plasma generating electrodes, said plasma generating electrodes being placed on opposite sides of said edge portion of said substrate only; supplying a gas capable of discharge between said pair of plasma generating electrodes to generate plasma at or about atmospheric pressure proximate said edge portion of said substrate;

activating said gas capable of discharge by said plasma to form activated species and excited molecules; removing said selected matter from said edge portion of said substrate by reaction with said activated species and excited molecules; and

exhausting said activated species and excited molecules and said removed selected matter away from said middle portion;

wherein said edge portion includes a first half-circumferential edge portion and a second half-circumferential edge portion; said pair of plasma generating electrodes comprises a first half-circumferential electrode including a pair of electrode portions which correspond to said first half-circumferential edge portion, and a second half-circumferential electrode including a pair of electrode portions which are matched to said second half-circumferential edge portion; and wherein

said removing step includes moving at least two of: (a) said substrate, (b) said first half-circumferential electrode and (c) said second half-circumferential electrode relative to each other whereby the respective half-circumferential edge portions of said substrate are positioned opposed to said first half-circumferential electrode and second half-circumferential electrode, respectively.

12. The method of removing selected matter of claim 11 wherein said edge portion includes both a half-circular edge portion and a straight edge portion; and

wherein said removing step further includes rotatably changing the position of said half-circular edge portion relative to said straight edge portion relative to said plasma generating electrodes; and linearly changing the position of said flat edge portion relative to said plasma generating electrodes to remove said selected matter from said half-circular edge portion and said straight edge portion of said substrate, respectively.

13. A coating method for coating a substrate, said substrate having a top face and a bottom face, said top face having an edge portion and a perimeter, said top face having a middle area surrounded by said edge portion, said method comprising the steps of:

rotating said substrate about an axis orthogonal to said top surface;

applying a coating material to said top face at a point near said rotation axis to spin-coat a coating on said substrate by centrifugal force;

supporting said substrate by a support contacting only said bottom face of said substrate;

applying an AC voltage across a pair of plasma generating electrodes, to generate plasma at or about atmospheric pressure, said plasma generating electrodes being disposed within a gas supply path, said gas supply path having a gas outlet at one end thereof said gas outlet including a ring-shaped gas passage formed therein at a position corresponding to and opposed to said edge portion, said gas supply path having a gas capable of plasma discharge flowing therethrough;

activating said gas capable of plasma discharge in said gas supply path by said plasma to form activated gas species and excited molecules;

blowing said activated gas species and excited molecules against said edge portion of said substrate from said gas outlet, said gas outlet disposed at a position opposed to and proximate said edge portion;

removing any selected matter from said edge portion of said substrate by reaction with said activated gas species and excited molecules; and

exhausting said activated gas species and excited molecules and removed selected matter away from said middle area of said substrate such that said gas is conducted radially.

14. The coating method of claim 13 wherein a plurality of said substrates are sequentially moved to a stage for said removing step after completion of said applying step, whereby said rotating step, said applying and said removing second step can be carried out sequentially in line.

15. A coating method for coating a substrate, said substrate having a top face and a bottom face and a perimeter, said top face having a middle portion surrounded by an edge portion at the perimeter, said method comprising the steps of:

rotating a substrate about an axis orthogonal to said top face;

applying coating material to said top face at a point near said rotation axis to spin-coat a coating on said substrate by centrifugal force;

supporting said substrate on a support, said support having a ring-shaped configuration defining a ring-shaped gas passageway and contacting only with said bottom face of said substrate;

applying an AC voltage across a pair of plasma generating electrodes, to generate plasma at or about atmospheric pressure said plasma generating electrodes disposed within a gas supply path through which a gas capable of plasma discharge flows, said gas supply path having a gas outlet at one end thereof;

activating said gas capable of plasma discharge in said gas supply path by said plasma to form activated gas species and excited molecules;

blowing said activated gas species and excited molecules against said edge portion of said substrate from said gas outlet, said gas outlet is disposed at a position opposed to and proximate said edge portion;

removing selected matter from said edge portion of said substrate by reaction with said activated gas species and excited molecules; and

blowing a carrier gas against said middle portion of said top face of said substrate and conducting said carrier gas from said middle portion to said edge portion of said substrate such that said gas is conducted radially so that said carrier gas prevents said activated gas species and excited molecules and said removed selected matter from depositing on said middle portion of said substrate.